TWI708407B - Manufacturing method of hermetic package - Google Patents
Manufacturing method of hermetic package Download PDFInfo
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- TWI708407B TWI708407B TW107108227A TW107108227A TWI708407B TW I708407 B TWI708407 B TW I708407B TW 107108227 A TW107108227 A TW 107108227A TW 107108227 A TW107108227 A TW 107108227A TW I708407 B TWI708407 B TW I708407B
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- container
- transparent substrate
- glass cover
- glass
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000011521 glass Substances 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000003566 sealing material Substances 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000001678 irradiating effect Effects 0.000 abstract description 12
- 239000000843 powder Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical class [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Abstract
本發明提供一種氣密封裝之製造方法,其可於使玻璃蓋及容器確實地密接於封接材料之狀態下藉由照射雷射光而將玻璃蓋及容器進行接合,從而可提高氣密性。 The present invention provides a method for manufacturing an airtight package, which can join the glass cover and the container by irradiating the laser light in a state where the glass cover and the container are firmly sealed to the sealing material, thereby improving the airtightness.
本發明之氣密封裝之製造方法之特徵在於:其係製造使用玻璃蓋5將容器3A~3C密封之氣密封裝之方法,且具備如下步驟:準備用以使玻璃蓋5密接之透明基板7;於在容器3A~3C與玻璃蓋5之間配置有封接材料4A之狀態下,藉由柱塞12(施力構件)對容器3A~3C施力而使玻璃蓋5密接於透明基板7;及於使玻璃蓋5密接於透明基板7之狀態下自透明基板7側向封接材料4A照射雷射光L,而藉由封接材料4A將容器3A~3C與玻璃蓋5接合。 The method for manufacturing the hermetic package of the present invention is characterized in that it is a method of manufacturing the hermetic package in which the containers 3A to 3C are sealed with a glass lid 5, and includes the following steps: preparing a transparent substrate 7 for tightly contacting the glass lid 5 ; In the state where the sealing material 4A is arranged between the container 3A~3C and the glass cover 5, the plunger 12 (forcing member) applies force to the container 3A~3C so that the glass cover 5 is in close contact with the transparent substrate 7 And in the state where the glass cover 5 is in close contact with the transparent substrate 7 from the transparent substrate 7 side to the sealing material 4A, laser light L is irradiated, and the containers 3A to 3C and the glass cover 5 are joined by the sealing material 4A.
Description
本發明係關於一種氣密封裝之製造方法。The present invention relates to a method for manufacturing an airtight package.
先前,為了搭載LED等元件並進行密封等,而使用有氣密封裝。此種氣密封裝係藉由將能夠配置元件等之容器、與用以密封容器之罩蓋構件接合而構成。研究有藉由將元件等密封於氣密封裝,而抑制水分等接觸元件等,提高可靠性。 於下述專利文獻1中揭示有一種氣密封裝,其係經由封接材料將由玻璃陶瓷構成之容器與玻璃蓋接合而成。於專利文獻1中,作為上述封接材料,使用包含低熔點玻璃之玻璃料。又,於專利文獻1中,藉由焙燒上述封接材料使之軟化,而將由玻璃陶瓷構成之容器與玻璃蓋接合。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2014-236202號公報Previously, in order to mount and seal components such as LEDs, airtight packages were used. Such an airtight device is formed by joining a container capable of arranging components and the like with a cover member for sealing the container. It has been studied to improve reliability by sealing components and the like in an airtight package to suppress contact with components such as moisture. Patent Document 1 below discloses an airtight package in which a container made of glass ceramic and a glass lid are joined via a sealing material. In Patent Document 1, as the above-mentioned sealing material, a glass frit containing low melting point glass is used. In addition, in Patent Document 1, by firing the above-mentioned sealing material to soften it, a container made of glass ceramic and a glass lid are joined. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2014-236202
