CN1243070C - Abrasive composition for polishing magnetic recording disk matrix - Google Patents
Abrasive composition for polishing magnetic recording disk matrix Download PDFInfo
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- CN1243070C CN1243070C CN 01104631 CN01104631A CN1243070C CN 1243070 C CN1243070 C CN 1243070C CN 01104631 CN01104631 CN 01104631 CN 01104631 A CN01104631 A CN 01104631A CN 1243070 C CN1243070 C CN 1243070C
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- polishing
- magnetic recording
- recording disk
- abrasive composition
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Abstract
The present invention provides an abrasive composition for polishing magnetic recording disk substrates that results in a low surface roughness of the magnetic recording disk, allows the attaining of high-density recording without the occurrence of protrusions or polishing scratches, and enables polishing to be performed at an economical speed. The present invention discloses an abrasive composition for polishing magnetic recording disk substrates comprising water, silicon dioxide, antigelling agent, aluminum nitrate and hydrogen peroxide.
Description
Detailed Description Of The Invention
The present invention relates to be used for the abrasive composition of polishing magnetic recording disk matrix, and be specifically related to a kind of abrasive composition that is used for polishing magnetic recording disk matrix, it can obtain high-precision magnetic recording disk surface, and the flying height (being the gap) that makes magnetic head leave this dish reduces.
Background of invention
In the external memorizer of computer and word processor, be extensive use of the means of magnetic recording disk (storage hard disk) as high quick checking rope.A common instance for preparing this magnetic recording disk is that a kind of Al alloy substrate is carried out the NiP electroless plating and prepares a kind of matrix, this matrix of surface finish on its surface, and forms Cr alloy underlayer, Co alloy magnetic film and carbon protective film successively by sputter subsequently.
When the irregularity that is higher than the magnetic head floats height or projection are stayed on the magnetic recording disk surface, can clash into this projection with predetermined come-up height and the magnetic head that skims over this dish at a high speed, cause that magnetic head damages.When magnetic recording disk matrix has projection and polishing cut, on this matrix, form in the process of Cr alloy underlayer or Co alloy magnetic film, produce the defective that projection and polishing cut cause on the film surface, thereby make the magnetic recording disk that is obtained to have high-precision flat surfaces.Therefore, in order to make magnetic recording disk, the accurately polishing of dish matrix with high-precision surface.
So, multiple polishing composition has been proposed, during to the magnetic recording disk matrix polishing, these compositions are removed projection, rising height are reduced to minimum or formed the polishing cut hardly.For example, although making rubbing down particulate prior art with employing submicron titan oxide particles compares, Japanese laid-open patent application Te Kaipingdi 10-121035 number (using a kind of composition that adds aluminum nitrate in the oriented titanium dioxide that contains) is easy to obtain high surface accuracy and high rate of wear, but, because the influence of abrasive grain hardness is difficult to obtain required surface accuracy at present.In addition, though make the result of abrasive grain as using soft silicon-dioxide fine granular, Japanese unexamined patent Te Kaipingdi 11-167715 (uses a kind of composition that adds aluminum nitrate in the oriented colloidal silica that contains,) make the acquisition surface accuracy become easy, but, be difficult to obtain to can be used for the rate of wear in the actual production.
The problem that invention will solve
In order to polish, can obtain the aluminium magnetic recording disk matrix of high density magnetic recording, the desired quality of abrasive composition is to obtain high-precision dish surface, and the magnetic head floats height is reduced.
The purpose of this invention is to provide a kind of abrasive composition that is used for polishing magnetic recording disk matrix, its reduces the roughness on magnetic recording disk surface, and can obtain high density recording and projection or polishing cut do not take place, and can polishing at a high speed with economy.
