JP2001181854A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001181854A5 JP2001181854A5 JP1999365464A JP36546499A JP2001181854A5 JP 2001181854 A5 JP2001181854 A5 JP 2001181854A5 JP 1999365464 A JP1999365464 A JP 1999365464A JP 36546499 A JP36546499 A JP 36546499A JP 2001181854 A5 JP2001181854 A5 JP 2001181854A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- formation method
- plating solution
- wiring formation
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 50
- 239000010949 copper Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 24
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 claims description 16
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 14
- -1 polyoxyethylene Polymers 0.000 claims description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 13
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical group OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 12
- 150000005215 alkyl ethers Chemical class 0.000 claims description 12
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 150000001299 aldehydes Chemical class 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 8
- 239000008139 complexing agent Substances 0.000 claims description 8
- 229910001431 copper ion Inorganic materials 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000005556 hormone Substances 0.000 description 1
- 229940088597 hormone Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36546499A JP2001181854A (ja) | 1999-12-22 | 1999-12-22 | 無電解めっき液及びこれを用いた配線形成方法 |
| PCT/JP2000/009099 WO2001046494A1 (en) | 1999-12-22 | 2000-12-21 | Electroless plating solution and method of forming wiring with the same |
| KR1020017010619A KR20010102294A (ko) | 1999-12-22 | 2000-12-21 | 무전해도금액 및 이것을 사용한 배선형성방법 |
| US09/890,455 US20030024431A1 (en) | 1999-12-22 | 2000-12-21 | Electroless plating solution and method of forming wiring with the same |
| EP00985822A EP1160356A1 (en) | 1999-12-22 | 2000-12-21 | Electroless plating solution and method of forming wiring with the same |
| TW089127647A TW581823B (en) | 1999-12-22 | 2000-12-22 | Electroless plating solution and method for forming wire by using the electroless plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36546499A JP2001181854A (ja) | 1999-12-22 | 1999-12-22 | 無電解めっき液及びこれを用いた配線形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001181854A JP2001181854A (ja) | 2001-07-03 |
| JP2001181854A5 true JP2001181854A5 (https=) | 2004-12-24 |
Family
ID=18484335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36546499A Pending JP2001181854A (ja) | 1999-12-22 | 1999-12-22 | 無電解めっき液及びこれを用いた配線形成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20030024431A1 (https=) |
| EP (1) | EP1160356A1 (https=) |
| JP (1) | JP2001181854A (https=) |
| KR (1) | KR20010102294A (https=) |
| TW (1) | TW581823B (https=) |
| WO (1) | WO2001046494A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4821082B2 (ja) * | 2000-03-21 | 2011-11-24 | 和光純薬工業株式会社 | 半導体基板洗浄剤及び洗浄方法 |
| KR100434946B1 (ko) * | 2001-09-28 | 2004-06-10 | 학교법인 성균관대학 | 무전해도금방식을 이용한 반도체 소자의 구리배선형성방법 |
| JP2003147541A (ja) * | 2001-11-15 | 2003-05-21 | Hitachi Ltd | 無電解銅めっき液、無電解銅めっき用補給液及び配線板の製造方法 |
| US6875260B2 (en) | 2002-12-10 | 2005-04-05 | Enthone Inc. | Copper activator solution and method for semiconductor seed layer enhancement |
| US6897152B2 (en) | 2003-02-05 | 2005-05-24 | Enthone Inc. | Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication |
