JP2001319919A - 半導体装置の製造方法及び処理装置 - Google Patents

半導体装置の製造方法及び処理装置

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Publication number
JP2001319919A
JP2001319919A JP2000174437A JP2000174437A JP2001319919A JP 2001319919 A JP2001319919 A JP 2001319919A JP 2000174437 A JP2000174437 A JP 2000174437A JP 2000174437 A JP2000174437 A JP 2000174437A JP 2001319919 A JP2001319919 A JP 2001319919A
Authority
JP
Japan
Prior art keywords
wafer
plating
processing
substrate
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000174437A
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English (en)
Japanese (ja)
Other versions
JP2001319919A5 (enExample
Inventor
Hiroshi Sato
浩 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000174437A priority Critical patent/JP2001319919A/ja
Publication of JP2001319919A publication Critical patent/JP2001319919A/ja
Publication of JP2001319919A5 publication Critical patent/JP2001319919A5/ja
Pending legal-status Critical Current

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP2000174437A 2000-05-08 2000-05-08 半導体装置の製造方法及び処理装置 Pending JP2001319919A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000174437A JP2001319919A (ja) 2000-05-08 2000-05-08 半導体装置の製造方法及び処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000174437A JP2001319919A (ja) 2000-05-08 2000-05-08 半導体装置の製造方法及び処理装置

Publications (2)

Publication Number Publication Date
JP2001319919A true JP2001319919A (ja) 2001-11-16
JP2001319919A5 JP2001319919A5 (enExample) 2007-06-14

Family

ID=18676474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000174437A Pending JP2001319919A (ja) 2000-05-08 2000-05-08 半導体装置の製造方法及び処理装置

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JP (1) JP2001319919A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266302A (ja) * 2006-03-28 2007-10-11 Tokyo Electron Ltd 液処理装置および液処理方法ならびにコンピュータ読取可能な記憶媒体
JP2008218545A (ja) * 2007-03-01 2008-09-18 Sumco Corp ウェーハの枚葉式エッチング装置
CN103545247A (zh) * 2012-07-13 2014-01-29 中芯国际集成电路制造(上海)有限公司 金属塞制备方法及其在相变随机存储器中的应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227370A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Pressure reduction etching system
JPH0251229A (ja) * 1988-08-12 1990-02-21 Dainippon Screen Mfg Co Ltd 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
JPH0835078A (ja) * 1994-07-22 1996-02-06 Fuji Xerox Co Ltd ウエットエッチング装置
JPH09232276A (ja) * 1996-02-27 1997-09-05 Dainippon Screen Mfg Co Ltd 基板処理装置および方法
JPH09289186A (ja) * 1996-02-20 1997-11-04 Puretetsuku:Kk 洗浄装置
JPH10270415A (ja) * 1997-03-25 1998-10-09 Tera Tec:Kk エッチング方法および装置
JPH11162930A (ja) * 1997-09-30 1999-06-18 Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Gmbh 半導体基板の平坦化方法並びにこの方法に使用されるエッチヤント
JP2000269178A (ja) * 1999-03-15 2000-09-29 Nec Corp エッチング除去方法および装置と洗浄方法および装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227370A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Pressure reduction etching system
JPH0251229A (ja) * 1988-08-12 1990-02-21 Dainippon Screen Mfg Co Ltd 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
JPH0835078A (ja) * 1994-07-22 1996-02-06 Fuji Xerox Co Ltd ウエットエッチング装置
JPH09289186A (ja) * 1996-02-20 1997-11-04 Puretetsuku:Kk 洗浄装置
JPH09232276A (ja) * 1996-02-27 1997-09-05 Dainippon Screen Mfg Co Ltd 基板処理装置および方法
JPH10270415A (ja) * 1997-03-25 1998-10-09 Tera Tec:Kk エッチング方法および装置
JPH11162930A (ja) * 1997-09-30 1999-06-18 Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Gmbh 半導体基板の平坦化方法並びにこの方法に使用されるエッチヤント
JP2000269178A (ja) * 1999-03-15 2000-09-29 Nec Corp エッチング除去方法および装置と洗浄方法および装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266302A (ja) * 2006-03-28 2007-10-11 Tokyo Electron Ltd 液処理装置および液処理方法ならびにコンピュータ読取可能な記憶媒体
JP2008218545A (ja) * 2007-03-01 2008-09-18 Sumco Corp ウェーハの枚葉式エッチング装置
CN103545247A (zh) * 2012-07-13 2014-01-29 中芯国际集成电路制造(上海)有限公司 金属塞制备方法及其在相变随机存储器中的应用

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