The means of dealing with problems
In order to reach the required high-precision glazed surface of the aluminium of low flying height magnetic recording disk is arranged, abrasive composition has been carried out broad research, the result, the inventor finds a kind of abrasive composition that presents excellent properties, this abrasive composition uses silicon-dioxide also to mix aluminum nitrate, anti-gelling agent and hydrogen peroxide therein as abrasive material, causes finishing the present invention thus.That is, the present invention is made up of following each invention:
(1) abrasive composition of a kind of magnetic recording disk matrix polishing usefulness, it comprises: the water of 95.7% weight at the most; The silicon-dioxide of at least 3% weight; The anti-gelling agent of at least 0.1% weight, this anti-gelling agent are selected from one or more in phosphinic acid compounds, phenanthroline and the aluminium acetylacetonate salt; The hydrogen peroxide of the aluminum nitrate of at least 1% weight and at least 0.2% weight;
(2) use abrasive composition according to the magnetic recording disk matrix polishing of above (1), wherein silicon-dioxide is selected from one or more in colloidal silica, pyrogenic silica and the precipitated silica;
(3) use abrasive composition according to the magnetic recording disk matrix polishing of one of above (1) or (2), wherein the mean particle size of silicon-dioxide secondary granule is the 0.03-0.5 micron;
(4) use abrasive composition according to the magnetic recording disk matrix polishing of above (1) to (3) in any one, wherein concentration of silicon dioxide is 3-30 weight % in the said composition;
(5) use abrasive composition according to the magnetic recording disk matrix polishing of above (1) to (4) in any one, wherein this anti-gelling agent is selected from one or more in phosphinic acid compounds, phenanthroline and the aluminium acetylacetonate salt; With
(6) use abrasive composition according to the magnetic recording disk matrix polishing of above (5), wherein this phosphinic acid compounds is a 1-hydroxyl ethane-1, the 1-di 2 ethylhexyl phosphonic acid.
According to the present invention, the abrasive composition that is used for the magnetic recording disk polishing is to be made of water, silicon-dioxide, anti-gelling agent, aluminum nitrate and hydrogen peroxide, like this, owing to have anti-gelling agent, aluminum nitrate and three kinds of compositions of hydrogen peroxide, just obtains higher rate of wear.
Though the abrasive composition that the present invention polishes usefulness can be advantageously used in the used matrix of for example high density recording, (recording density is 1G bit/inch to the dish of using as the high record density of the magnetic head adapted of utilization magnetoresistance (MR) effect usually
2Or higher), from the viewpoint of improvement in reliability, it also can be effective to have the magnetic recording disk of lower recording density.
Embodiment of the present invention
Polish with in the abrasive composition in the present invention, the contained silicon-dioxide as abrasive material is had no particular limits, can use colloidal silica, pyrogenic silica or precipitated silica, and the mean particle size of secondary granule is preferably the 0.03-0.5 micron.The mean particle size of secondary granule is meant: with the value that MICROTRAC UPA 150 (Honeywell manufacturings) are measured, this product is a kind of particle size distribution measurement instrument of laser doppler spectral decomposition type.
Though when the size of silicon-dioxide secondary granule increases, owing to exist coarse grained probability also to increase, suppress meticulous gelation and gathering and become and be more prone to, this can cause the appearance of polishing cut.In addition, if the size of secondary granule reduces, above-mentioned gelation and gathering also are easy to take place, and this also causes the appearance of polishing cut.Therefore, the present invention polishes with the contained secondary granule as abrasive material silicon-dioxide in the abrasive composition, the preferred 0.03-0.5 micron of its mean particle size, and more preferably 0.04-0.2 micron.
If polishing is lower than 3 weight % with concentration of silicon dioxide in the abrasive composition, then rate of wear significantly reduces.In addition, along with silica concentration increases,,, just can not observe the further increase of rate of wear, and easier generation gelation is particularly in the situation of colloidal silica if this concentration surpasses 30 weight % though rate of wear also increases.Consider feasibility economically, the actual upper bound of silica concentration is 30 weight %.Like this, the silica concentration in the abrasive composition is preferably in the scope of 3-30 weight %, more preferably in 5-15 weight % scope.
