JP2001203229A - 半導体装置及びその製造方法、回路基板並びに電子機器 - Google Patents

半導体装置及びその製造方法、回路基板並びに電子機器

Info

Publication number
JP2001203229A
JP2001203229A JP2000008761A JP2000008761A JP2001203229A JP 2001203229 A JP2001203229 A JP 2001203229A JP 2000008761 A JP2000008761 A JP 2000008761A JP 2000008761 A JP2000008761 A JP 2000008761A JP 2001203229 A JP2001203229 A JP 2001203229A
Authority
JP
Japan
Prior art keywords
bump
semiconductor device
conductive layer
insulating layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000008761A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001203229A5 (https=
Inventor
Yohei Kurashima
羊平 倉島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2000008761A priority Critical patent/JP2001203229A/ja
Publication of JP2001203229A publication Critical patent/JP2001203229A/ja
Publication of JP2001203229A5 publication Critical patent/JP2001203229A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2000008761A 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器 Withdrawn JP2001203229A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000008761A JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000008761A JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (2)

Publication Number Publication Date
JP2001203229A true JP2001203229A (ja) 2001-07-27
JP2001203229A5 JP2001203229A5 (https=) 2005-02-24

Family

ID=18536979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000008761A Withdrawn JP2001203229A (ja) 2000-01-18 2000-01-18 半導体装置及びその製造方法、回路基板並びに電子機器

Country Status (1)

Country Link
JP (1) JP2001203229A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP2006179652A (ja) * 2004-12-22 2006-07-06 Sanyo Electric Co Ltd 回路装置
JP2009049059A (ja) * 2007-08-14 2009-03-05 Toppan Forms Co Ltd 部品実装基板およびその製造方法
JP2009070865A (ja) * 2007-09-11 2009-04-02 Rohm Co Ltd 半導体装置
JP2009117496A (ja) * 2007-11-05 2009-05-28 Panasonic Corp 実装構造体およびその製造方法
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法
US10207503B2 (en) 2016-01-20 2019-02-19 Seiko Epson Corporation MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
US10498260B2 (en) 2015-11-13 2019-12-03 Seiko Epson Corporation Electric device, piezoelectric motor, robot, hand, and liquid transport pump

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP2006179652A (ja) * 2004-12-22 2006-07-06 Sanyo Electric Co Ltd 回路装置
US8093699B2 (en) 2004-12-22 2012-01-10 Sanyo Electric Co., Ltd. Circuit device with circuit board and semiconductor chip mounted thereon
JP2009049059A (ja) * 2007-08-14 2009-03-05 Toppan Forms Co Ltd 部品実装基板およびその製造方法
JP2009070865A (ja) * 2007-09-11 2009-04-02 Rohm Co Ltd 半導体装置
JP2009117496A (ja) * 2007-11-05 2009-05-28 Panasonic Corp 実装構造体およびその製造方法
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法
US10498260B2 (en) 2015-11-13 2019-12-03 Seiko Epson Corporation Electric device, piezoelectric motor, robot, hand, and liquid transport pump
US10207503B2 (en) 2016-01-20 2019-02-19 Seiko Epson Corporation MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

Similar Documents

Publication Publication Date Title
JP3633559B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP4662079B2 (ja) 配線基板の製造方法及び電子部品の製造方法
JP3994262B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP3838331B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPH10199934A (ja) 半導体素子実装構造体及び半導体素子実装方法
US6521483B1 (en) Semiconductor device, method of manufacture thereof, circuit board, and electronic device
JPWO2001026147A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPWO2001026155A1 (ja) 半導体装置及びその製造方法、製造装置、回路基板並びに電子機器
JP2004343030A (ja) 配線回路基板とその製造方法とその配線回路基板を備えた回路モジュール
JPWO2001008223A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2005079581A (ja) テープ基板、及びテープ基板を用いた半導体チップパッケージ、及び半導体チップパッケージを用いたｌｃｄ装置
JP4019251B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPWO2001008222A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
CN101499453B (zh) 配线电路基板及其制造方法
JP2001223243A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2001203229A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2005191541A (ja) 半導体装置、半導体チップ、半導体装置の製造方法及び電子機器
WO2000019515A1 (en) Semiconductor device and manufacturing method thereof, circuit board and electronic equipment
JP3904058B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2005311293A (ja) 半導体チップ、半導体装置、半導体装置の製造方法及び電子機器
JP3582513B2 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JPWO2000026959A1 (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2005101170A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2001250842A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2012093646A (ja) 電子デバイス及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040316

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040316

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041026

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20051220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060308

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20060502