CN110603235B - Method for manufacturing hermetic package - Google Patents
Method for manufacturing hermetic package Download PDFInfo
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- CN110603235B CN110603235B CN201880029501.9A CN201880029501A CN110603235B CN 110603235 B CN110603235 B CN 110603235B CN 201880029501 A CN201880029501 A CN 201880029501A CN 110603235 B CN110603235 B CN 110603235B
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- glass
- container
- containers
- transparent substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 129
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000003566 sealing material Substances 0.000 claims abstract description 45
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 238000005304 joining Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Inorganic materials O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- -1 zirconium phosphate compound Chemical class 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a method for manufacturing an airtight package, which can bond a glass cover and a container by laser irradiation under the condition that the glass cover and the container are reliably sealed on a sealing material, and can improve the airtightness. The method is used for manufacturing an airtight package in which containers (3A-3C) are sealed with a glass lid (5), and is characterized by comprising: a step for preparing a transparent substrate (7) for bonding with the glass cover (5); a step in which the glass cover (5) and the transparent substrate (7) are brought into intimate contact by urging the containers (3A-3C) with a plunger (12) (urging member) in a state in which the intimate contact material (4A) is disposed between the containers (3A-3C) and the glass cover (5); and a step of irradiating the sealing material (4A) with a laser beam (L) from the transparent substrate (7) side in a state where the glass lid (5) and the transparent substrate (7) are in close contact with each other, and joining the containers (3A-3C) and the glass lid (5) by the sealing material (4A).
Description
Technical Field
The present invention relates to a method for manufacturing a hermetic package.
Background
Conventionally, an airtight package is used to mount and seal an element such as an LED. Such an airtight package is configured by joining a container in which an element or the like can be arranged and a lid member for sealing the container. A method of sealing an element or the like in an airtight package to suppress contact of moisture or the like with the element or the like and improve reliability has been studied.
Patent document 1 discloses an airtight package in which a container made of glass ceramic and a glass lid are joined together with a sealing material. In patent document 1, a frit made of a low-melting glass is used as the adhesion material. In patent document 1, the adhesion material is fired to soften the adhesion material, and a container made of glass ceramics and a glass lid are joined together.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2014-
Disclosure of Invention
Technical problems to be solved by the invention
When a device having low heat resistance is mounted, when the glass frit is fired and softened as in patent document 1, the device characteristics may be thermally deteriorated by heating during firing. As a method for solving this problem, a method of irradiating a glass frit with a laser beam and locally heating the glass frit to soften the glass frit is conceivable.
However, since the shape of the container is not uniform in practice, it is difficult to bring the glass lid and the container into a state of reliably adhering to the sealing material when the container is irradiated with the laser beam. Therefore, the airtightness of the package may not be sufficiently improved.
The invention aims to: provided is a method for manufacturing an airtight package, wherein a glass lid and a container can be joined to each other by laser irradiation in a state in which the glass lid and the container are reliably sealed to a sealing material, and the airtightness can be improved.
Technical solution for solving technical problem
A method for manufacturing a hermetic package according to the present invention is a method for manufacturing a hermetic package in which a container is sealed with a glass lid, the method including: preparing a transparent substrate for bonding the glass cover; a step of forcing the container by a forcing member to make the glass cover and the transparent substrate closely contact with each other in a state that the sealing material is arranged between the container and the glass cover; and a step of irradiating the sealing material with laser light from the transparent substrate side in a state where the glass lid is in close contact with the transparent substrate, and joining the container and the glass lid with the sealing material.
In the present invention, the method is used for manufacturing a plurality of hermetic packages, and the plurality of glass covers and the transparent substrate can be brought into close contact with each other by independently biasing each of the plurality of containers by a plurality of biasing members provided corresponding to each of the plurality of containers.
In the present invention, it is preferable that the glass lid is brought into close contact with the transparent substrate by biasing the substantially central portion of the bottom of the container so that the bottom of the container can be tilted.
In the present invention, a force bearing member may be provided between the bottom of the container and the urging member, and the force bearing member may be urged by the urging member to urge the container. Preferably, the first surface of the force-bearing member that contacts the bottom of the container is formed to be in close contact with the bottom. Preferably, a concave portion is formed on the second surface of the force-applying member on the side of the force-applying member, and the force-applying member is brought into contact with the concave portion to apply a force to the force-applying member and the container in a state in which the bottom portion is tiltable, thereby bringing the glass lid into close contact with the transparent substrate.