[發明所欲解決之問題] 於搭載耐熱性較低之元件之情形時,若如專利文獻1般焙燒玻璃料使之軟化,則有因焙燒時之加熱而導致元件特性熱劣化之虞。作為解決該問題之方法,而考慮藉由向玻璃料照射雷射光局部地進行加熱而軟化玻璃料之方法。 然而,由於容器之形狀實際上存在不均,故而於照射雷射光時,難以成為使玻璃蓋及容器確實地密接於封接材料之狀態。因此,存在無法充分地提高封裝之氣密性之情況。 本發明之目的在於提供一種氣密封裝之製造方法,其可於使玻璃蓋及容器確實地密接於封接材料之狀態下藉由照射雷射光而將玻璃蓋及容器進行接合,從而可提高氣密性。 [解決問題之技術手段] 本發明之氣密封裝之製造方法之特徵在於:其係製造使用玻璃蓋將容器密封之氣密封裝之方法,且具備如下步驟:準備用以使玻璃蓋密接之透明基板;於在容器與玻璃蓋之間配置有封接材料之狀態下,藉由施力構件對容器施力而使玻璃蓋密接於透明基板;及於使玻璃蓋密接於透明基板之狀態下自透明基板側向封接材料照射雷射光,從而藉由封接材料將容器與玻璃蓋進行接合。 亦可為,本發明係製造複數個氣密封裝之方法,藉由針對複數個容器之各者而設置之複數個施力構件對容器之各者獨立地進行施力,而使複數個玻璃蓋密接於透明基板。 於本發明中,較佳為藉由對容器之底部之大致中央部施力,而對容器之底部以能夠傾斜之狀態進行施力,從而使玻璃蓋密接於透明基板。 於本發明中,亦可為,於容器之底部與施力構件之間設置承受構件,藉由利用施力構件對承受構件施力而對容器施力。較佳為,以與容器之底部相接之承受構件之第1面和底部密接之方式形成。較佳為,於承受構件之施力構件側之第2面形成有凹部,藉由使施力構件接觸於凹部並施力,而以底部能夠傾斜之狀態對承受構件及容器施力,使玻璃蓋密接於透明基板。 於本發明中,亦可為,施力構件具有棒狀部、及連接於棒狀部之彈簧構件。 [發明之效果] 根據本發明,可提供一種氣密封裝之製造方法,其可於使玻璃蓋及容器確實地密接於封接材料之狀態下藉由照射雷射光而將玻璃蓋及容器進行接合,從而可提高氣密性。[Problem to be Solved by the Invention] When a device with low heat resistance is mounted, if the glass frit is fired as in Patent Document 1 to soften it, the heating during firing may cause thermal degradation of the device characteristics. As a solution to this problem, a method of softening the glass frit by irradiating the glass frit with laser light and locally heating is considered. However, since the shape of the container is actually uneven, it is difficult to ensure that the glass lid and the container are in a state in which the sealing material is securely sealed when irradiating laser light. Therefore, there are cases where the airtightness of the package cannot be sufficiently improved. The object of the present invention is to provide a method for manufacturing an airtight package, which can join the glass cover and the container by irradiating the laser light in a state where the glass cover and the container are firmly attached to the sealing material, thereby improving the gas Tightness. [Technical Means to Solve the Problem] The manufacturing method of the hermetic package of the present invention is characterized in that it is a method of manufacturing the hermetic package in which the container is sealed with a glass lid, and has the following steps: prepare the transparent glass lid to be sealed tightly Substrate; In the state where the sealing material is arranged between the container and the glass lid, the urging member applies force to the container to make the glass lid adhere to the transparent substrate; and in the state that the glass lid adheres to the transparent substrate The transparent substrate irradiates the sealing material with laser light so that the container and the glass cover are joined by the sealing material. Alternatively, the present invention is a method of manufacturing a plurality of airtight packages, and a plurality of force applying members are provided for each of the plurality of containers to independently force each of the containers to make a plurality of glass lids Adhere to the transparent substrate. In the present invention, it is preferable to apply a force to the substantially central portion of the bottom of the container, and to force the bottom of the container in a state where it can be tilted, so that the glass cover is in close contact with the transparent substrate. In the present invention, it is also possible to provide a receiving member between the bottom of the container and the force applying member, and force the container by applying force to the receiving member by the force applying member. Preferably, it is formed in such a manner that the first surface of the receiving member in contact with the bottom of the container and the bottom are in close contact. Preferably, a concave portion is formed on the second surface of the urging member side of the receiving member. By contacting the urging member to the concave portion and applying force, the receiving member and the container are urged in a state where the bottom can be inclined to make the glass The cover is in close contact with the transparent substrate. In the present invention, the urging member may have a rod-shaped portion and a spring member connected to the rod-shaped portion. [Effects of the Invention] According to the present invention, it is possible to provide a method for manufacturing a hermetic package, which can join the glass cover and the container by irradiating the laser light in a state where the glass cover and the container are firmly sealed to the sealing material , Which can improve air tightness.
