JP2001168222A - Sealing device and method of package for electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for sealing an inexpensive package for electronic parts, does not select any atmosphere, and allows operation easily, and a method for sealing the package for electronic parts. SOLUTION: A sealing device 100 of a package for electronic parts is provided with an accommodation part for accommodating the package for electronic parts having a package body 220 for storing electronic parts 210 and a package lid 230 for putting a lid to the package body, a transparent substrate 120 for pressing the package lid that is accommodated in the accommodation part to the side of the package body, and a laser part 130 for applying laser beams to the transparent substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package sealing device and an electronic component package sealing method for sealing an electronic component package.

[0002]

2. Description of the Related Art In recent years, information devices such as mobile computers, hard disk devices, and IC cards, and mobile communication devices such as mobile phones, car phones, and pacing systems have been remarkably reduced in size and thickness. Piezoelectric devices (piezoelectric devices) such as elements, piezoelectric oscillators, and SAW devices are also required to be small and thin. At the same time, there is a need for a surface-mount type piezoelectric device that can be surface-mounted on a circuit board of each device. For this reason, a piezoelectric device having a configuration in which a piezoelectric vibration element is stored in an electronic component package has been developed.

[0003] As an electronic component package for storing this electronic component, for example, there is one shown in FIG.

In FIG. 5, an electronic component package 10 is shown.
Includes a base portion 11 having a space portion 11a which is a concave portion for storing an electronic component, for example, a piezoelectric vibrating piece (not shown). The lid 12 is placed so as to cover the space 11 a of the base 11.

[0005] A seam ring 13 for sealing the space 11a of the base portion 13 with the lid portion 12 is disposed between the lid portion 12 and the base portion 11.

The lid 12 is formed of a Kovar alloy, and a nickel plating film, for example, is formed on the surface thereof as a sealing material. The base portion 11 is made of a ceramic body such as alumina, and a metal coating layer made of a tungsten (W) metallized film and a nickel (Ni) plated film is formed on a bonding surface of the base portion 11 with the lid portion 12. It is formed as a stacked film.

The seam ring 13 is a metal frame made of, for example, Kovar or 42 alloy, and is joined to the metal coating layer with a brazing material such as silver (Ag).

To seal the lid 12 of the electronic component package 10 to the base 11, a seam welding machine as shown in FIG. 6 is used. FIG. 6 is a schematic view showing a main part of the seam welding machine.

First, as shown in FIG.
During the operation, the base portion 11 of the electronic component package 10 in which the piezoelectric vibrating reed is stored in the space 11a is arranged. Then, the lid 12 is placed on the base 11 via the seam ring 13.

In this state, the seam welding machine 20 is set in a nitrogen atmosphere. Thereafter, the electronic component package 1
The lid 12 and the seam ring 13 are temporarily fixed to the base 11.

Then, as shown in FIG. 6, the slopes 21a, 21a of the rollers 21, 21 of the seam welding machine 20 are brought into contact with the lid 12 of the electronic component package 10. Since the rollers 21 and 21 are provided with electrodes, when a current flows, the nickel plating film of the lid 12 is melted by Joule heat, and the lid 12 and the seam ring 13 are joined, that is, seam welded. Will be.

Specifically, this joining state is performed by moving the jig on which the electronic component package 10 is mounted in the directions shown in FIGS. , 21 will rotate.

As described above, by moving the jig on which the electronic component package 10 is mounted, the lid 12
The space 11a of the electronic component package 10 is sealed.

On the other hand, instead of the seam welding machine 20 described above,
There is also a method of sealing the space 11a of the electronic component package 10 with an electron beam welding machine.

More specifically, the process is performed using an electron beam welding machine 30 as shown in FIG. FIG. 8 is a diagram showing a main part of the electron beam welding machine 30.

The electronic component package sealed by the electron beam welding machine 30 is the electronic component package 1 described above.
0 and its configuration is different.

That is, in the electronic component package 40 sealed by the electron beam welding machine 30, the seam ring 13 is not arranged between the lid portion 42 and the base portion 41. Therefore, a brazing material such as silver (Ag) is printed on a surface of the base portion 41 that is joined to the lid portion 42, and plays a role similar to that of the above-described brazing material.

A piezoelectric vibrating reed or the like is installed in such an electronic component package 40 and placed in the electron beam welding machine 30. Then, the lid 42 is placed on the base 41.

The cover 42 of the electronic component package 40 is attached to the base 4 by the electron beam welding machine 30.
Four fixing claws 31 for fixing to one are provided. Then, these four fixing claws 31 are arranged as shown in FIG. 9 to fix the lid 42.