In the present invention, the urging member may have a rod-shaped portion and a spring member connected to the rod-shaped portion.
Effects of the invention
The present invention can provide a method for manufacturing an airtight package, in which a glass lid and a container can be joined to each other by laser irradiation in a state where the glass lid and the container are reliably sealed to a sealing material, and airtightness can be improved.
Drawings
Fig. 1 is a schematic front sectional view of a hermetic package of one embodiment of the present invention.
Fig. 2(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the first embodiment.
Fig. 3 is a schematic cross-sectional plan view for explaining a method of manufacturing the hermetic package according to the first embodiment of the present invention.
Fig. 4(a) and (b) are schematic front cross-sectional views for explaining a method of manufacturing the hermetic package according to the first embodiment of the present invention.
Fig. 5(a) and (b) are schematic front cross-sectional views for explaining a method of manufacturing the hermetic package according to the first embodiment of the present invention.
Fig. 6(a) and (b) are schematic front cross-sectional views for explaining a method of manufacturing the hermetic package according to the modification of the first embodiment.
Fig. 7(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package according to the second embodiment of the present invention.
Fig. 8(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the comparative example.
Detailed Description
Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. In addition, in each drawing, components having substantially the same function may be referred to by the same reference numerals.
(Airtight Package)
Fig. 1 is a schematic front sectional view of a hermetic package of one embodiment of the present invention. As shown in fig. 1, the hermetic package 1 has a container 3 and a glass lid 5 for sealing the container 3. The container 3 has a bottom portion 3a and a frame-shaped sidewall portion 3b disposed on the bottom portion 3 a.
The container 3 is made of, for example, ceramic, glass ceramic, or the like. Examples of the ceramics include alumina, aluminum nitride, zirconia, mullite, and the like. Examples of the glass Ceramics include LTCC (Low Temperature cofired Ceramics: Low Temperature Co-fired Ceramics) and the like. Specific examples of LTCC include sintered bodies of inorganic powders such as titanium oxide and niobium oxide and glass powders. The bottom portion 3a and the side wall portion 3b may be integrally formed. Alternatively, the container 3 may be formed of a bottom portion 3a and a side wall portion 3b which are separate bodies.
Various glasses can be used as the material of the glass cover 5. Examples of the glass include alkali-free glass, borosilicate glass, and soda-lime glass.
The hermetic package 1 includes a sealing material layer 4 disposed between a side wall portion 3b of the container 3 and the glass lid 5. The container 3 and the glass lid 5 are joined by a layer 4 of sealing material.
The sealing material layer 4 is formed of a sealing material containing a low melting point glass powder. The low-melting glass powder can soften the sealing material at a relatively low temperature and can further suppress thermal deterioration of the element. As the low melting point glass powder, for example, Bi can be used2O3Glass powder, SnO-P2O5Glass powder, V2O5-TeO2Glass powder, etc. When the sealing material is softened by irradiation with laser light as described below, the glass may contain one or more elements selected from CuO and Cr in order to enhance absorption of the laser light2O3、Fe2O3、MnO2Etc. of at least 1 pigment. The sealing material may contain a low-expansion refractory filler, a laser absorbing material, and the like in addition to the low-melting glass powder. Examples of the low-expansion refractory filler include cordierite, willemite, alumina, a zirconium phosphate compound, zircon, zirconia, tin oxide, quartz glass, a β -quartz solid solution, β -eucryptite, and spodumene. Examples of the laser absorbing material include at least 1 metal selected from Fe, Mn, Cu, and the like, and compounds such as oxides containing the metal. The container 3 and the glass lid 5 of the present embodiment are formed with the sealing material layer 4 by softening the sealing material by irradiation with laser light as described below.
(production method)
(first embodiment)
Fig. 2(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the first embodiment. Fig. 3 is a schematic top cross-sectional view for explaining a method of manufacturing the hermetic package according to the first embodiment. Fig. 4(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the first embodiment. In fig. 4(a), the containers 3A to 3C are shown in a schematic view. Fig. 4(b) schematically shows a plunger 12 to be described later.
As shown in fig. 2(a), a plurality of glass covers 5 are prepared. On the other hand, a plurality of containers 3A to 3C shown in fig. 4(a) are also prepared. It is desirable that all of the plurality of containers 3A to 3C have the same shape. However, in practice, the thickness of the container may vary or the bottom may be inclined due to manufacturing variations or the like. In the present embodiment, the bottom of the container 3A is inclined, and the thickness of the container 3B is larger than that of the container 3C. In the present specification, the thickness of the container means the maximum dimension of the container along the direction in which the side wall portion extends.