以下,對較佳之實施形態進行說明。但,以下實施形態僅為例示,本發明並不限於以下實施形態。又,於各圖式中,存在具有實質上相同之功能之構件參照相同之元件符號的情況。 (氣密封裝) 圖1係本發明之一實施形態之氣密封裝之模式性前視剖視圖。如圖1所示般,氣密封裝1具備容器3及將容器3密封之玻璃蓋5。容器3具有底部3a及配置於底部3a上之框狀之側壁部3b。 容器3例如由陶瓷、玻璃陶瓷等構成。作為陶瓷,例如可列舉:氧化鋁、氮化鋁、氧化鋯、富鋁紅柱石等。作為玻璃陶瓷,可列舉LTCC(Low Temperature Co-fired Ceramics,低溫共燒陶瓷)等。作為LTCC之具體例,可列舉氧化鈦或氧化鈮等無機粉末與玻璃粉末之燒結體等。底部3a及側壁部3b可一體形成。或者,容器3亦可由獨立個體之底部3a與側壁部3b形成。 玻璃蓋5之材料可使用各種玻璃。作為玻璃,例如可列舉:無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃等。 氣密封裝1具備配置於容器3之側壁部3b與玻璃蓋5之間之封接材料層4。容器3與玻璃蓋5係藉由封接材料層4而接合。 封接材料層4由包含低熔點玻璃粉末之封接材料構成。低熔點玻璃粉末可於更低溫下使封接材料軟化,而可更進一步抑制元件之熱劣化。作為低熔點玻璃粉末,例如可使用:Bi2
O3
系玻璃粉末、或SnO-P2
O5
系玻璃粉末、V2
O5
-TeO2
系玻璃粉末等。如下所述,為了於藉由照射雷射光而使封接材料軟化時提高雷射光之吸收,亦可於玻璃中包含選自CuO、Cr2
O3
、Fe2
O3
、MnO2
等之至少一種顏料。又,封接材料除上述低熔點玻璃粉末以外,亦可包含低膨脹耐火性填料、或雷射光吸收材等。作為低膨脹耐火性填料,例如可列舉:堇青石、矽鋅礦、氧化鋁、磷酸鋯系化合物、鋯英石、氧化鋯、氧化錫、石英玻璃、β-石英固溶體、β-鋰霞石、鋰輝石。又,作為雷射光吸收材,例如可列舉選自Fe、Mn、Cu等之至少一種金屬或包含該金屬之氧化物等化合物。如下所述,本實施形態之容器3與玻璃蓋5係藉由照射雷射光使封接材料軟化而形成封接材料層4。 (製造方法) (第1實施形態) 圖2(a)及(b)係用以說明第1實施形態之氣密封裝之製造方法之模式性前視剖視圖。圖3係用以說明第1實施形態之氣密封裝之製造方法之模式性俯視剖視圖。圖4(a)及(b)係用以說明第1實施形態之氣密封裝之製造方法之模式性前視剖視圖。再者,於圖4(a)中,概略地表示容器3A~3C。於圖4(b)中,概略地表示下述柱塞12。 如圖2(a)所示般準備複數個玻璃蓋5。另一方面,亦準備圖4(a)所示之複數個容器3A~3C。複數個容器3A~3C較理想為全部為相同之形狀。然而,實際上,因製造不均等,存在容器之厚度不同之情況或成為底部傾斜之狀態之情況。於本實施形態中,容器3A之底部傾斜,容器3B之厚度厚於容器3C之厚度。再者,於本說明書中,所謂容器之厚度係指沿著側壁部延伸之方向的容器之最大尺寸。 其次,如圖2(a)所示般於各玻璃蓋5上配置封接材料4A。封接材料4A配置於玻璃蓋5之與容器接合之部分。本實施形態之封接材料4A係含有雷射光吸收材之玻璃料。封接材料4A之配置例如可藉由印刷將封接材料4A與適當之有機黏合劑混合而成之漿料而進行。其次,以400℃以上且600℃以下之溫度進行焙燒。再者,封接材料4A亦可配置於容器之側壁部上。 其次,如圖2(b)所示般準備具有透明基板7之第1治具6。第1治具6具有用以對玻璃蓋5進行定位之第1治具側壁部8a。如圖3所示般,第1治具側壁部8a具有於俯視下為格子狀之形狀。第1治具側壁部8a之上述格子狀之形狀係對應於各玻璃蓋5之平面形狀之形狀。第1治具側壁部8a以於將複數個玻璃蓋5配置於透明基板7上時包圍各玻璃蓋5之方式設置。藉此,可對複數個玻璃蓋5進行定位。 