In this state, the inside of the electron beam welding machine 30 is set in a vacuum atmosphere, and as shown in FIG.
Irradiate 2 By irradiating the electron beam in this way, the nickel plating film of the lid portion 42, the plating film and the brazing material of the base portion 41 are melted, and the electronic component package 40
The lid 42 seals the space of the base 41.

[0021]

As described above, the packages 10 and 40 for electronic components have been sealed by the seam welding machine 20 or the electron beam welding machine 30, but there are the following problems. .

That is, in the seam welding machine 20, the roller 21 is provided with an electrode, and the roller 21 comes into contact with the lid portion 12 and the like, so that the rollers 21 and 21 become dirty and costly for cleaning and the like. There was a problem. In addition, the lid 12 must be temporarily fixed as described above, which has been a factor of cost increase. Also, to discharge,
There was also a problem that work could not be performed in a vacuum atmosphere.
Further, there is also a problem that the apparatus becomes large-scale in order to obtain a vacuum atmosphere, and the apparatus itself becomes expensive.

On the other hand, the electron beam welding machine 30 has a problem that work can be performed only in a vacuum atmosphere because an electron beam is used. The electronic component package 40
Since the fixing claw 31 for holding the cover 42 is required, an expensive jig is required, and the apparatus itself is expensive, which causes a problem of an increase in product cost.

The present invention has been made in view of the above points, and has a low cost.
It is another object of the present invention to provide an electronic component package sealing device and an electronic component package sealing method that can be easily operated regardless of the atmosphere.

[0025]

SUMMARY OF THE INVENTION The above object is achieved by the present invention.
According to the invention, a housing portion for housing a package for electronic components having a package body for storing an electronic component, a package lid for covering the package body, and a housing portion for housing the electronic component package A transparent substrate for pressing the formed package lid against the package body, and a laser unit for irradiating the transparent substrate with a laser beam, wherein the electronic component package is sealed. This is achieved by the device.

According to this configuration, the transparent substrate for pressing the package lid housed in the housing toward the package body side and the laser unit for irradiating the transparent substrate with laser light are provided. Since a jig or the like for pressing the package lid is unnecessary and the laser light is used, the package can be sealed regardless of the atmosphere. Therefore, there is no need to use expensive equipment.

According to a second aspect of the present invention, there is provided the electronic device package sealing device according to the first aspect, wherein the transparent substrate is formed of a glass plate.

According to this structure, since the transparent substrate is formed of a glass plate, the glass plate serves to press the package lid toward the package body and transmit the laser light of the laser section. Will fulfill.

More preferably, according to the third aspect of the present invention, in the configuration of the first or second aspect, an antireflection film for laser light is formed on at least one of an upper surface and a lower surface of the transparent substrate. A sealing device for an electronic component package.

According to this configuration, since at least one of the upper surface and the lower surface of the transparent substrate is formed with the antireflection film for laser light, the efficiency of transmitting laser light can be increased.

Preferably, according to the invention of claim 4, in the structure of claims 1 to 3, the transparent substrate is provided with a projection for pressing the package lid. An electronic device package sealing device.

According to this structure, since the transparent substrate is provided with the projection for pressing the package lid, the package lid can be more effectively pressed against the package body. .

Preferably, according to a fifth aspect of the present invention, in the configuration of the third aspect, the protrusion presses a part of the package lid. It is a sealing device.

According to this configuration, since the protrusion presses a part of the package lid, the heat of the laser beam is less likely to be radiated through the protrusion. Further, dust generated by irradiating the package lid or the like with the laser light is less likely to adhere to the transparent substrate.

More preferably, according to the invention of claim 6, in the configuration of claim 5, the shape of the protrusion is smaller than the shape of the package lid, and the shape of the protrusion is within the range of the package lid. An electronic device package sealing device characterized by pressing a package lid.

According to this configuration, the shape of the projection is smaller than the shape of the package lid, and the projection presses the package lid within the range of the package lid. The heat of the laser beam propagates through the protrusions over the entire circumference of the portion, making it difficult to dissipate the heat. In addition, dust generated by irradiating the package lid or the like with the laser light is less likely to adhere to the transparent substrate over the entire circumference of the protrusion.

Preferably, according to the seventh aspect of the present invention, in the configuration of any one of the first to sixth aspects, the accommodating portion has an additional portion for pressing the package body toward the transparent substrate. A sealing device for an electronic component package, wherein a biasing means is provided.

[0038] According to this configuration, since the urging means for pressing the package body toward the transparent substrate is provided in the accommodating portion, the package lid and the package body are misaligned. No fixed state.