Next, as shown in fig. 2(a), a sealing material 4A is disposed on each glass lid 5. The sealing material 4A is disposed in a portion of the glass lid 5 to be bonded to the container. The sealing material 4A of the present embodiment is a frit containing a laser absorbing material. The sealing material 4A can be disposed by, for example, printing a paste obtained by mixing the sealing material 4A and a suitable organic binder. Then, the firing is performed at a temperature of 400 ℃ to 600 ℃. The sealing material 4A may be disposed on the side wall of the container.
Next, as shown in fig. 2(b), the first jig 6 having the transparent substrate 7 is prepared. The first jig 6 has a first jig side wall portion 8a for positioning the glass cover 5. As shown in fig. 3, the first jig side wall portion 8a has a lattice shape in plan view. The lattice-like shape of the first jig side wall portion 8a corresponds to the shape of each glass cover 5 in a plan view. When the plurality of glass covers 5 are disposed on the transparent substrate 7, the first jig side wall portion 8a is provided so as to surround each glass cover 5. This enables positioning of the plurality of glass covers 5.
Returning to fig. 2(b), the first jig 6 has a second jig side wall portion 8b for positioning each container. The second jig side wall portion 8b has a lattice shape in plan view, similarly to the first jig side wall portion 8 a. The first jig 6 has a jig fixing portion 6a for fixing a second jig, which will be described later. The jig fixing portion 6a is provided so as to surround the transparent substrate 7 in a plan view. The first jig 6 may have the transparent substrate 7, and the configuration of the first jig 6 is not particularly limited.
Next, as shown in fig. 2(b) and 3, each glass cover 5 is disposed on the transparent substrate 7 so as to be surrounded by the first chuck side wall portion 8 a. Next, as shown in fig. 4(a), the containers 3A to 3C are placed on the respective glass lids 5 with the sealing material 4A interposed therebetween.
On the other hand, as shown in fig. 4(b), a second jig 9 is prepared. The second jig 9 has a jig bottom portion 9a, a plurality of biasing members disposed so as to penetrate the jig bottom portion 9a, and a third jig side wall portion 9b provided on the jig bottom portion 9 a. In the present embodiment, the urging member is the plunger 12.
The plunger 12 includes a body 13, a rod 14 protruding from the body 13, and a spring member housed in the body 13 and connected to the rod 14. The shape of the tip of the rod-shaped portion 14 is not particularly limited, and is substantially hemispherical in the present embodiment. Each plunger 12 is disposed at a position corresponding to the position where the containers 3A to 3C are disposed in the first jig 6 shown in fig. 4 (a). The second jig 9 is an example of a jig for pushing the containers 3A to 3C toward the glass cover 5 and pushing the glass cover 5 toward the transparent substrate 7, and the configuration of the second jig 9 is not particularly limited.
Fig. 5(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the first embodiment. In fig. 5(a) and (b), the containers 3A to 3C and the plunger 12 are schematically shown.
Next, as shown in fig. 5(a), the second jig 9 is disposed so that the third jig side wall portion 9b is in contact with the jig fixing portion 6a of the first jig 6 at the jig fixing portion 6a, and the rod-shaped portions 14 of the plungers 12 are in contact with the bottoms of the containers 3A to 3C, respectively. The position of the bottom of the containers 3A to 3C with which each rod-shaped portion 14 contacts is not particularly limited, and in the present embodiment, the bottom contacts the substantially central portion of the bottom. Next, the first jig 6 and the second jig 9 are fixed. In the present embodiment, the first jig 6 and the second jig 9 are fixed by screws, but the fixing method is not limited to this.
In the step shown in fig. 4(b), the length of the portion of the rod-shaped portion 14 of each plunger 12 protruding from the body 13 is longer than the distance between each body 13 and the containers 3A to 3C when the first jig 6 and the second jig 9 are fixed. Thus, when the first jig 6 and the second jig 9 are fixed as shown in fig. 5(a), the rod-shaped portion 14 of each plunger 12 is pushed into the body 13 by the bottom of the containers 3A to 3C. At this time, the spring member of each plunger 12 contracts, and the plungers 12 push the containers 3A to 3C toward the glass covers 5 and the glass covers 5 toward the transparent substrate 7 by the restoring force of the spring member. In this way, the respective containers 3A to 3C are independently biased by the respective plungers 12 provided corresponding to the respective containers 3A to 3C, and the respective glass covers 5 are brought into close contact with the transparent substrate 7.
