JP2001207161A5 - - Google Patents
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- Publication number
- JP2001207161A5 JP2001207161A5 JP2000013858A JP2000013858A JP2001207161A5 JP 2001207161 A5 JP2001207161 A5 JP 2001207161A5 JP 2000013858 A JP2000013858 A JP 2000013858A JP 2000013858 A JP2000013858 A JP 2000013858A JP 2001207161 A5 JP2001207161 A5 JP 2001207161A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- composition
- magnetic disk
- disk substrate
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 21
- 239000000758 substrate Substances 0.000 claims 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 7
- 238000000034 method Methods 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims 4
- -1 acetylacetone aluminum salt Chemical compound 0.000 claims 3
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims 2
- 239000003349 gelling agent Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000008119 colloidal silica Substances 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 229910021485 fumed silica Inorganic materials 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 150000003009 phosphonic acids Chemical class 0.000 claims 1
- 239000003755 preservative agent Substances 0.000 claims 1
- 230000002335 preservative effect Effects 0.000 claims 1
- 239000011163 secondary particle Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013858A JP3877924B2 (ja) | 2000-01-24 | 2000-01-24 | 磁気ディスク基板研磨用組成物 |
| MYPI20010276 MY118633A (en) | 2000-01-24 | 2001-01-22 | Abrasive composition for polishing magnetic recording disk substrates |
| US09/767,024 US6478835B2 (en) | 2000-01-24 | 2001-01-23 | Abrasive composition for polishing magnetic recording disk substrates |
| CN 01104631 CN1243070C (zh) | 2000-01-24 | 2001-01-23 | 用于抛光磁记录盘基体的磨料组合物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013858A JP3877924B2 (ja) | 2000-01-24 | 2000-01-24 | 磁気ディスク基板研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001207161A JP2001207161A (ja) | 2001-07-31 |
| JP2001207161A5 true JP2001207161A5 (enExample) | 2005-08-04 |
| JP3877924B2 JP3877924B2 (ja) | 2007-02-07 |
Family
ID=18541393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000013858A Expired - Lifetime JP3877924B2 (ja) | 2000-01-24 | 2000-01-24 | 磁気ディスク基板研磨用組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3877924B2 (enExample) |
| CN (1) | CN1243070C (enExample) |
| MY (1) | MY118633A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| MY133305A (en) * | 2001-08-21 | 2007-11-30 | Kao Corp | Polishing composition |
| JP4462599B2 (ja) * | 2001-08-21 | 2010-05-12 | 花王株式会社 | 研磨液組成物 |
| JP3875156B2 (ja) * | 2002-08-07 | 2007-01-31 | 花王株式会社 | ロールオフ低減剤 |
| JP4202172B2 (ja) * | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP4891304B2 (ja) * | 2008-10-23 | 2012-03-07 | 花王株式会社 | メモリーハードディスク基板の製造方法 |
| JP6484894B2 (ja) * | 2014-03-28 | 2019-03-20 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| JP6511039B2 (ja) | 2014-03-28 | 2019-05-08 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| JP6480139B2 (ja) * | 2014-09-30 | 2019-03-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| MY184933A (en) | 2015-09-25 | 2021-04-30 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3825827B2 (ja) * | 1996-01-30 | 2006-09-27 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JP3653133B2 (ja) * | 1996-01-30 | 2005-05-25 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JPH10121034A (ja) * | 1996-03-18 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板の研磨用組成物 |
| JPH10121035A (ja) * | 1996-08-30 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| JP3457144B2 (ja) * | 1997-05-21 | 2003-10-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
-
2000
- 2000-01-24 JP JP2000013858A patent/JP3877924B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-22 MY MYPI20010276 patent/MY118633A/en unknown
- 2001-01-23 CN CN 01104631 patent/CN1243070C/zh not_active Expired - Fee Related
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