| JP2011154380A (ja) * | 2003-03-20 | 2011-08-11 | Toshiba Mobile Display Co Ltd | 表示装置の形成方法 |
| JP2004304167A (ja) * | 2003-03-20 | 2004-10-28 | Advanced Lcd Technologies Development Center Co Ltd | 配線、表示装置及び、これらの形成方法 |
| JP4931196B2 (ja) * | 2005-11-08 | 2012-05-16 | 学校法人早稲田大学 | 無電解銅めっき浴、無電解銅めっき方法及びｕｌｓｉ銅配線形成方法 |
| KR20080083790A (ko) * | 2007-03-13 | 2008-09-19 | 삼성전자주식회사 | 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법 |
| US20080248194A1 (en) * | 2007-04-04 | 2008-10-09 | L'air Liquide - Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for producing a copper layer on a substrate in a flat panel display manufacturing process |
| FR3013995A1 (fr) * | 2013-11-29 | 2015-06-05 | Commissariat Energie Atomique | Procede ameliore de metallisation d'un materiau poreux |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4563217A (en) * | 1983-07-25 | 1986-01-07 | Hitachi, Ltd. | Electroless copper plating solution |
| JPH0684545B2 (ja) * | 1985-03-29 | 1994-10-26 | 日立化成工業株式会社 | 無電解銅めっき液 |
| JPH07193214A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Electric Corp | バイアホール及びその形成方法 |
| KR960005765A (ko) * | 1994-07-14 | 1996-02-23 | 모리시다 요이치 | 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법 |
| JPH09316649A (ja) * | 1996-05-27 | 1997-12-09 | Matsushita Electric Ind Co Ltd | 無電解めっき液 |
| JP3276919B2 (ja) * | 1998-03-06 | 2002-04-22 | 英夫 本間 | 樹脂基材への高密着性めっき方法およびこれに用いる銅めっき液 |
| JP3217319B2 (ja) * | 1998-12-11 | 2001-10-09 | 松下電器産業株式会社 | 半導体装置の製造方法 |
-
1999
- 1999-12-22 JP JP36546499A patent/JP2001181854A/ja active Pending
-
2000
- 2000-12-21 KR KR1020017010619A patent/KR20010102294A/ko not_active Ceased
- 2000-12-21 WO PCT/JP2000/009099 patent/WO2001046494A1/ja not_active Ceased
- 2000-12-21 US US09/890,455 patent/US20030024431A1/en not_active Abandoned
- 2000-12-21 EP EP00985822A patent/EP1160356A1/en not_active Withdrawn
- 2000-12-22 TW TW089127647A patent/TW581823B/zh not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001181854A5 (https=) | ||
| SG11202110021PA (en) | Silicon nitride etching liquid composition | |
| US8273232B2 (en) | Copper filling-up method | |
| KR20090017582A (ko) | 구리의 무전해 증착을 위한 도금액 | |
| JP4686635B2 (ja) | 銅の無電解析出のためのめっき溶液 | |
| US4563217A (en) | Electroless copper plating solution | |
| JP2004510001A5 (https=) | ||
| US11434424B2 (en) | Aqueous solution for etching silicon oxide | |
| CN115786916A (zh) | 一种铜蚀刻液及其制备方法与玻璃基板铜的蚀刻方法 | |
| JP2004126013A5 (https=) | ||
| TWI360586B (en) | Etching solution for titanium or titanium alloy | |
| JP2002303978A5 (https=) | ||
| JP2003328185A (ja) | ブラインドビアホール充填方法 | |
| US7875110B2 (en) | Electroless plating bath composition and method of use | |
| JP2001181854A (ja) | 無電解めっき液及びこれを用いた配線形成方法 | |
| JP2545094B2 (ja) | ホトレジストストリッピング溶液及びその製法及びホトレジストの除去方法 | |
| CN1500912A (zh) | 改良的清洗组合物 | |
| US7335288B2 (en) | Methods for depositing copper on a noble metal layer of a work piece | |
| JP2000080494A (ja) | 銅ダマシン配線用めっき液 | |
| JP5774488B2 (ja) | ルテニウムの無電解析出のためのメッキ溶液 | |
| JP7650265B2 (ja) | チタンおよび／またはチタン合金のエッチング液、該エッチング液を用いたチタンおよび／またはチタン合金のエッチング方法、および該エッチング液を用いた基板の製造方法 | |
| CN1819748A (zh) | 蚀刻液和补给液以及使用它们的导体图案的形成方法 | |
| US20090130581A1 (en) | Developer composition and method for preparing the same, and method for forming resist pattern | |
| CN101336309B (zh) | 钴基合金化学镀液以及使用该化学镀液的化学镀法 | |
| JP4931196B2 (ja) | 無電解銅めっき浴、無電解銅めっき方法及びｕｌｓｉ銅配線形成方法 |