Though, as the result who uses anti-gelling agent, aluminum nitrate and three kinds of constituents mixts of hydrogen peroxide in polishing with abrasive composition in the present invention, obtain appreciable abrasion facilitation effect, but the addition of anti-gelling agent is preferably 0.1-2 weight %, more preferably 0.3-1 weight %, the addition of aluminum nitrate is preferably 1-20 weight %, more preferably 2-15 weight %, the addition of hydrogen peroxide is preferably 0.2-5 weight, more preferably 0.5-3 weight %.
If the addition of anti-gelling agent is less than 0.1 weight %, then abrasive facilitation effect weakens and is easier to produce gel.In addition, even the addition of anti-gelling agent surpasses 2 weight %, abrasive facilitation effect also no longer increases.
If the addition of aluminum nitrate is less than 1 weight %, then abrasive facilitation effect weakens.In addition, if the addition of aluminum nitrate surpasses 20 weight %, then be easier to produce gel.
If the addition of hydrogen peroxide is less than 0.2 weight %, then abrasive facilitation effect weakens.In addition, even the addition of hydrogen peroxide surpasses 5 weight %, abrasive facilitation effect also no longer increases.
Used anti-gelling agent is preferably and is selected from phosphinic acid compounds, phenanthroline and the aluminium acetylacetonate salt class or two classes or the mixture of multiclass more among the present invention.The specific examples of phosphinic acid compounds comprises: 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid (C
2H
6O
7P
2) and amino trimethylammonium phosphonic acids (C
2H
12O
9P
3N), the specific examples of phenanthroline is 1,10-phenanthroline hydrate (C
12H
8N
2H
2O) and the specific examples of aluminium acetylacetonate salt be the aluminum complex salt (Al of methyl ethyl diketone
2[CH (COCH
3)
3]).Wherein, particularly as rubbing down promotor, with 1-hydroxyl ethane-1, the 1-di 2 ethylhexyl phosphonic acid is the most effective.
Above-mentioned each constituent concentration all is meant the concentration during the magnetic recording disk matrix polishing.Use after polishing is that manufacturing has the abrasive composition greater than above-mentioned concentration in processes such as the manufacturing of abrasive composition and transportations, is diluted to above-mentioned concentration in use then, this will be more effective.
Though, can prove and in silicon-dioxide, sneak into anti-gelling agent, aluminum nitrate and three kinds of compositions of hydrogen peroxide, the present invention's polishing has suitable abrasion facilitation effect with abrasive composition,, its mechanism is also uncertain.Yet, it is believed that disperse the effect of anti-gelling agent to have gentle physical grinding effect, the oxidation effectiveness of hydrogen peroxide works to strengthen the abrasion facilitation effect of aluminum nitrate, makes the chemical grinding effect more effective.By mixing 3 kinds of compositions, the rate of wear when rate of wear is higher than two kinds of compositions of any mixing really, and certain appearance that has suppressed polishing cut and hole.
Except above-mentioned each composition, also can be to the additive of magnetic recording disk matrix polishing of the present invention with interpolation such as tensio-active agent and sanitas in the abrasive composition.But, to additivated type of institute and the necessary careful attention of consumption, so that do not cause gelation.
Similar with abrasive composition with the polishing of prior art, polishing of the present invention can be by suspended silica in water with abrasive composition, adds anti-gelling agent, aluminum nitrate and hydrogen peroxide then and waits and prepare.
Although the type that the present invention is polished with the handled magnetic recording disk matrix of abrasive composition is not particularly limited, but, when abrasive composition of the present invention is used for the polishing of aluminium (comprising aluminium alloy) matrix, when particularly for example the aluminum substrate of process NiP chemical plating polishes, because the synergy between the chemical grinding effect that gentle physical grinding effect that silicon-dioxide produces and anti-gelling agent, aluminum nitrate and hydrogen peroxide produce can obtain the high quality polished surface.
