WO2017203795A1 - Airtight package and method for producing airtight package - Google Patents
Airtight package and method for producing airtight package Download PDFInfo
- Publication number
- WO2017203795A1 WO2017203795A1 PCT/JP2017/009641 JP2017009641W WO2017203795A1 WO 2017203795 A1 WO2017203795 A1 WO 2017203795A1 JP 2017009641 W JP2017009641 W JP 2017009641W WO 2017203795 A1 WO2017203795 A1 WO 2017203795A1
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- WO
- WIPO (PCT)
- Prior art keywords
- container
- sealing material
- side wall
- airtight package
- oxide layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000003566 sealing material Substances 0.000 claims abstract description 67
- 239000011521 glass Substances 0.000 claims abstract description 57
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 27
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 79
- 239000000758 substrate Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000005394 sealing glass Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 150000003658 tungsten compounds Chemical class 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- -1 yttrium compound Chemical class 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical class [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Definitions
- the present invention relates to an airtight package for mounting and sealing an element and a method for manufacturing the airtight package.
- an airtight package is used for mounting and sealing an element such as an LED.
- Such an airtight package is configured by joining a container in which an element can be mounted and a cover member for sealing the inside of the container.
- Patent Document 1 discloses an airtight package in which a glass ceramic substrate and a cover glass are bonded via a sealing material.
- a low-melting-point sealing glass is used as the sealing material.
- the hermetic package in Patent Document 1 is manufactured by irradiating the sealing material with a laser to soften it and bonding a glass ceramic substrate and a cover glass.
- Patent Document 2 discloses an airtight package in which a ceramic substrate made of aluminum nitride and a ceramic cap are joined by a sealing glass.
- an oxide layer is formed so as to cover the entire surface of the ceramic substrate in order to improve the wettability between the ceramic substrate and the sealing glass.
- the oxide layer is formed by subjecting a ceramic substrate to a heat treatment.
- JP 2014-236202 A Japanese Patent Laid-Open No. 10-154770
- Patent Document 1 when a glass ceramic substrate is used as a container, it is difficult to efficiently dissipate the heat generated from the element to the outside.
- An object of the present invention is to provide an airtight package that is excellent in airtightness and heat dissipation.
- An airtight package is an airtight package for mounting and sealing an element, and includes a bottom portion on which the element is mounted and a frame-like side wall portion disposed on the bottom portion, and is nitrided
- the container which is made of aluminum, is arranged on the upper part of the side wall of the container, and is disposed between the glass lid for sealing the inside of the container, the side wall of the container, and the glass lid.
- a sealing material layer, and an oxide layer of a component contained in the container is provided in at least a part of a region where the sealing material layer is disposed in a side wall portion of the container. In the bottom of the container, the oxide layer is not provided in a region where the element is mounted.
- the oxide layer includes aluminum oxide.
- the sealing material layer preferably contains bismuth glass.
- a method for manufacturing an airtight package according to the present invention is a method for manufacturing an airtight package according to the present invention, wherein at least a part of a region where the sealing material layer is disposed is provided on the side wall portion of the container.
- the step of irradiating with plasma to form the oxide layer, and in the side wall portion of the container, the glass lid is disposed via a sealing material on the portion where the oxide layer is formed, Irradiating a laser to soften the sealing material, and joining the side wall of the container and the glass lid.
- the element may be mounted on the bottom of the container before the step of forming the oxide layer.
- the wavelength of the laser may be 600 nm to 1600 nm.
- the sealing material preferably contains bismuth-based glass powder.
- an airtight package having excellent airtightness and heat dissipation can be provided.
- FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
- FIG. 3 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
- FIG. 4 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
- FIG. 5 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
- FIG. 6 is a schematic cross-sectional view for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
- FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
- FIG. 3 is a schematic cross-sectional view for explaining a
- FIG. 7 is a schematic plan view for explaining a laser irradiation method in the method for manufacturing an airtight package according to the embodiment of the present invention.
- FIG. 8 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Example 1.
- FIG. 9 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Comparative Example 1.
- FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG.
- the airtight package 1 includes a container 2, a glass lid 3, and a sealing material layer 4.
- An element 6 is mounted in the hermetic package 1 and sealed.
- the element 6 deep ultraviolet LED, MEMS, etc. can be mounted.
- the container 2 is made of aluminum nitride.
- the container 2 has a bottom 2a and a side wall 2b.
- the bottom portion 2a is a portion on which the element 6 is mounted in the container 2.
- a frame-like side wall 2b is disposed on the bottom 2a.
- a glass lid 3 is disposed on the upper surface 2b1 of the side wall 2b.
- the glass lid 3 is a member for sealing the inside of the container 2.
- a sealing material layer 4 is provided between the side wall 2b and the glass lid 3.
- the side wall 2b and the glass lid 3 are joined by the sealing material layer 4.
- the sealing material layer 4 includes bismuth glass. But in this invention, the sealing material layer 4 may contain other glass, and is not specifically limited.
- the oxide layer 5 of the component contained in the container 2 is provided in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2, while the bottom 2a of the container 2 is The oxide layer 5 is not provided in the region where the element 6 is mounted.
- the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed on the side wall 2b of the container 2, so that the hermeticity is enhanced. Further, since the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 is excellent in airtightness and heat dissipation.
- the wettability between the aluminum nitride and the glass is not sufficient, so that the bonding strength between the container 2 and the glass lid 3 is not sufficient, and the airtightness is reduced. It is difficult to raise enough.
- Bismuth-based glass softens at a very low temperature and is preferable in the case of sealing using laser irradiation.
- the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed, so that the wettability between the container 2 and the sealing glass is improved.