Preferably, according to the invention of claim 8, in the structure of any one of claims 1 to 7, the laser unit is arranged to be branched into a plurality of parts with respect to the transparent substrate. A sealing device for an electronic component package.

According to this configuration, since the laser section is arranged in a plurality of branches with respect to the transparent substrate,
A plurality of locations can be irradiated with laser light at the same time, and the working time can be significantly reduced.

Preferably, according to the ninth aspect of the present invention, in any one of the first to eighth aspects, the electronic component is a piezoelectric vibrating element and an IC (Integrated).
(Circuit).

According to this structure, the electronic component is composed of a piezoelectric vibrating element and an IC (Integrated Circuit).
Since t), these electronic components can be more efficiently sealed.

According to a tenth aspect of the present invention, an electronic component package having a package lid mounted on a package body for storing an electronic component is provided.
It is housed in the housing part and abuts against the package lid, and a transparent substrate is arranged so that the package lid is pressed against the package body.Laser light emitted from a laser unit transmits through the transparent substrate. The package lid is fixed to the package main body by irradiating the package lid and / or the package main body, thereby achieving the electronic component package sealing method.

According to this method, the transparent substrate is arranged so that the package lid is pressed against the package body, and the laser light oscillated from the laser unit passes through the transparent substrate, and the package lid and Since the package lid is fixed to the package main body by irradiating the package main body, a jig or the like for pressing the package lid is unnecessary, and sealing is performed regardless of the atmosphere because it is a laser beam. be able to. Therefore, there is no need to use expensive equipment.

Preferably, according to the invention of claim 11,
The method according to claim 10, wherein a plating portion is provided on the package lid and the package body in contact with the package lid, and the plating portion is melted by the laser light, so that the package lid and the package are formed. A method for sealing a package for an electronic component, wherein the package is fixed to a main body.

According to this method, the package lid,
A plating portion is provided on the package body that comes into contact with the package lid, and the package light is melted by the laser light, so that the package lid and the package body are fixed. Even when the molten metal is not arranged between the package body and the package body, the package lid and the package body can be fixed.

Preferably, according to the twelfth aspect of the invention,
11. The method according to claim 10, wherein a molten metal is arranged between the package lid and the package body, and the package lid and the package body are fixed by melting the molten metal with the laser beam. A method for sealing an electronic component package.

According to this method, the molten metal is arranged between the package lid and the package body, and the molten metal is melted by the laser light, whereby the package lid and the package body are fixed. Therefore, even when the molten metal is arranged between the package lid and the package main body, the package lid and the package main body can be fixed.

[0049]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.

The embodiments described below are preferred specific examples of the present invention, and are therefore subject to various technically preferable limitations. However, the scope of the present invention is not limited to the scope of the present invention in the following description. However, the present invention is not limited to these embodiments unless otherwise described. (First Embodiment) FIG.
FIG. 1 is a schematic plan view showing a package 200 for an electronic component, which is a package for an electronic component, which is sealed by the laser sealing device 100 according to the first embodiment, which is a device for sealing an electronic component package of the present invention. is there.

As shown in FIG. 1, the piezoelectric oscillator package 200 includes a box-shaped base portion 220 which is a package body having a space 220a therein. As shown in FIG. 1, the piezoelectric vibrating reed 210 and an IC under the piezoelectric vibrating reed 210 are stored in the space 220a. The base portion 220 is formed by laminating ceramic sheets or the like. Further, a lid 2 serving as a package lid of the base 220 described later.
A silver (Ag) row is arranged by printing on the joint surface with 30.

On the base portion 220, a cover portion 230 shown in a partially broken state is mounted. The lid 230 is made of iron (Fe), nickel (Ni), cobalt (C) having a nickel plating film formed on the entire surface.
It is formed by punching a Kovar metal plate, which is the alloy of o), into a predetermined rectangle.

The piezoelectric oscillator package 200 thus formed is placed in the laser sealing device 100 shown in FIG.

FIG. 2 is a schematic view showing a main part of the laser sealing device 100 according to the first embodiment of the present invention. The laser sealing device 100 has, for example, a box-shaped housing (not shown) that can block the atmosphere inside from outside. The piezoelectric oscillator package 20 as shown in FIG.
0 does not seal its lid 230 and merely
The mounting table 1 of the laser sealing device 100 is placed on the mounting table 1
10 will be mounted.

When the piezoelectric oscillator package 200 is thus mounted on the mounting table 110, the glass plate 12 of the laser sealing device 100 is
0 is disposed so as to contact the upper surface of the lid 230 of the piezoelectric oscillator package 200 from above in the figure.