The method of polishing is the polishing pad that generally is used for the pulpous state abrasive material to be slided on magnetic recording disk matrix, and rotate this polishing pad or matrix when infeeding slurry between this liner and matrix.
Magnetic recording disk with the present invention's polishing is made with the matrix of abrasive composition polishing has the generation frequency of the nibs of extremely low for example little hole and minute scratch marks, and surfaceness (Ra) is about 0.2-0.3 nanometer, and excellent planeness is arranged.
Embodiment
Though the detailed description of the embodiment of the invention hereinafter is provided,, the present invention is limited to these embodiment absolutely not.
Embodiment 1-13
Add water, anti-gelling agent, aluminum nitrate and hydrogen peroxide to colloidal silica (SYTON HT-50F in the ratio shown in the table 2, E.I.du Pont de Nemours and Company) in, the various water-based abrasive compositions of preparation polishing usefulness, afterwards, with polishing under polishing machine and the polishing condition hereinafter.It the results are shown in table 2.
In addition, measure granularity with MICROTRAC UPA 150 (Honeywell manufacturings), this product is a kind of laser doppler spectral decomposition type particle size distribution measurement instrument.The size-grade distribution that records sees Table 1.
Embodiment 14 and 15
Grind precipitated silica (Nippon Silica Industrial Co. with medium stirring mill, Ltd., E-150) and pyrogenic silica (Nippon Aerosil Co., Ltd., AERSIL 50), and remove coarse particles by classification, be 0.1 micron silicon-dioxide to prepare the mean particle size of secondary granule wherein.Then, add water, anti-gelling agent, aluminum nitrate and hydrogen peroxide, so that the various water-based abrasive compositions of preparation polishing usefulness subsequently, polish with polishing machine and under following polishing condition according to the ratio shown in the table 2.It the results are shown in table 2.In addition, the granularity that records sees Table 1.
Polishing condition:
The base material that adopts: 3.5 inches aluminium dishes, carried out chemical plating with NiP.
The polishing condition that polishing machine uses:
Polished finish machine: 4-road Twp-sided polishing machine
Polishing underlay: chamois leather type (POLITEX DG, Rodel Inc.)
Base pressure dish rotating speed: 60 rev/mins
Inject slurry speed: 50 ml/min
Polishing time: 5 minutes
Operating pressure: 50 gram per centimeters
2
The assessment of polishing performance:
Rate of wear: calculate from the difference of polished aluminum dish front and back weight.
Surfaceness: measure with Talystep and Talydata 2000 (Rank Taylor Hobson Ltd.).
Carry out 3 dimension morphological analyses by the P-12 surface analyzer (TENCOR) that is equipped with scan-probe, measure the degree of depth in polishing cut and polishing hole.
Table 2 has been listed the assessment result of polishing performance.In table 2, grade " A " is meant that the degree of depth in polishing cut or polishing hole is 5 nanometers or situation still less, and grade " B " is meant that the degree of depth in polishing cut or polishing hole is the 5-10 nanometer.In any embodiment and Comparative Examples, there be not polishing cut or the polishing hole of the degree of depth greater than 10 nanometers.
Comparative Examples 1 and 2
Add water, anti-gelling agent, aluminum nitrate and hydrogen peroxide to colloidal silica (SYTON HT-50F in the ratio shown in the table 2, E.I.du Pont de Nemours and Company) in, a kind of water-based abrasive composition of preparation polishing usefulness then polishes with the mode identical with these embodiment.It the results are shown in table 2.