返回至圖2(b),第1治具6具有用以對各容器進行定位之第2治具側壁部8b。第2治具側壁部8b與第1治具側壁部8a同樣地具有於俯視下為格子狀之形狀。進而,第1治具6具有用以固定下述第2治具之治具固定部6a。治具固定部6a以於俯視下包圍透明基板7之方式設置。再者,第1治具6只要具有透明基板7即可,第1治具6之構成並無特別限定。 其次,如圖2(b)及圖3所示般,以被第1治具側壁部8a包圍之方式將各玻璃蓋5配置於透明基板7上。其次,如圖4(a)所示般,於各玻璃蓋5之上介存封接材料4A後搭載容器3A~3C。 另一方面,如圖4(b)所示般準備第2治具9。第2治具9具有治具底部9a、以貫通治具底部9a之方式配置之複數個施力構件、及設置於治具底部9a上之第3治具側壁部9b。於本實施形態中,上述施力構件為柱塞12。 柱塞12具有本體13、自本體13突出之棒狀部14、及收容於本體13內且連接於棒狀部14之彈簧構件。棒狀部14之前端之形狀並無特別限定,於本實施形態中為大致半球狀。各柱塞12配置於圖4(a)所示之於第1治具6中與配置有容器3A~3C之位置對應之位置。再者,第2治具9係用以對容器3A~3C向玻璃蓋5側施力且對玻璃蓋5向透明基板7側施力之治具之一例,第2治具9之構成並無特別限定。 圖5(a)及(b)係用以說明第1實施形態之氣密封裝之製造方法之模式性前視剖視圖。再者,於圖5(a)及(b)中,概略地表示容器3A~3C及柱塞12。 其次,如圖5(a)所示般,以第3治具側壁部9b接於第1治具6之治具固定部6a上且各柱塞12之棒狀部14分別接於容器3A~3C之底部之方式配置第2治具9。各棒狀部14於容器3A~3C之底部所接觸之位置並無特別限定,於本實施形態中,接觸於底部之大致中央部。其次,將第1治具6與第2治具9固定。於本實施形態中,藉由螺釘將第1治具6與第2治具9固定,但上述固定方法並不限於此。 此處,於圖4(b)所示之步驟中,各柱塞12之棒狀部14中之自本體13突出之部分之長度較將第1治具6與第2治具9固定時之各本體13與容器3A~3C之距離長。藉此,如圖5(a)所示般將第1治具6與第2治具9固定時,各柱塞12之棒狀部14被容器3A~3C之底部壓入至本體13內。此時,各柱塞12之彈簧構件收縮,藉由彈簧構件之恢復力,各柱塞12對容器3A~3C向各玻璃蓋5側施力,且對各玻璃蓋5向透明基板7側施力。如此,藉由針對容器3A~3C之各者而設置之各柱塞12而對容器3A~3C之各者獨立地進行施力,從而使各玻璃蓋5密接於透明基板7。 於本實施形態中,各柱塞12之彈簧構件會根據容器3A~3C之厚度或底部之形狀進行收縮,各柱塞12對容器3A~3C施力。藉此,即便於容器3A~3C之厚度不同之情形或底部傾斜之情形時,亦可使各玻璃蓋5確實地密接於透明基板7。 此時,於各玻璃蓋5密接於透明基板7之狀態下,藉由各柱塞12對容器3A~3C向各玻璃蓋5側施力。由此,可使玻璃蓋5及容器3A~3C更確實地密接於封接材料4A。 其次,如圖5(b)所示般,於使各玻璃蓋5密接於透明基板7之狀態下自透明基板7側向封接材料4A照射雷射光L。藉此,使封接材料4A軟化,而將各玻璃蓋5與容器3A~3C進行接合。此時,形成圖1所示之封接材料層4,可獲得複數個氣密封裝。 於本實施形態中,可使容器3A~3C及各玻璃蓋5更確實地密接於封接材料4A,且藉由照射雷射光L而將容器3A~3C及各玻璃蓋5進行接合。由此,可有效地提高各氣密封裝之氣密性,可有效地提高可靠性。此外,可同時獲得複數個氣密封裝,而可提高生產性。 以下,藉由比較本實施形態與比較例,而更詳細地說明本實施形態之效果。 圖8(a)及(b)係用以說明比較例之氣密封裝之製造方法之模式性前視剖視圖。於比較例中,如圖8(a)所示般準備第2治具109。