JP2001203229A5 - - Google Patents

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Publication number
JP2001203229A5
JP2001203229A5 JP2000008761A JP2000008761A JP2001203229A5 JP 2001203229 A5 JP2001203229 A5 JP 2001203229A5 JP 2000008761 A JP2000008761 A JP 2000008761A JP 2000008761 A JP2000008761 A JP 2000008761A JP 2001203229 A5 JP2001203229 A5 JP 2001203229A5
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JP
Japan
Prior art keywords
semiconductor device
conductive layer
bump
manufacturing
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000008761A
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English (en)
Japanese (ja)
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JP2001203229A (ja
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Application filed filed Critical
Priority to JP2000008761A priority Critical patent/JP2001203229A/ja
Priority claimed from JP2000008761A external-priority patent/JP2001203229A/ja
Publication of JP2001203229A publication Critical patent/JP2001203229A/ja
Publication of JP2001203229A5 publication Critical patent/JP2001203229A5/ja
Withdrawn legal-status Critical Current

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JP2000008761A 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器 Withdrawn JP2001203229A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000008761A JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000008761A JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (2)

Publication Number Publication Date
JP2001203229A JP2001203229A (ja) 2001-07-27
JP2001203229A5 true JP2001203229A5 (https=) 2005-02-24

Family

ID=18536979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000008761A Withdrawn JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Country Status (1)

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JP (1) JP2001203229A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP4880218B2 (ja) 2004-12-22 2012-02-22 三洋電機株式会社 回路装置
JP2009049059A (ja) * 2007-08-14 2009-03-05 Toppan Forms Co Ltd 部品実装基板およびその製造方法
JP2009070865A (ja) * 2007-09-11 2009-04-02 Rohm Co Ltd 半導体装置
JP4979542B2 (ja) * 2007-11-05 2012-07-18 パナソニック株式会社 実装構造体およびその製造方法
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法
JP6676935B2 (ja) 2015-11-13 2020-04-08 セイコーエプソン株式会社 電気デバイス、圧電モーター、ロボット、ハンド及び送液ポンプ
JP6769034B2 (ja) 2016-01-20 2020-10-14 セイコーエプソン株式会社 Ｍｅｍｓデバイス、液体噴射ヘッド、および液体噴射装置

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