Comparative Examples 3
With medium stirring mill milled titanium dioxide (SUPER TITANIA F-2, Showa Titanium Co.Ltd. product), subsequently, the classified coarse particles of removing is 0.3 micron a titanium dioxide at first to obtain mean particle size.Then, add water and aluminum nitrate,, subsequently, polish according to the mode identical with these embodiment to prepare a kind of water-based abrasive composition that polishes usefulness according to the ratio shown in the table 2.It the results are shown in table 2, and in addition, the granularity that records is shown in table 1.
Table 1
| Name of product | Original particle size (micron) | Secondary particle size (micron) | |
| Silicon-dioxide (1) (silica (1)) silicon-dioxide (2) (silica (2)) silicon-dioxide (3) (silica (3)) | SYTON HT-50F E-150J AEROSIL 50 | 0.05 0.03 0.05 | 0.05 0.1 0.1 |
| Titanium dioxide (titanium dioxide) | F-2 | 0.06 | 0.3 |
Table 2
| The rubbing down agent | Anti-gelling agent | Aluminum nitrate | Hydrogen peroxide | Rate of wear (micron minute) | Surfaceness (Ra) (nm) | The polishing cut | The polishing hole | ||
| Kind addition (wt%) | Kind addition (wt%) | Addition (wt%) | Addition (wt%) | ||||||
| Embodiment | 1 2 3 4 5 6 7 8 9 10 | Silica (1) 2 silica (1) 6 silica (1) 15 silica (1) 6 silica (1) 6 silica (1) 6 silica (1) 6 silica (1) 6 silica (1) 6 silica (1) 6 | 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 1.0 1-hydroxyl ethanes-1,1-di 2 ethylhexyl phosphonic acid 2.0 1-hydroxyl ethanes-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 | 5.0 5.0 5.0 5.0 5.0 2.0 10.0 5.0 5.0 5.0 | 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.1 0.5 2.0 | 0.11 0.20 0.24 0.24 0.25 0.18 0.23 0.12 0.18 0.22 | 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 | A A A A A A A A A A | A A A A A A A A A A |
| 11 12 13 | Silica (1) 6 silica (1) 6 silica (1) 6 | Amino Trimethylene Phosphonic Acid 0.3 1,10-phenanthroline monohydrate 0.3 aluminium acetylacetonate salt 0.3 | 5.0 5.0 5.0 | 1.0 1.0 1.0 | 0.20 0.19 0.19 | 0.2 0.2 0.2 | A A A | A A A | |
| 14 15 | Silica (2) 6 silicas (3) 6 | 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3 | 5.0 5.0 | 1.0 1.0 | 0.20 0.20 | 0.2 0.2 | A A | A A | |
| Comparative Examples | 1 2 3 | Silica (1) 6 silica (1) 6 titanium dioxide 6 | --1-hydroxyl ethane-1,1-di 2 ethylhexyl phosphonic acid 0.3-- | 5.0 - 5.0 | 1.0 1.0 - | 0.08 0.09 0.21 | 0.4 0.2 0.4 | B A B | A A B |
The invention effect
When the abrasive composition polishing disk that uses for polishing with the present invention, can significantly reduce surface roughness, and can polish with high rate of wear. Use the magnetic recording disk of polishing disk as the hard disk of low flying height, and can high density recording.
Use the magnetic recording disk of polishing disk, particularly, as high-density recording media, its value is very high, and generally (packing density is as 1G bit/inch take MR used medium for this medium2Or higher) be representative. From the viewpoint of high reliability medium, it can also be used for the magnetic recording dish of low packing density.
Claims (5)
1. the abrasive composition of magnetic recording disk matrix polishing usefulness, it comprises: the water of 95.7% weight at the most; The silicon-dioxide of 3～30% weight; 0.1 the anti-gelling agent of～2% weight, this anti-gelling agent are selected from phosphinic acid compounds, phenanthroline and the aluminium acetylacetonate salt one or more; The hydrogen peroxide of the aluminum nitrate of 1～20% weight and 0.2～5% weight.
2. use abrasive composition according to the magnetic recording disk matrix polishing of claim 1, wherein silicon-dioxide is selected from one or more in colloidal silica, pyrogenic silica and the precipitated silica.