In the present embodiment, the spring member of each plunger 12 contracts according to the thickness or the shape of the bottom of the containers 3A to 3C, and each plunger 12 biases the containers 3A to 3C. Thus, even when the containers 3A to 3C have different thicknesses or the bottom portions thereof are inclined, the glass covers 5 can be reliably brought into close contact with the transparent substrate 7.
At this time, the containers 3A to 3C are pushed toward the glass caps 5 by the plungers 12 in a state where the glass caps 5 are in close contact with the transparent substrate 7. Therefore, the glass lid 5 and the containers 3A to 3C can be more reliably adhered to the sealing member 4A.
Next, as shown in fig. 5(b), the sealing material 4A is irradiated with the laser light L from the transparent substrate 7 side in a state where each glass lid 5 is brought into close contact with the transparent substrate 7. This softens the sealing material 4A and bonds the glass lid 5 to the containers 3A to 3C. In this case, the sealing material layer 4 shown in fig. 1 can be formed to obtain a plurality of airtight packages.
In the present embodiment, the containers 3A to 3C and the glass lids 5 can be more reliably adhered to the sealing material 4A, and the containers 3A to 3C and the glass lids 5 can be joined by irradiation with the laser light L. Therefore, the airtightness of each airtight package can be effectively improved, and the reliability can be effectively improved. Further, a plurality of airtight packages can be obtained at the same time, and productivity can be improved.
Hereinafter, the effects of the present embodiment will be described in more detail by comparing the present embodiment with comparative examples.
Fig. 8(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the comparative example. In the comparative example, as shown in fig. 8(a), a second jig 109 was prepared. The second jig 109 has the jig bottom portion 9a and the third jig side wall portion 9b, but does not have an urging member, as in the second jig of the present embodiment. In the second jig 109 of the comparative example, a mounting table 109c is provided on the jig bottom portion 9 a. The mounting table 109c is provided with a first jig side wall portion 8a and a second jig side wall portion 8b, which are the same as those of the first embodiment.
Next, the containers 3A to 3C having the sealing material 4A disposed on the side wall portion are placed on the placing table 109C. Next, the glass lid 5 is placed on each of the containers 3A to 3C with the sealant 4A interposed therebetween.
On the other hand, a first jig 106 having a transparent substrate 7 shown in fig. 8(b) was prepared. The first jig 106 is configured in the same manner as the first jig of the present embodiment, except that the first jig side wall portion 8a and the second jig side wall portion 8b are not provided. Next, as shown in fig. 8(b), the containers 3A to 3C are joined to the respective glass lids 5 by irradiating the sealing material 4A with the laser light L in a state where the respective glass lids 5 are pressed by the transparent substrate 7.
In the comparative example, as shown in fig. 8(B), since the container 3C is thinner than the container 3B, it is difficult to bring the glass lid 5 on the container 3C into close contact with the transparent substrate 7. Since the bottom of the container 3A is inclined, the glass lid 5 on the container 3A is inclined in a state of being disposed from the bottom side on the mounting table 109 c. Therefore, it is difficult to sufficiently adhere the glass lid 5 on the container 3A to the transparent substrate 7. Therefore, it is difficult to reliably seal the glass lid 5 and the containers 3A and 3C to the sealing material 4A, and the airtightness of the airtight package may not be sufficiently improved.
In contrast, in the present embodiment, as shown in fig. 5(a), the method includes a step of urging the containers 3A to 3C by the plungers 12 in a state where the sealing member 4A is disposed between the containers 3A to 3C and the glass covers 5, and bringing the glass covers 5 into close contact with the transparent substrate 7. As a result, as shown in fig. 5(b), the glass lids 5 and the containers 3A to 3C can be joined to each other by irradiation with the laser light L while the glass lids 5 and the containers 3A to 3C are reliably bonded to the sealing material 4A. Therefore, a hermetically sealed package having high airtightness can be obtained.
In the present embodiment, the bottom portions of the containers 3A to 3C are biased in a state in which the bottom portions are inclined by biasing substantially the center portions of the bottom portions of the containers 3A to 3C. Therefore, the glass lid 5 and the transparent substrate 7 can be more reliably brought into close contact, and the glass lids 5 and the containers 3A to 3C can be more reliably brought into close contact with the sealing material 4A.
