JP2001267352A - ワイヤボンディング装置およびその制御方法 - Google Patents

ワイヤボンディング装置およびその制御方法

Info

Publication number
JP2001267352A
JP2001267352A JP2000073363A JP2000073363A JP2001267352A JP 2001267352 A JP2001267352 A JP 2001267352A JP 2000073363 A JP2000073363 A JP 2000073363A JP 2000073363 A JP2000073363 A JP 2000073363A JP 2001267352 A JP2001267352 A JP 2001267352A
Authority
JP
Japan
Prior art keywords
capillary
wire
horn
wire bonding
bonding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000073363A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267352A5 (enExample
Inventor
Takanori Okita
孝典 沖田
Masayuki Hiroki
正幸 広木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Engineering Co Ltd
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Engineering Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Engineering Co Ltd, Mitsubishi Electric Corp filed Critical Mitsubishi Electric Engineering Co Ltd
Priority to JP2000073363A priority Critical patent/JP2001267352A/ja
Publication of JP2001267352A publication Critical patent/JP2001267352A/ja
Publication of JP2001267352A5 publication Critical patent/JP2001267352A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP2000073363A 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法 Pending JP2001267352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000073363A JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Publications (2)

Publication Number Publication Date
JP2001267352A true JP2001267352A (ja) 2001-09-28
JP2001267352A5 JP2001267352A5 (enExample) 2007-04-26

Family

ID=18591618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000073363A Pending JP2001267352A (ja) 2000-03-16 2000-03-16 ワイヤボンディング装置およびその制御方法

Country Status (1)

Country Link
JP (1) JP2001267352A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170052484A (ko) * 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170052484A (ko) * 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법
JP2017092464A (ja) * 2015-11-04 2017-05-25 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法
CN110695575A (zh) * 2015-11-04 2020-01-17 库利克和索夫工业公司 用于引线焊接的焊接机上的自动悬置芯片优化工具及相关方法
KR102593242B1 (ko) * 2015-11-04 2023-10-25 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법

Similar Documents

Publication Publication Date Title
JP4314313B1 (ja) ボンディング装置
JP4595020B2 (ja) ボンディング装置及びボンディングツール振巾測定方法ならびにボンディングツール振巾較正方法
JP2001267352A (ja) ワイヤボンディング装置およびその制御方法
JP6637623B2 (ja) ワイヤボンディング装置
JP3818932B2 (ja) ワイヤボンディング装置
JP2006216852A (ja) 位置決め装置および位置決め装置の制御方法
JP3528643B2 (ja) ワイヤボンディング装置
JP3313568B2 (ja) ワイヤボンディング装置およびその制御方法
JP2017216314A (ja) ボンディング装置、ボンディング方法及びプログラム
JPH10256320A (ja) 半導体製造装置
JPH1140612A (ja) バンプ付電子部品のボンディング方法
JP3452046B2 (ja) ワイヤボンディング方法
JP3633502B2 (ja) ワイヤボンディング方法
JP3171012B2 (ja) ワイヤボンディング方法及びワイヤボンディング装置
JP4234688B2 (ja) ボンディング方法およびボンディング装置
JP3013630B2 (ja) ワイヤボンダ用接地検出装置
JP2877771B2 (ja) ワイヤボンディング装置
JP3178330B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JP3399679B2 (ja) ワイヤボンディング装置およびワイヤボンディング方法
JP3424671B2 (ja) ワイヤボンディング方法
JP2977028B2 (ja) 超音波ワイヤボンディング装置の振動状態監視方法及び装置
JP2799938B2 (ja) ワイヤボンディング装置及びその方法
JP2001308136A (ja) ワイヤボンディング装置及びそれに用いるサーボ調整方法
JPH03152947A (ja) ワイヤボンディング方法
JPH0131297B2 (enExample)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070309

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070309

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090414

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090611

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090707

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091203

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091208