JP2001316888A - 半導体基板のメッキ処理システム - Google Patents
半導体基板のメッキ処理システムInfo
- Publication number
- JP2001316888A JP2001316888A JP2000133454A JP2000133454A JP2001316888A JP 2001316888 A JP2001316888 A JP 2001316888A JP 2000133454 A JP2000133454 A JP 2000133454A JP 2000133454 A JP2000133454 A JP 2000133454A JP 2001316888 A JP2001316888 A JP 2001316888A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor substrate
- unit
- section
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 205
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000004140 cleaning Methods 0.000 claims abstract description 36
- 238000001035 drying Methods 0.000 claims abstract description 30
- 239000003595 mist Substances 0.000 claims abstract description 27
- 238000012546 transfer Methods 0.000 claims description 73
- 238000000034 method Methods 0.000 claims description 37
- 238000012545 processing Methods 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000005192 partition Methods 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 8
- 238000005406 washing Methods 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000133454A JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
| US09/846,660 US6716329B2 (en) | 2000-05-02 | 2001-05-01 | Processing apparatus and processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000133454A JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001316888A true JP2001316888A (ja) | 2001-11-16 |
| JP2001316888A5 JP2001316888A5 (enExample) | 2007-04-05 |
Family
ID=18641949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000133454A Pending JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001316888A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118843721A (zh) * | 2023-08-23 | 2024-10-25 | 株式会社荏原制作所 | 基板处理装置 |
-
2000
- 2000-05-02 JP JP2000133454A patent/JP2001316888A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118843721A (zh) * | 2023-08-23 | 2024-10-25 | 株式会社荏原制作所 | 基板处理装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070216 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070216 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090702 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090728 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091215 |