In fig. 5(a) and (b), an example in which the container 3A is biased by 1 plunger 12 is illustrated, but the container 3A may be biased by a plurality of plungers 12. In this case, the uniformity in the in-plane direction of the force applied to the bottom of the container 3A can be improved. The same applies to the case 3B and the case 3C biased by the plurality of plungers 12. This enables the containers 3A to 3C and the glass covers 5 to be more reliably sealed to the sealing material 4A.
The tip of the rod-like portion 14 of the plunger 12 is preferably formed into a curved surface shape such as a substantially hemispherical shape as in the present embodiment. Thus, even when the bottom portion is inclined as in the case of the container 3A, the rod-shaped portion 14 can be brought into contact with the bottom portion appropriately, and the biasing force can be applied more reliably. Therefore, the glass lid 5 and the container 3A can be more reliably brought into close contact with the sealing member 4A.
In the second jig 9, the urging member is the plunger 12 having a spring member, but the urging member is not limited thereto. The urging member may be, for example, a pneumatic plunger, or may be a spring member.
The manufacturing method of the present embodiment is a method of manufacturing a plurality of airtight packages, but the present invention can also be applied to a method of manufacturing 1 airtight package. At this time, as in the present embodiment, even when the bottom of the container 3A is inclined, the glass lid 5 and the container 3A can be joined to each other by irradiation of the laser beam L in a state where the glass lid 5 and the container 3A are reliably bonded to the sealing member 4A. Therefore, a hermetically sealed package having high airtightness can be obtained.
In the present embodiment, since the step of disposing the glass cover 5 on the transparent substrate 7 is included, the glass cover 5 and the transparent substrate 7 can be more reliably brought into close contact with each other. Therefore, the glass lid 5 and the containers 3A to 3C can be joined by irradiation with the laser light L in a state where the glass lid 5 and the containers 3A to 3C are more reliably in close contact with the sealing member 4A. However, the step of disposing the glass cover 5 on the transparent substrate 7 is not necessarily included.
Fig. 6(a) and (b) are schematic front cross-sectional views for explaining a method of manufacturing the hermetic package according to the modification of the first embodiment.
In the present modification, a second jig 39 having a plurality of plungers 12 shown in fig. 6(a) is prepared. The second jig 39 is configured in the same manner as the second jig of the first embodiment, except that the second jig side wall portion 8b of the first embodiment is provided on the jig bottom portion 9a via the support members 9c and 9 d. On the other hand, containers 3A to 3C having the sealing member 4A disposed on the side wall portion are prepared.
Next, as shown in fig. 6(a), the containers 3A to 3C are arranged so as to be supported by the second jig side wall portion 8b and the rod-shaped portion 14 of each plunger 12. Next, the glass lid 5 is placed on each of the containers 3A to 3C with the sealant 4A interposed therebetween. At this time, the spring members of the plungers 12 are in a contracted state due to the weight of the containers 3A to 3C and the glass covers 5.
In the present modification, among the glass lids 5 on the containers 3A to 3C, the glass lid 5 on the container 3B is farthest from the jig bottom 9 a. The container 3A and the lid 5 on the container 3A are disposed so as to be inclined due to the inclination of the bottom of the container 3A.
On the other hand, a first jig 36 having a transparent substrate 7 shown in fig. 6(b) was prepared. The first jig 36 is configured in the same manner as the first jig of the first embodiment, except that the first jig side wall portion 8a and the second jig side wall portion 8b shown in fig. 5(b) are not provided. Next, as shown in fig. 6(b), each glass cover 5 is pressed by the transparent substrate 7. At this time, the transparent substrate 7 initially presses the glass cover 5 on the container 3B. Thereby, the spring member of the plunger 12 contracts, and the transparent substrate 7 and the glass cover 5 move toward the plunger 12. Due to this movement, the transparent substrate 7 also comes into contact with the glass lid 5 on the container 3A and the glass lid 5 on the container 3C, and the transparent substrate 7 presses the glass lids 5 on the containers 3A to 3C.
