JP2001267352A - ワイヤボンディング装置およびその制御方法 - Google Patents

ワイヤボンディング装置およびその制御方法

Info

Publication number
JP2001267352A
JP2001267352A JP2000073363A JP2000073363A JP2001267352A JP 2001267352 A JP2001267352 A JP 2001267352A JP 2000073363 A JP2000073363 A JP 2000073363A JP 2000073363 A JP2000073363 A JP 2000073363A JP 2001267352 A JP2001267352 A JP 2001267352A
Authority
JP
Japan
Prior art keywords
capillary
wire
horn
wire bonding
bonding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000073363A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267352A5 (enExample
Inventor
Takanori Okita
孝典 沖田
Masayuki Hiroki
正幸 広木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Engineering Co Ltd
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Engineering Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Engineering Co Ltd, Mitsubishi Electric Corp filed Critical Mitsubishi Electric Engineering Co Ltd
Priority to JP2000073363A priority Critical patent/JP2001267352A/ja
Publication of JP2001267352A publication Critical patent/JP2001267352A/ja
Publication of JP2001267352A5 publication Critical patent/JP2001267352A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2000073363A 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法 Pending JP2001267352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Publications (2)

Publication Number Publication Date
JP2001267352A true JP2001267352A (ja) 2001-09-28
JP2001267352A5 JP2001267352A5 (enExample) 2007-04-26

Family

ID=18591618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000073363A Pending JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Country Status (1)

Country Link
JP (1) JP2001267352A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170052484A (ko) * 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170052484A (ko) * 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법
JP2017092464A (ja) * 2015-11-04 2017-05-25 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法
CN110695575A (zh) * 2015-11-04 2020-01-17 库利克和索夫工业公司 用于引线焊接的焊接机上的自动悬置芯片优化工具及相关方法
KR102593242B1 (ko) * 2015-11-04 2023-10-25 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법

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