JP2001207161A5 - - Google Patents

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Publication number
JP2001207161A5
JP2001207161A5 JP2000013858A JP2000013858A JP2001207161A5 JP 2001207161 A5 JP2001207161 A5 JP 2001207161A5 JP 2000013858 A JP2000013858 A JP 2000013858A JP 2000013858 A JP2000013858 A JP 2000013858A JP 2001207161 A5 JP2001207161 A5 JP 2001207161A5
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JP
Japan
Prior art keywords
polishing
composition
magnetic disk
disk substrate
substrate according
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JP2000013858A
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Japanese (ja)
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JP2001207161A (en
JP3877924B2 (en
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Priority to JP2000013858A priority Critical patent/JP3877924B2/en
Priority claimed from JP2000013858A external-priority patent/JP3877924B2/en
Priority to MYPI20010276 priority patent/MY118633A/en
Priority to CN 01104631 priority patent/CN1243070C/en
Priority to US09/767,024 priority patent/US6478835B2/en
Publication of JP2001207161A publication Critical patent/JP2001207161A/en
Publication of JP2001207161A5 publication Critical patent/JP2001207161A5/ja
Application granted granted Critical
Publication of JP3877924B2 publication Critical patent/JP3877924B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Claims (17)

水、酸化ケイ素、ゲル化防止剤、硝酸アルミニウム及び過酸化水素を含む磁気ディスク基板研磨用組成物。 A magnetic disk substrate polishing composition comprising water, silicon oxide, an antigelling agent, aluminum nitrate and hydrogen peroxide. 酸化ケイ素がコロイダルシリカ、ヒュームドシリカ及びホワイトカーボンから選ばれる１種又は２種以上である請求項１に記載の磁気ディスク基板研磨用組成物。  2. The magnetic disk substrate polishing composition according to claim 1, wherein the silicon oxide is one or more selected from colloidal silica, fumed silica and white carbon. 酸化ケイ素の二次粒子の平均粒子径が０．０３〜０．５μｍである請求項１または２に記載の磁気ディスク基板研磨用組成物。  3. The magnetic disk substrate polishing composition according to claim 1, wherein the secondary particles of silicon oxide have an average particle size of 0.03 to 0.5 μm. 酸化ケイ素の組成物中濃度が３〜３０質量％である請求項１〜３のいずれか１項に記載の磁気ディスク基板研磨用組成物。  The composition for polishing a magnetic disk substrate according to any one of claims 1 to 3, wherein the concentration of silicon oxide in the composition is 3 to 30% by mass. ゲル化防止剤がホスホン酸系化合物、フェナントロリン及びアセチルアセトンアルミニウム塩から選ばれる１種又は２種以上である請求項１〜４のいずれか１項に記載の磁気ディスク基板研磨用組成物。  The composition for polishing a magnetic disk substrate according to any one of claims 1 to 4, wherein the anti-gelling agent is one or more selected from phosphonic acid compounds, phenanthroline and acetylacetone aluminum salt. ゲル化防止剤がホスホン酸系化合物である請求項５に記載の磁気ディスク基板研磨用組成物。The composition for polishing a magnetic disk substrate according to claim 5, wherein the gelling inhibitor is a phosphonic acid compound. ホスホン酸系化合物が１−ヒドロキシエタン−１，１−ジホスホン酸である請求項６に記載の磁気ディスク基板研磨用組成物。The composition for polishing a magnetic disk substrate according to claim 6 , wherein the phosphonic acid compound is 1-hydroxyethane-1,1-diphosphonic acid. ゲル化防止剤の組成物中濃度が０．１〜２質量％である請求項１〜７のいずれか１項に記載の磁気ディスク基板研磨用組成物。The composition for polishing a magnetic disk substrate according to any one of claims 1 to 7, wherein the concentration of the anti-gelling agent in the composition is 0.1 to 2% by mass. 硝酸アルミニウムの組成物中濃度が１〜２０質量％である請求項１〜８のいずれか１項に記載の磁気ディスク基板研磨用組成物。The composition for polishing a magnetic disk substrate according to any one of claims 1 to 8, wherein the concentration of aluminum nitrate in the composition is 1 to 20% by mass. 過酸化水素の組成物中濃度が０．２〜５質量％である請求項１〜９のいずれか１項に記載の磁気ディスク基板研磨用組成物。10. The composition for polishing a magnetic disk substrate according to claim 1, wherein the concentration of hydrogen peroxide in the composition is 0.2 to 5 mass%. さらに界面活性剤を含む請求項１〜１０のいずれか１項に記載の磁気ディスク基板研磨用組成物。The composition for polishing a magnetic disk substrate according to claim 1, further comprising a surfactant. さらに防腐剤を含む請求項１〜１１のいずれか１項に記載の磁気ディスク基板研磨用組成物。The magnetic disk substrate polishing composition according to any one of claims 1 to 11, further comprising a preservative. 水で希釈して請求項４及び８〜１０のいずれか１項に記載の磁気ディスク基板研磨用組成物となる濃厚な組成物。A concentrated composition which is diluted with water to become the magnetic disk substrate polishing composition according to any one of claims 4 and 8 to 10. 請求項１３に記載の濃厚な組成物として運搬する磁気ディスク基板研磨用組成物の運搬方法。A method for transporting a magnetic disk substrate polishing composition that is transported as a concentrated composition according to claim 13. 請求項１〜１２のいずれか１項に記載の磁気ディスク基板研磨用組成物を用いて研磨する磁気ディスク基板の研磨方法。A method for polishing a magnetic disk substrate, comprising polishing using the magnetic disk substrate polishing composition according to claim 1. 請求項１３に記載の濃厚な組成物を希釈して研磨に用いる磁気ディスク基板の研磨方法。A method for polishing a magnetic disk substrate used for polishing by diluting the thick composition according to claim 13. 請求項１５または１６に記載の磁気ディスク基板の研磨方法で研磨する工程を含む磁気ディスク基板の製造方法。A method for manufacturing a magnetic disk substrate, comprising a step of polishing with the method for polishing a magnetic disk substrate according to claim 15.
JP2000013858A 2000-01-24 2000-01-24 Magnetic disk substrate polishing composition Expired - Lifetime JP3877924B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000013858A JP3877924B2 (en) 2000-01-24 2000-01-24 Magnetic disk substrate polishing composition
MYPI20010276 MY118633A (en) 2000-01-24 2001-01-22 Abrasive composition for polishing magnetic recording disk substrates
CN 01104631 CN1243070C (en) 2000-01-24 2001-01-23 Abrasive composition for polishing magnetic recording disk matrix
US09/767,024 US6478835B2 (en) 2000-01-24 2001-01-23 Abrasive composition for polishing magnetic recording disk substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000013858A JP3877924B2 (en) 2000-01-24 2000-01-24 Magnetic disk substrate polishing composition