The spring members of the plungers 12 are contracted by the force of the transparent substrate 7 pressing the glass covers 5, and the containers 3A to 3C are pushed toward the glass covers 5 by the restoring force of the spring members, thereby pushing the glass covers 5 toward the transparent substrate 7. Thereby, each glass lid 5 is brought into close contact with the transparent substrate 7. The glass lid 5 on the container 3A is disposed obliquely with respect to the transparent substrate 7, and the container 3A and the glass lid 5 on the container 3A are rotated by the above-described biasing so that the glass lid 5 is in close contact with the transparent substrate 7. Thereby, the glass lid 5 on the container 3A is also in close contact with the transparent substrate 7.
Next, the sealing material 4A is irradiated with the laser L in a state where the glass lids 5 are in close contact with the transparent substrate 7, and the containers 3A to 3C are joined to the glass lids 5.
In the present modification, the glass lids 5 and the containers 3A to 3C can be joined to each other by irradiation with the laser light L in a state where the glass lids 5 and the containers 3A to 3C are reliably sealed to the sealing material 4A. Of course, when the step of disposing the glass lid 5 on the transparent substrate 7 is included as in the first embodiment, the glass lids 5 and the transparent substrate 7 can be more easily brought into close contact, and the glass lids 5 and the containers 3A to 3C can be more easily brought into close contact with the sealing material 4A.
(second embodiment)
Fig. 7(a) and (b) are schematic front sectional views for explaining a method of manufacturing the hermetic package of the second embodiment. In the manufacturing method of the present embodiment, the same steps as those of the first embodiment are performed before the step shown in fig. 4 (b).
Next, as shown in fig. 7(a), the force-bearing members 25 are disposed on the bottom portions of the containers 3A to 3C, respectively. Each force-bearing member 25 has a first surface 25a on the container 3A to 3C side and a second surface 25b opposite to the first surface 25 a. The first surfaces 25a are provided to be in close contact with the bottom portions of the containers 3A to 3C, respectively.
The second surface 25b of each force bearing member 25 is provided with a recess 25 c. The concave portions 25C are provided at positions where the rod-shaped portions 14 of the plungers 12 come into contact when the containers 3A to 3C are biased. The shape of the recess 25c is not particularly limited, and in the present embodiment, corresponds to the shape of the tip of the rod 14. More specifically, the recess 25c has a substantially hemispherical shape.
Next, as shown in fig. 7(b), the second jig 9 is disposed so that the third jig side wall portion 9b contacts the jig fixing portion 6a of the first jig 6 and the rod-shaped portion 14 of each plunger 12 contacts the concave portion 25c of each force bearing member 25. Next, the first jig 6 and the second jig 9 are fixed. Thus, the plungers 12 are brought into contact with and biased against the concave portions 25C of the force bearing members 25, and the force bearing members 25 and the containers 3A to 3C are biased in a state in which the bottoms thereof can be inclined, whereby the glass lid 5 is brought into close contact with the transparent substrate 7.
In the present embodiment, since the containers 3A to 3C are biased by providing the respective force bearing members 25 between the bottoms of the containers 3A to 3C and the respective plungers 12 and biasing the respective force bearing members 25, the force applied to the bottoms of the containers 3A to 3C can be dispersed. Further, since the first surfaces 25a of the respective force bearing members 25 are in close contact with the bottom portions of the containers 3A to 3C, the force applied to the bottom portions can be effectively dispersed. Therefore, the containers 3A to 3C are not easily broken.
Since the shape of the recess 25c of the force-bearing member 25 corresponds to the shape of the tip of the rod-shaped portion 14 of the plunger 12, the contact area between the rod-shaped portion 14 and the force-bearing member 25 can be increased. This makes it possible to further reliably bring the bottom portion into a tiltable state when the containers 3A to 3C are biased. In addition, the force applied to the bottom portions of the containers 3A to 3C can be further dispersed. The force-bearing member 25 may not have the recess 25 c. At this time, the force applied to the bottom portions of the containers 3A to 3C can be dispersed by the plungers 12.
Next, the transparent substrate 7 is irradiated with the laser light L from the transparent substrate 7 side in a state where the glass covers 5 are in close contact with the transparent substrate 7.
In the present embodiment, the glass lids 5 and the containers 3A to 3C can be joined to each other by irradiation with the laser light L in a state where the glass lids 5 and the containers 3A to 3C are reliably bonded to the sealing material 4A. Therefore, a hermetically sealed package having high airtightness can be obtained.