第2治具109與本實施形態之第2治具同樣地具有治具底部9a及第3治具側壁部9b,但不具有施力構件。於比較例之第2治具109中,在治具底部9a上設置有載台109c。於載台109c上設置有與本實施形態中之第1治具相同之第1治具側壁部8a及第2治具側壁部8b。 其次,於載台109c上載置側壁部上配置有封接材料4A之容器3A~3C。其次,於容器3A~3C上介存封接材料4A後分別搭載玻璃蓋5。 另一方面,準備圖8(b)所示之具有透明基板7之第1治具106。第1治具106除不具有第1治具側壁部8a及第2治具側壁部8b之方面以外,與本實施形態之第1治具同樣地構成。其次,如8(b)所示般,於藉由透明基板7按壓各玻璃蓋5之狀態下向封接材料4A照射雷射光L,藉此將容器3A~3C與各玻璃蓋5進行接合。 於比較例中,如圖8(b)所示般,容器3C之厚度較容器3B薄,故而難以使容器3C上之玻璃蓋5與透明基板7密接。由於容器3A之底部傾斜,故而於自底部側配置於載台109c上之狀態下,容器3A上之玻璃蓋5成為傾斜之狀態。因此,難以使容器3A上之玻璃蓋5與透明基板7充分地密接。由此,難以使各玻璃蓋5及容器3A、3C確實地密接於封接材料4A,而存在無法充分地提高氣密封裝之氣密性之情況。 相對於此,於本實施形態中,具有如下步驟:如圖5(a)所示般,於在容器3A~3C與各玻璃蓋5之間配置有封接材料4A之狀態下,藉由各柱塞12對容器3A~3C施力而使各玻璃蓋5密接於透明基板7。藉此,如圖5(b)所示般,可於使各玻璃蓋5及容器3A~3C確實地密接於封接材料4A之狀態下,藉由照射雷射光L而將各玻璃蓋5及容器3A~3C進行接合。由此,可獲得氣密性較高之氣密封裝。 再者,於本實施形態中,藉由對容器3A~3C之底部之大致中央部施力,而對容器3A~3C之底部以能夠傾斜狀態施力。由此,可使玻璃蓋5更進一步確實地密接於透明基板7,可使各玻璃蓋5及容器3A~3C更進一步確實地密接於封接材料4A。 於圖5(a)及(b)中,示出了藉由1個柱塞12對容器3A施力之例,但亦可藉由複數個柱塞12對容器3A施力。於該情形時,可提高施加至容器3A之底部之力在面內方向之均一性。於藉由複數個柱塞12對容器3B及容器3C施力之情形時亦相同。藉此,可使容器3A~3C及各玻璃蓋5更進一步確實地密接於封接材料4A。 柱塞12之棒狀部14之前端較佳為如本實施形態般為大致半球等曲面形狀。藉此,即便於如容器3A般底部傾斜之情形時,亦可使棒狀部14較佳地接觸於底部,而可更確實地進行施力。由此,可使玻璃蓋5及容器3A更確實地密接於封接材料4A。 第2治具9中,施力構件為具有彈簧構件之柱塞12,但施力構件並不限於此。施力構件例如可為空壓式之柱塞,或亦可為彈簧構件等。 再者,本實施形態之製造方法係製造複數個氣密封裝之方法,但本發明亦可用作製造1個氣密封裝之方法。於該情形時,與本實施形態同樣地,即便於容器3A之底部傾斜之情形等時,亦可於使玻璃蓋5及容器3A確實地密接於封接材料4A之狀態下藉由照射雷射光L而將玻璃蓋5及容器3A進行接合。由此,可獲得氣密性較高之氣密封裝。 於本實施形態中,由於具有在透明基板7上配置玻璃蓋5之步驟,故而可使玻璃蓋5更進一步確實地密接於透明基板7。由此,可於使玻璃蓋5及容器3A~3C更確實地密接於封接構件4A之狀態下藉由照射雷射光L而將玻璃蓋5及容器3A~3C進行接合。再者,亦可未必具有在透明基板7上配置玻璃蓋5之步驟。 圖6(a)及(b)係用以說明第1實施形態之變化例之氣密封裝之製造方法的模式性前視剖視圖。 於本變化例中,準備圖6(a)所示之具有複數個柱塞12之第2治具39。第2治具39除於治具底部9a上經由支持構件9c、9d設置有第1實施形態中之第2治具側壁部8b之方面以外,與第1實施形態之第2治具同樣地構成。另一方面,準備於側壁部上配置有封接構件4A之容器3A~3C。 