CN1243070C - 用于抛光磁记录盘基体的磨料组合物 - Google Patents
用于抛光磁记录盘基体的磨料组合物 Download PDFInfo
- Publication number
- CN1243070C CN1243070C CN 01104631 CN01104631A CN1243070C CN 1243070 C CN1243070 C CN 1243070C CN 01104631 CN01104631 CN 01104631 CN 01104631 A CN01104631 A CN 01104631A CN 1243070 C CN1243070 C CN 1243070C
- Authority
- CN
- China
- Prior art keywords
- polishing
- magnetic recording
- abrasive composition
- silica
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 85
- 239000000203 mixture Substances 0.000 title claims abstract description 48
- 239000011159 matrix material Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 112
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 35
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 34
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000003349 gelling agent Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 17
- 239000011163 secondary particle Substances 0.000 claims description 9
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 8
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 claims description 6
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 claims description 5
- 239000008119 colloidal silica Substances 0.000 claims description 5
- 150000003009 phosphonic acids Chemical class 0.000 claims description 5
- -1 phosphonic acid compound Chemical class 0.000 claims description 4
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 abstract description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 15
- 230000000694 effects Effects 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000004408 titanium dioxide Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001879 gelation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001737 promoting effect Effects 0.000 description 4
- 239000011362 coarse particle Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- PPQJCISYYXZCAE-UHFFFAOYSA-N 1,10-phenanthroline;hydrate Chemical group O.C1=CN=C2C3=NC=CC=C3C=CC2=C1 PPQJCISYYXZCAE-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229940075614 colloidal silicon dioxide Drugs 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- BXLLINKJZLDGOX-UHFFFAOYSA-N dimethoxyphosphorylmethanamine Chemical compound COP(=O)(CN)OC BXLLINKJZLDGOX-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013858A JP3877924B2 (ja) | 2000-01-24 | 2000-01-24 | 磁気ディスク基板研磨用組成物 |
| JP013858/00 | 2000-01-24 | ||
| JP013858/2000 | 2000-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1309160A CN1309160A (zh) | 2001-08-22 |
| CN1243070C true CN1243070C (zh) | 2006-02-22 |
Family
ID=18541393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01104631 Expired - Fee Related CN1243070C (zh) | 2000-01-24 | 2001-01-23 | 用于抛光磁记录盘基体的磨料组合物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3877924B2 (enExample) |
| CN (1) | CN1243070C (enExample) |
| MY (1) | MY118633A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| MY133305A (en) * | 2001-08-21 | 2007-11-30 | Kao Corp | Polishing composition |
| JP4462599B2 (ja) * | 2001-08-21 | 2010-05-12 | 花王株式会社 | 研磨液組成物 |
| JP3875156B2 (ja) * | 2002-08-07 | 2007-01-31 | 花王株式会社 | ロールオフ低減剤 |
| JP4202172B2 (ja) * | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP4891304B2 (ja) * | 2008-10-23 | 2012-03-07 | 花王株式会社 | メモリーハードディスク基板の製造方法 |
| JP6484894B2 (ja) * | 2014-03-28 | 2019-03-20 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| JP6511039B2 (ja) | 2014-03-28 | 2019-05-08 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| JP6480139B2 (ja) * | 2014-09-30 | 2019-03-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| MY184933A (en) | 2015-09-25 | 2021-04-30 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3825827B2 (ja) * | 1996-01-30 | 2006-09-27 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JP3653133B2 (ja) * | 1996-01-30 | 2005-05-25 | 昭和電工株式会社 | 研磨用組成物、磁気ディスク基板の研磨方法、及び製造方法 |
| JPH10121034A (ja) * | 1996-03-18 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板の研磨用組成物 |
| JPH10121035A (ja) * | 1996-08-30 | 1998-05-12 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| JP3457144B2 (ja) * | 1997-05-21 | 2003-10-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
-
2000
- 2000-01-24 JP JP2000013858A patent/JP3877924B2/ja not_active Expired - Lifetime
-
2001
- 2001-01-22 MY MYPI20010276 patent/MY118633A/en unknown
- 2001-01-23 CN CN 01104631 patent/CN1243070C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| MY118633A (en) | 2004-12-31 |
| CN1309160A (zh) | 2001-08-22 |
| JP3877924B2 (ja) | 2007-02-07 |
| JP2001207161A (ja) | 2001-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060222 Termination date: 20160123 |
|
| EXPY | Termination of patent right or utility model |