Description of the symbols
1 … hermetic package
3. 3A-3C … container
3a … bottom
3b … side wall part
4 … sealing material layer
4A … sealing Material
5 … glass cover
6 … first clamp
6a … clamp fixing part
7 … transparent substrate
8a, 8b … first and second jig side wall parts
9 … second clamp
9a … Clamp bottom
9b … third clip side wall part
9c, 9d … support member
12 … plunger
13 … Main body
14 … Bar-shaped part
25 … force bearing part
25a, 25b … first and second surfaces
25c … concave part
36 … first clamp
39 … second clamp
106 … first clamp
109 … second clamp
109c … platform
Claims (5)
1. A method for manufacturing a plurality of hermetic packages in which a container is sealed with a glass lid, the method comprising:
preparing a transparent substrate for bonding to the glass cover;
a step of independently biasing each of the plurality of containers by a plurality of biasing members provided corresponding to the respective containers in a state where a sealing material is disposed between the container and the glass lid, to thereby bring the plurality of glass lids into close contact with the transparent substrate; and
a step of irradiating the sealing material with laser light from the transparent substrate side in a state where the plurality of glass lids are in close contact with the transparent substrate, and bonding the plurality of containers and the glass lids with the sealing material,
in the case where the containers have different thicknesses or have inclined bottoms, the glass lid and the transparent substrate are brought into close contact with each other by applying a force to substantially the center of the bottom of each of the plurality of containers so that the bottom of the container can be inclined.
2. The method of manufacturing a hermetic package according to claim 1, wherein:
and a force bearing part is arranged between the bottom of the container and the force application part, and the force application part applies force to the force bearing part, so that the container is applied with force.
3. The method of manufacturing a hermetic package according to claim 2, wherein:
the first surface of the force-bearing member that contacts the bottom of the container is formed to be in close contact with the bottom.
4. The method of manufacturing a hermetic package according to claim 2, wherein:
a concave portion is formed in a second surface of the force bearing member on the force application member side, and the force application member is brought into contact with the concave portion to apply a force to the concave portion, whereby the force bearing member and the container are applied with the bottom portion being tiltable, and the glass lid is brought into close contact with the transparent substrate.
5. The method of manufacturing a hermetic package according to any one of claims 1 to 4, wherein:
the urging member has a rod-shaped portion and a spring member connected to the rod-shaped portion.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017-105563 | 2017-05-29 | ||
JP2017105563A JP6972661B2 (en) | 2017-05-29 | 2017-05-29 | Manufacturing method of airtight package |
PCT/JP2018/006117 WO2018220909A1 (en) | 2017-05-29 | 2018-02-21 | Method for producing airtight package |
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CN110603235A CN110603235A (en) | 2019-12-20 |
CN110603235B true CN110603235B (en) | 2022-06-24 |
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CN201880029501.9A Active CN110603235B (en) | 2017-05-29 | 2018-02-21 | Method for manufacturing hermetic package |
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JP (1) | JP6972661B2 (en) |
KR (1) | KR102478227B1 (en) |
CN (1) | CN110603235B (en) |
TW (1) | TWI708407B (en) |
WO (1) | WO2018220909A1 (en) |
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JP7388112B2 (en) * | 2019-10-10 | 2023-11-29 | 日本電気硝子株式会社 | Joined body manufacturing method and joined body manufacturing apparatus |
JP7511813B2 (en) | 2020-09-29 | 2024-07-08 | 日本電気硝子株式会社 | Manufacturing method of the joint body |
JP2023005724A (en) * | 2021-06-29 | 2023-01-18 | 日本電気硝子株式会社 | Manufacturing method of assembly, and manufacturing apparatus of assembly |
JP2023005725A (en) * | 2021-06-29 | 2023-01-18 | 日本電気硝子株式会社 | Manufacturing method of assembly, and manufacturing apparatus of assembly |
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- 2018-02-21 CN CN201880029501.9A patent/CN110603235B/en active Active
- 2018-02-21 WO PCT/JP2018/006117 patent/WO2018220909A1/en active Application Filing
- 2018-03-12 TW TW107108227A patent/TWI708407B/en active
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Also Published As
Publication number | Publication date |
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TWI708407B (en) | 2020-10-21 |
JP6972661B2 (en) | 2021-11-24 |
TW201901992A (en) | 2019-01-01 |
JP2018199600A (en) | 2018-12-20 |
WO2018220909A1 (en) | 2018-12-06 |
KR20200014261A (en) | 2020-02-10 |
KR102478227B1 (en) | 2022-12-16 |
CN110603235A (en) | 2019-12-20 |
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