The glass plate 120 has a projection 121 on the lower surface in the figure, and the projection 121 comes into contact with the lid 230. The area of the protrusion 121 abutting on the cover 230 is the cover 2
It is formed to be smaller than 30. Lid 230
In order to make the area in contact with the cover 230 smaller than the cover 230, the shape of the protrusion 121 is smaller than the shape of the cover 230.
30 is pressed. Further, in order to enhance the transmission efficiency of the laser light, the upper surface 12
2 and at least one of the lower surface 123, for example, Mg
An anti-reflection coating is made of F, ZnS, or the like.

In the drawing of the glass plate 120, a laser portion such as YAG (Yttrium Aluminum
(inium Garnet) laser head 130 is disposed.

On the other hand, in the vicinity of the mounting table 110, a spring 140 as an urging means is provided.
0 is an upper end portion of the piezoelectric oscillator package 200.
The base portion 220 is pushed up toward the glass substrate 120.

Therefore, the base part 220 and the lid part 230 of the piezoelectric oscillator package 200 are
Thus, it is reliably positioned by being sandwiched between the 0 projection 121 and the spring 140 in the vertical direction. For this reason, it is not necessary to provide a jig for pressing the lid of the electronic component package as in the related art, so that the cost can be reduced.

The laser sealing device 100 is configured as described above, and is used as follows. First, as described above, the piezoelectric oscillator package 200 is
And the projection 121 of the glass plate 120 and the spring 14
0, after positioning the piezoelectric oscillator package 200, the YAG laser head 130 is moved to irradiate the laser beam, that is, right above the joint between the lid 230 and the base 220 of the piezoelectric oscillator package 200. The YAG laser head 130 is arranged. This joining portion is a portion A in FIG. Then, as shown by A in FIG. 1, the joining portion is connected to the lid 230 and the base 2.
There are 20 borders.

Therefore, the YAG laser head 130
Means that the laser light is irradiated while sequentially moving along the portion A in FIG.

The laser light emitted from the YAG laser head 130 is applied, for example, to the portion A in FIG. 2 and reaches the glass plate 120 first. The glass plate 230 transmits the laser beam, so that the glass plate 120
The laser light transmitted through the lid 230 and the base 2 shown in FIG.
20 will be reached.

At this time, since the upper surface 122 and the lower surface 123 of the glass plate 120 are coated with an anti-reflection coating, the laser beam irradiated on the glass plate 120 is reflected by the upper surface 122 of the glass plate. Is less likely to
It is possible to more efficiently irradiate the joint portion with the laser beam.

When the laser beam is applied to the joint A, molten metal scum is generated as described later.
As shown in FIG. 2, since a fixed distance is maintained between the joint portion A and the glass plate 120, it is possible to prevent this metal residue from adhering to the glass plate 120.

Next, when the laser beam of the YAG laser head 130 is applied to the joint portion A, the following operation is performed.
That is, the lid 230 of the piezoelectric oscillator package 200
Nickel base film provided on the base portion 220
Is melted by the heat of the laser beam, and the lid 230 and the base 220 are joined. As described above, the joint portion A and the glass plate 12
Since it is difficult to dissipate the heat of the laser beam through the projection 121 because the fixed distance is maintained as 0,
The heat of the laser beam can be used efficiently.

At this time, the atmosphere of the laser sealing device 100 may be any of the atmosphere, an inert gas such as nitrogen, or vacuum, and the atmosphere is not limited. The range of use will be significantly expanded. Further, since the range of use is widened in this manner, various electronic component packages can be sealed at low cost.

As described above, when all the joints A of the lid 230 and the base 220 of the piezoelectric oscillator package 200 are joined, the sealing of the piezoelectric oscillator package 200 is completed.

(Second Embodiment) FIG. 3 is a schematic diagram showing a main part of a laser sealing device 300 according to a second embodiment of the present invention. Laser sealing device 3 according to the present embodiment
00 has substantially the same configuration as that of the laser sealing device 100 according to the above-described first embodiment, and therefore, the same portions are denoted by the same reference numerals and description thereof will be omitted, and only different points will be described below.

In the present embodiment, unlike the first embodiment, a YAG laser head 33 for branching is added to the YAG laser.
A plurality of 0s are arranged, for example, two.

Therefore, the piezoelectric oscillator package 2
Since the laser beam can be applied to a plurality of portions, for example, two portions, of the joint portion A between the cover portion 230 and the base portion 220 at the same time, sealing can be performed in a shorter time.