3. use abrasive composition according to the magnetic recording disk matrix polishing of one of claim 1 or 2, wherein the mean particle size of silicon-dioxide secondary granule is the 0.03-0.5 micron.
4. abrasive composition is used in the magnetic recording disk matrix polishing in any one according to claim 1 to 3, and wherein concentration of silicon dioxide is 3-30 weight % in the said composition.
5. abrasive composition is used in the magnetic recording disk matrix polishing in any one according to claim 1 to 4, and wherein this phosphinic acid compounds is a 1-hydroxyl ethane-1, the 1-di 2 ethylhexyl phosphonic acid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP013858/2000 | 2000-01-24 | ||
| JP2000013858A JP3877924B2 (en) | 2000-01-24 | 2000-01-24 | Magnetic disk substrate polishing composition |
| JP013858/00 | 2000-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1309160A CN1309160A (en) | 2001-08-22 |
| CN1243070C true CN1243070C (en) | 2006-02-22 |
Family
ID=18541393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01104631 Expired - Fee Related CN1243070C (en) | 2000-01-24 | 2001-01-23 | Abrasive composition for polishing magnetic recording disk matrix |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3877924B2 (en) |
| CN (1) | CN1243070C (en) |
| MY (1) | MY118633A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4231632B2 (en) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | Polishing liquid composition |
| JP4462599B2 (en) * | 2001-08-21 | 2010-05-12 | 花王株式会社 | Polishing liquid composition |
| MY133305A (en) * | 2001-08-21 | 2007-11-30 | Kao Corp | Polishing composition |
| JP3875156B2 (en) * | 2002-08-07 | 2007-01-31 | 花王株式会社 | Roll-off reducing agent |
| JP4202172B2 (en) * | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | Polishing composition |
| JP4891304B2 (en) * | 2008-10-23 | 2012-03-07 | 花王株式会社 | Manufacturing method of memory hard disk substrate |
| WO2015146941A1 (en) | 2014-03-28 | 2015-10-01 | 山口精研工業株式会社 | Polishing agent composition and method for polishing magnetic disk substrate |
| JP6484894B2 (en) | 2014-03-28 | 2019-03-20 | 山口精研工業株式会社 | Abrasive composition and method for polishing magnetic disk substrate |
| JP6480139B2 (en) * | 2014-09-30 | 2019-03-06 | 株式会社フジミインコーポレーテッド | Polishing composition |
| MY184933A (en) | 2015-09-25 | 2021-04-30 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3653133B2 (en) * | 1996-01-30 | 2005-05-25 | 昭和電工株式会社 | Polishing composition, magnetic disk substrate polishing method, and manufacturing method |
| JP3825827B2 (en) * | 1996-01-30 | 2006-09-27 | 昭和電工株式会社 | Polishing composition, magnetic disk substrate polishing method, and manufacturing method |
| JPH10121034A (en) * | 1996-03-18 | 1998-05-12 | Showa Denko Kk | Composition for polishing magnetic disk substrate |
| JPH10121035A (en) * | 1996-08-30 | 1998-05-12 | Showa Denko Kk | Composition for polishing magnetic disk substrate |
| JP3457144B2 (en) * | 1997-05-21 | 2003-10-14 | 株式会社フジミインコーポレーテッド | Polishing composition |
| US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
-
2000
- 2000-01-24 JP JP2000013858A patent/JP3877924B2/en not_active Expired - Lifetime
-
2001
- 2001-01-22 MY MYPI20010276 patent/MY118633A/en unknown
- 2001-01-23 CN CN 01104631 patent/CN1243070C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3877924B2 (en) | 2007-02-07 |
| JP2001207161A (en) | 2001-07-31 |
| CN1309160A (en) | 2001-08-22 |
| MY118633A (en) | 2004-12-31 |
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