JP2001222751A - 自動販売機温度制御装置 - Google Patents

自動販売機温度制御装置

Info

Publication number
JP2001222751A
JP2001222751A JP2000034850A JP2000034850A JP2001222751A JP 2001222751 A JP2001222751 A JP 2001222751A JP 2000034850 A JP2000034850 A JP 2000034850A JP 2000034850 A JP2000034850 A JP 2000034850A JP 2001222751 A JP2001222751 A JP 2001222751A
Authority
JP
Japan
Prior art keywords
temperature
operation mode
sales
cooling
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000034850A
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuyoshi Kishimura
村 光 祥 岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Electric Appliances Co Ltd
Original Assignee
Toshiba Electric Appliances Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Electric Appliances Co Ltd filed Critical Toshiba Electric Appliances Co Ltd
Priority to JP2000034850A priority Critical patent/JP2001222751A/ja
Priority to DE10106492A priority patent/DE10106492B4/de
Publication of JP2001222751A publication Critical patent/JP2001222751A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
JP2000034850A 2000-02-14 2000-02-14 自動販売機温度制御装置 Pending JP2001222751A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000034850A JP2001222751A (ja) 2000-02-14 2000-02-14 自動販売機温度制御装置
DE10106492A DE10106492B4 (de) 2000-02-14 2001-02-13 Verbiegefähige Halbleitervorrichtung und Verfahren zu deren Herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000034850A JP2001222751A (ja) 2000-02-14 2000-02-14 自動販売機温度制御装置

Publications (1)

Publication Number Publication Date
JP2001222751A true JP2001222751A (ja) 2001-08-17

Family

ID=18559123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000034850A Pending JP2001222751A (ja) 2000-02-14 2000-02-14 自動販売機温度制御装置

Country Status (2)

Country Link
JP (1) JP2001222751A (de)
DE (1) DE10106492B4 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005539313A (ja) * 2002-09-16 2005-12-22 ザ・コカ−コーラ・カンパニー 冷却システム及び加熱システムの温度制御のためのシステムと方法
JP2009067448A (ja) * 2007-09-14 2009-04-02 Hoshizaki Electric Co Ltd 飲料注出装置
CN109075159A (zh) * 2016-04-21 2018-12-21 三菱电机株式会社 半导体装置及其制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10156386B4 (de) 2001-11-16 2007-08-09 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterchips

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
DE4435120C2 (de) * 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung
US5733814A (en) * 1995-04-03 1998-03-31 Aptek Industries, Inc. Flexible electronic card and method
DE19740055A1 (de) * 1997-09-12 1999-03-18 Daimler Benz Ag Anordnung und Verfahren zur Herstellung von CSP-Gehäusen für elektrische Bauteile
JPH11102985A (ja) * 1997-09-26 1999-04-13 Mitsubishi Electric Corp 半導体集積回路装置
DE19750316A1 (de) * 1997-11-13 1999-05-27 Siemens Ag Siliziumfolie als Träger von Halbleiterschaltungen als Teil von Karten
DE19931240C2 (de) * 1999-07-07 2001-08-02 Infineon Technologies Ag Chipkarte

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005539313A (ja) * 2002-09-16 2005-12-22 ザ・コカ−コーラ・カンパニー 冷却システム及び加熱システムの温度制御のためのシステムと方法
JP2009067448A (ja) * 2007-09-14 2009-04-02 Hoshizaki Electric Co Ltd 飲料注出装置
CN109075159A (zh) * 2016-04-21 2018-12-21 三菱电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
DE10106492B4 (de) 2007-06-14
DE10106492A1 (de) 2001-08-23

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