(Third Embodiment) FIG. 4 is a schematic view showing a main part of a laser sealing device 400 according to a third embodiment of the present invention. Laser sealing device 4 according to the present embodiment
00 has substantially the same configuration as that of the laser sealing device 100 according to the above-described first embodiment, so that the same parts will not be described, and only the differences will be described below.

In this embodiment, different from the first embodiment, a plurality of, for example, three, piezoelectric oscillator packages 200, 200, 200 can be placed in the laser sealing device 400. For example, three YAG laser heads 130 corresponding to the number of the piezoelectric oscillator packages 200, 200, 200 are arranged.

Therefore, since a plurality of piezoelectric oscillator packages 200, 200, 200 can be simultaneously sealed, a large number of piezoelectric oscillator packages 200 can be sealed.
Etc. can be sealed in a short time.

In each of the above-described embodiments, the YAG laser heads 130 and 330 are arranged in a manner perpendicular to the glass plate 120. However, the present invention is not limited to this. Can also be arranged.

[0075]

As described above, according to the present invention, an electronic component package sealing device and an electronic component package sealing device that can be easily operated at low cost and in any atmosphere. A stopping method can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a package for a piezoelectric oscillator sealed with a laser sealing device according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing a main part of the laser sealing device according to the first embodiment of the present invention.

FIG. 3 is a schematic view showing a main part of a laser sealing device according to a second embodiment of the present invention.

FIG. 4 is a schematic view showing a main part of a laser sealing device according to a third embodiment of the present invention.

FIG. 5 is a schematic perspective view showing a conventional electronic component package.

FIG. 6 is a schematic view showing a main part of a conventional seam welding machine.

FIG. 7 is a schematic view showing the operation of the seam welding machine of FIG. 6;

FIG. 8 is a schematic view showing a main part of a conventional electron beam welding machine.

9 is a schematic plan view showing a fixing claw of the electron beam welding machine shown in FIG.

[Explanation of symbols]

 100, 300, 400 ... laser sealing device 110 ... mounting table 120 ... glass plate 121 ... protrusion 122 ... upper surface 123 ... lower surface 130 ... YAG laser head 330 ...・ YAG laser head 140 ・ ・ ・ Spring 200 ・ ・ ・ Piezoelectric oscillator package 210 ・ ・ ・ Piezoelectric vibrating reed 220 ・ ・ ・ Base 220a ・ ・ ・ Space 230 → Cover

Claims (12)

[Claims] A package body for storing an electronic component; a package lid for covering the package body;
A housing for housing an electronic component package having: a transparent substrate for pressing the package lid housed in the housing toward the package body; and irradiating the transparent substrate with laser light. And a laser unit for the electronic component package. 2. The electronic device package sealing device according to claim 1, wherein the transparent substrate is formed of a glass plate. 3. The electronic component package according to claim 1, wherein an antireflection film for laser light is formed on at least one of an upper surface and a lower surface of the transparent substrate. Stop device. 4. The electronic component package sealing device according to claim 1, wherein the transparent substrate is provided with a projection for pressing the package lid. 5. The sealing device for an electronic component package according to claim 4, wherein the projection presses a part of the package lid. 6. The package according to claim 5, wherein the shape of the projection is smaller than the shape of the package lid, and the projection presses the package lid within the range of the package lid. The sealing device for a package for an electronic component according to Claim 1. 7. The container according to claim 1, wherein the housing is provided with a biasing unit for pressing the package body toward the transparent substrate. Electronic device package sealing device. 8. The electronic component package according to claim 1, wherein the laser unit is disposed so as to be branched into a plurality of portions with respect to the transparent substrate. apparatus. 9. The electronic component according to claim 8, wherein the electronic component is a piezoelectric vibrating element and an IC
The sealing device for a package for an electronic component according to claim 1, wherein the sealing device is (Integrated Circuit). 10. An electronic component package having a package lid placed in a package body for storing electronic components is accommodated in an accommodation portion, and is brought into contact with the package lid. A transparent substrate is disposed so as to be pressed against the package body, and a laser beam oscillated from a laser unit passes through the transparent substrate and is irradiated on the package lid and / or the package body, thereby irradiating the package. A method for sealing an electronic component package, wherein a lid is fixed to the package body. 11. A plating portion is provided on the package lid and on the package body that is in contact with the package lid, and the plating portion is melted by the laser light, so that the package lid and the package body are separated from each other. The method for sealing an electronic component package according to claim 10, wherein is fixed. 12. A method in which a molten metal is arranged between the package lid and the package body, and the package lid and the package body are fixed by melting the molten metal with the laser beam. The method for sealing an electronic component package according to claim 10.