JP2001316888A5 - - Google Patents
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- Publication number
- JP2001316888A5 JP2001316888A5 JP2000133454A JP2000133454A JP2001316888A5 JP 2001316888 A5 JP2001316888 A5 JP 2001316888A5 JP 2000133454 A JP2000133454 A JP 2000133454A JP 2000133454 A JP2000133454 A JP 2000133454A JP 2001316888 A5 JP2001316888 A5 JP 2001316888A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor substrate
- cassette
- transport section
- tank section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 description 37
- 239000000758 substrate Substances 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 5
- 239000003595 mist Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000133454A JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
| US09/846,660 US6716329B2 (en) | 2000-05-02 | 2001-05-01 | Processing apparatus and processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000133454A JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001316888A JP2001316888A (ja) | 2001-11-16 |
| JP2001316888A5 true JP2001316888A5 (enExample) | 2007-04-05 |
Family
ID=18641949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000133454A Pending JP2001316888A (ja) | 2000-05-02 | 2000-05-02 | 半導体基板のメッキ処理システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001316888A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025041283A1 (ja) * | 2023-08-23 | 2025-02-27 | 株式会社荏原製作所 | 基板処理装置 |
-
2000
- 2000-05-02 JP JP2000133454A patent/JP2001316888A/ja active Pending
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