其次,如圖6(a)所示般,以支持於第2治具側壁部8b及各柱塞12之棒狀部14之方式配置容器3A~3C。其次,於容器3A~3C上介存封接材料4A後分別搭載玻璃蓋5。此時,藉由容器3A~3C及各玻璃蓋5之重量,使得各柱塞12之彈簧構件收縮。 再者,於本變化例中,容器3A~3C上之玻璃蓋5中之容器3B上的玻璃蓋5距離治具底部9a最遠。容器3A之底部傾斜,故而容器3A及容器3A上之蓋部5傾斜配置。 另一方面,準備圖6(b)所示之具有透明基板7之第1治具36。第1治具36除不具有圖5(b)所示之第1治具側壁部8a及第2治具側壁部8b之方面以外,與第1實施形態之第1治具同樣地構成。其次,如圖6(b)所示般,藉由透明基板7對各玻璃蓋5進行按壓。此時,透明基板7首先對容器3B上之玻璃蓋5進行按壓。藉此,柱塞12之彈簧構件收縮,透明基板7及上述玻璃蓋5向柱塞12側移動。藉由該移動,使得透明基板7亦接觸於容器3A上之玻璃蓋5及容器3C上之玻璃蓋5,從而透明基板7對容器3A~3C上之各玻璃蓋5進行按壓。 藉由透明基板7對各玻璃蓋5進行按壓之力,使得各柱塞12之彈簧構件收縮,藉由彈簧構件之恢復力,對容器3A~3C向各玻璃蓋5側施力,對各玻璃蓋5向透明基板7側施力。藉此,使各玻璃蓋5密接於透明基板7。再者,容器3A上之玻璃蓋5相對於透明基板7傾斜配置,但藉由上述施力,而使得容器3A及容器3A上之玻璃蓋5以玻璃蓋5密接於透明基板7之方式進行旋轉。藉此,容器3A上之玻璃蓋5亦密接於透明基板7。 其次,藉由於使各玻璃蓋5密接於透明基板7之狀態下向封接材料4A照射雷射光L,而將容器3A~3C與各玻璃蓋5進行接合。 於本變化例中,亦可於使各玻璃蓋5及容器3A~3C確實地密接於封接材料4A之狀態下藉由照射雷射光L而將各玻璃蓋5及容器3A~3C進行接合。但,於如第1實施形態般具有於透明基板7上配置玻璃蓋5之步驟之情形時,可使各玻璃蓋5更容易地密接於透明基板7,而可使各玻璃蓋5及容器3A~3C更容易地密接於封接材料4A。 (第2實施形態) 圖7(a)及(b)係用以說明第2實施形態之氣密封裝之製造方法之模式性前視剖視圖。於本實施形態之製造方法中,在圖4(b)所示之步驟之前進行與第1實施形態相同之步驟。 其次,如圖7(a)所示般,於容器3A~3C之底部分別配置各承受構件25。各承受構件25具有位於容器3A~3C側之第1面25a、及與第1面25a對向之第2面25b。各第1面25a以分別密接於容器3A~3C之底部之方式設置。 於各承受構件25之第2面25b分別設置有凹部25c。各凹部25c分別設置於在對容器3A~3C施力時各柱塞12之棒狀部14所接觸之位置。凹部25c之形狀並無特別限定,於本實施形態中,為與棒狀部14之前端之形狀對應之形狀。更具體而言,凹部25c之形狀為大致半球狀。 其次,如圖7(b)所示般,以第3治具側壁部9b接於第1治具6之治具固定部6a上,且各柱塞12之棒狀部14分別接觸於各承受構件25之凹部25c之方式配置第2治具9。其次,將第1治具6與第2治具9固定。藉此,藉由使各柱塞12接觸於各承受構件25之凹部25c並進行施力,而以底部能夠傾斜之狀態對各承受構件25及容器3A~3C施力,從而使玻璃蓋5密接於透明基板7。 於本實施形態中,於容器3A~3C之底部與各柱塞12之間設置各承受構件25,藉由對各承受構件25施力而對容器3A~3C進行施力,故而可使施加至容器3A~3C之底部之力分散。再者,由於各承受構件25之第1面25a密接於容器3A~3C之底部,故而可有效地使施加至底部之力分散。由此,容器3A~3C不易破損。 由於承受構件25之凹部25c之形狀為與柱塞12之棒狀部14之前端之形狀對應之形狀,故而可使棒狀部14與承受構件25之接觸面積變大。藉此,於對容器3A~3C施力時,可更進一步確實地成為底部能夠傾斜之狀態。