Publications (3)

Publication Number Publication Date
JP2001207161A JP2001207161A (en) 2001-07-31
JP2001207161A5 true JP2001207161A5 (en) 2005-08-04
JP3877924B2 JP3877924B2 (en) 2007-02-07

Family

ID=18541393

Family Applications (1)

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JP2000013858A Expired - Lifetime JP3877924B2 (en) 2000-01-24 2000-01-24 Magnetic disk substrate polishing composition

Country Status (3)

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JP (1) JP3877924B2 (en)
CN (1) CN1243070C (en)
MY (1) MY118633A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4231632B2 (en) * 2001-04-27 2009-03-04 花王株式会社 Polishing liquid composition
MY133305A (en) * 2001-08-21 2007-11-30 Kao Corp Polishing composition
JP4462599B2 (en) * 2001-08-21 2010-05-12 花王株式会社 Polishing liquid composition
JP3875156B2 (en) * 2002-08-07 2007-01-31 花王株式会社 Roll-off reducing agent
JP4202172B2 (en) * 2003-03-31 2008-12-24 株式会社フジミインコーポレーテッド Polishing composition
JP4891304B2 (en) * 2008-10-23 2012-03-07 花王株式会社 Manufacturing method of memory hard disk substrate
WO2015146941A1 (en) * 2014-03-28 2015-10-01 山口精研工業株式会社 Polishing agent composition and method for polishing magnetic disk substrate
WO2015146942A1 (en) 2014-03-28 2015-10-01 山口精研工業株式会社 Polishing agent composition and method for polishing magnetic disk substrate
JP6480139B2 (en) * 2014-09-30 2019-03-06 株式会社フジミインコーポレーテッド Polishing composition
JP6775511B2 (en) * 2015-09-25 2020-10-28 山口精研工業株式会社 Abrasive composition and method for polishing magnetic disk substrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3825827B2 (en) * 1996-01-30 2006-09-27 昭和電工株式会社 Polishing composition, magnetic disk substrate polishing method, and manufacturing method
JP3653133B2 (en) * 1996-01-30 2005-05-25 昭和電工株式会社 Polishing composition, magnetic disk substrate polishing method, and manufacturing method
JPH10121034A (en) * 1996-03-18 1998-05-12 Showa Denko Kk Composition for polishing magnetic disk substrate
JPH10121035A (en) * 1996-08-30 1998-05-12 Showa Denko Kk Composition for polishing magnetic disk substrate
JP3457144B2 (en) * 1997-05-21 2003-10-14 株式会社フジミインコーポレーテッド Polishing composition
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing

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