JP2001267371A - 液晶表示装置 - Google Patents

液晶表示装置

Info

Publication number
JP2001267371A
JP2001267371A JP2000077402A JP2000077402A JP2001267371A JP 2001267371 A JP2001267371 A JP 2001267371A JP 2000077402 A JP2000077402 A JP 2000077402A JP 2000077402 A JP2000077402 A JP 2000077402A JP 2001267371 A JP2001267371 A JP 2001267371A
Authority
JP
Japan
Prior art keywords
liquid crystal
semiconductor chip
crystal display
transparent substrate
bump electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000077402A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267371A5 (https=
Inventor
Nobuyuki Nakamura
信幸 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000077402A priority Critical patent/JP2001267371A/ja
Publication of JP2001267371A publication Critical patent/JP2001267371A/ja
Publication of JP2001267371A5 publication Critical patent/JP2001267371A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2000077402A 2000-03-21 2000-03-21 液晶表示装置 Pending JP2001267371A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000077402A JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000077402A JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Publications (2)

Publication Number Publication Date
JP2001267371A true JP2001267371A (ja) 2001-09-28
JP2001267371A5 JP2001267371A5 (https=) 2005-01-06

Family

ID=18594978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000077402A Pending JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Country Status (1)

Country Link
JP (1) JP2001267371A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053585A1 (en) * 2002-12-09 2004-06-24 Samsung Electronics Co., Ltd. Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
JP2011114170A (ja) * 2009-11-27 2011-06-09 Kyocera Corp 配線基板および電子部品実装基板
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053585A1 (en) * 2002-12-09 2004-06-24 Samsung Electronics Co., Ltd. Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
JP2011114170A (ja) * 2009-11-27 2011-06-09 Kyocera Corp 配線基板および電子部品実装基板
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置
US9425135B2 (en) 2012-03-30 2016-08-23 Olympus Corporation Electrode body, wiring substrate, and semiconductor device

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