進而,可更進一步分散施加至容器3A~3C之底部之力。再者,承受構件25亦可不設置凹部25c。於該情形時,亦可藉由各柱塞12而使施加至容器3A~3C之底部之力分散。 其次,於使各玻璃蓋5密接於透明基板7之狀態下自透明基板7側照射雷射光L。 於本實施形態中,亦可於使各玻璃蓋5及容器3A~3C確實地密接於封接材料4A之狀態下藉由照射雷射光L而將各玻璃蓋5及容器3A~3C進行接合。由此,可獲得氣密性較高之氣密封裝。Hereinafter, preferred embodiments will be described. However, the following embodiments are only examples, and the present invention is not limited to the following embodiments. In addition, in each drawing, there are cases where members having substantially the same function refer to the same symbol. (Hermetically sealed device) Fig. 1 is a schematic front sectional view of an airtight device according to an embodiment of the present invention. As shown in FIG. 1, the hermetic package 1 includes a
1‧‧‧氣密封裝3‧‧‧容器3a‧‧‧底部3A‧‧‧容器3b‧‧‧側壁部3B‧‧‧容器3C‧‧‧容器4‧‧‧封接材料層4A‧‧‧封接材料5‧‧‧玻璃蓋6‧‧‧第1治具6a‧‧‧治具固定部7‧‧‧透明基板8a‧‧‧第1治具側壁部8b‧‧‧第2治具側壁部9‧‧‧第2治具9a‧‧‧治具底部9b‧‧‧第3治具側壁部9c、9d‧‧‧支持構件12‧‧‧柱塞13‧‧‧本體14‧‧‧棒狀部25‧‧‧承受構件25a‧‧‧第1面25b‧‧‧第2面25c‧‧‧凹部36‧‧‧第1治具39‧‧‧第2治具106‧‧‧第1治具109‧‧‧第2治具109c‧‧‧載台L‧‧‧雷射光1‧‧‧Air-sealed
圖1係本發明之一實施形態之氣密封裝之模式性前視剖視圖。 圖2(a)及(b)係用以說明第1實施形態之氣密封裝之製造方法的模式性前視剖視圖。 圖3係用以說明本發明之第1實施形態之氣密封裝之製造方法的模式性俯視剖視圖。 圖4(a)及(b)係用以說明本發明之第1實施形態之氣密封裝之製造方法的模式性前視剖視圖。 圖5(a)及(b)係用以說明本發明之第1實施形態之氣密封裝之製造方法的模式性前視剖視圖。 圖6(a)及(b)係用以說明第1實施形態之變化例之氣密封裝之製造方法的模式性前視剖視圖。 圖7(a)及(b)係用以說明本發明之第2實施形態之氣密封裝之製造方法的模式性前視剖視圖。 圖8(a)及(b)係用以說明比較例之氣密封裝之製造方法的模式性前視剖視圖。Fig. 1 is a schematic front cross-sectional view of an airtight device according to an embodiment of the present invention. 2(a) and (b) are schematic front cross-sectional views for explaining the manufacturing method of the hermetic package of the first embodiment. Fig. 3 is a schematic plan cross-sectional view for explaining the manufacturing method of the hermetic package according to the first embodiment of the present invention. 4(a) and (b) are schematic front cross-sectional views for explaining the manufacturing method of the hermetic package according to the first embodiment of the present invention. 5(a) and (b) are schematic front cross-sectional views for explaining the manufacturing method of the hermetic package according to the first embodiment of the present invention. Fig. 6 (a) and (b) are schematic front cross-sectional views for explaining the method of manufacturing the hermetic package according to the modification of the first embodiment. 7(a) and (b) are schematic front cross-sectional views for explaining the manufacturing method of the hermetic package according to the second embodiment of the present invention. 8(a) and (b) are schematic front cross-sectional views for explaining the manufacturing method of the hermetic package of the comparative example.
3A:容器 3A: Container
3B:容器 3B: Container
3C:容器 3C: Container
4A:封接材料 4A: Sealing material
5:玻璃蓋 5: Glass cover
6:第1治具 6: The first fixture
6a:治具固定部 6a: Fixture part
7:透明基板 7: Transparent substrate
8a:第1治具側壁部 8a: The side wall of the first jig
8b:第2治具側壁部 8b: The side wall of the second jig
9:第2治具 9: The second fixture
9a:治具底部 9a: bottom of fixture
9b:第3治具側壁部 9b: The side wall of the third jig
12:柱塞 12: Plunger
13:本體 13: body
14:棒狀部 14: Rod
L:雷射光 L: Laser light
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JP2017-105563 | 2017-05-29 |
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