- the oxide layer 5 since the oxide layer 5 is provided, the bismuth-based glass is less likely to come into direct contact with aluminum nitride, so that generation of nitrogen gas can be suppressed. Therefore, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease. Therefore, the airtight package 1 is excellent in airtightness.
- the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed, but the oxide layer 5 is formed in at least a part of the region where the sealing material layer 4 is disposed. Should just be provided. However, from the viewpoint of further improving the airtightness, it is preferable that the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed as in the present embodiment.
- the oxide layer 5 may be provided on the surface of the container 2 in a portion other than the region where the element 6 is mounted. However, from the viewpoint of further improving heat dissipation, it is preferable that the oxide layer 5 is provided only in the region where the sealing material layer 4 is disposed.
- Method for manufacturing airtight package 3 to 6 are schematic cross-sectional views for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
- a container 2 having a bottom 2a and a side wall 2b is prepared.
- the upper surface 2b1 of the side wall 2b of the container 2 is irradiated with atmospheric pressure plasma, which is plasma generated under atmospheric pressure, to form the oxide layer 5 shown in FIG.
- the atmospheric pressure plasma treatment is performed such that the oxide layer 5 is formed in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2.
- the oxide layer 5 is not formed in the region where the element 6 is mounted on the bottom 2a of the container 2.
- an oxide layer can be formed only in a desired region by masking in advance a region where an oxide layer is not desired to be formed (a region where an element is mounted or the like). Note that the atmospheric pressure plasma irradiation may be performed after the element 6 is mounted.
- a sealing material is printed on the oxide layer 5 in the side wall 2 b of the container 2. Further, after printing the sealing material, the sealing material is sintered by drying and heat treatment to form the sealing material layer 4.
- the sealing material layer 4 may be formed on the glass lid 3 side, or may be formed on both the container 2 and the glass lid 3.
- the element 6 is mounted on the bottom 2 a of the container 2.
- the glass lid 3 is disposed on the portion where the sealing material layer 4 is provided on the upper surface 2 b 1 of the side wall 2 b.
- the glass lid 3 may be arranged so that at least a part thereof overlaps the portion where the sealing material layer 4 is provided in plan view. But it is preferable to arrange
- the laser light is irradiated from the laser light source to soften the sealing material layer 4 and the side wall of the container 2 2b and the glass lid 3 are joined.
- the inside of the container 2 is hermetically sealed, and the hermetic package 1 shown in FIGS. 1 and 2 is obtained.
- the laser for example, a laser having a wavelength of 600 nm to 1600 nm can be used.
- the laser irradiation method will be described in more detail with reference to FIG.
- FIG. 7 is a schematic plan view for explaining a laser irradiation method in the method for manufacturing an airtight package according to the embodiment of the present invention.
- the laser 9 is irradiated with the laser 8 from the laser light source 7. Subsequently, the laser is scanned along the direction of the arrow B and is rotated. The circulated laser irradiates to a position exceeding the starting point 9. Thereby, the container 2 is sealed.
- the end point of the laser may be a position beyond the start point 9 after the laser is circulated, or may be the same position as the start point 9.
- the region where the sealing material layer 4 is disposed is treated with the atmospheric pressure plasma in the side wall portion 2b of the container 2, and thereby the oxide layer 5 is formed.
- the bonding strength between the container 2 and the glass lid 3 is enhanced.
- the oxide layer 5 is provided, the aluminum nitride contained in the container 2 and the sealing material do not easily react with each other, so that generation of nitrogen gas can be suppressed. For this reason, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease.
- the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 obtained by the manufacturing method of this embodiment is excellent in airtightness and heat dissipation.
- the container is made of aluminum nitride.
- the container may contain an yttrium compound, a tungsten compound, or the like as a sintering aid when sintering aluminum nitride.
- the container has a bottom part and a side wall part.
- the container may be one in which the bottom and the side wall are integrally molded, or may be one in which the bottom and the side wall are separately molded and bonded together with an adhesive or the like.
- Glass lid examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ is Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na or Ka) glass, SnO—P 2 O 5 glass, TeO 2 glass or Bi 2 O 3 glass or the like can be used.
- SiO 2 —B 2 O 3 —RO R is Mg, Ca, Sr or Ba
- Sealing material layer As a sealing material for forming the sealing material layer, low melting point sealing such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, V 2 O 5 —TeO 2 glass powder, etc. It preferably contains glass. In particular, when sealing is performed by irradiating a laser, bismuth-based glass powder with a very low softening point is used for sealing glass because of the necessity of softening the sealing material by heating for a shorter time and the strength of bonding. It is more preferable to use Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like.
- Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, ⁇ -quartz solid solution, ⁇ -eucryptite, and spodumene.
- Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
- An oxide layer examples of the oxide constituting the oxide layer include aluminum oxide and the oxide of the sintering aid described above. Examples of the oxide of the sintering aid include yttrium oxide and tungsten oxide.
- the method of forming the oxide layer is not limited to the above-described method of irradiating the atmospheric pressure plasma.
- another method for forming the oxide layer for example, there is a method in which an upper portion of a side wall portion in an aluminum nitride container is irradiated with a laser and heated.
- the wavelength of the laser beam at this time is preferably 3000 nm or more, and more preferably in the range of 5000 to 11000 nm. By setting it within such a wavelength range, the upper part of the side wall portion of the aluminum nitride container can be efficiently heated.
- a light source for emitting laser light a carbon dioxide laser is preferably used.
- an oxide layer can be formed by heating the upper part of the side wall portion of the container with a laser beam having a wavelength of 1600 nm or less.
- a laser beam having a wavelength of 600 nm to 1600 nm for heating the sealing material layer can be used, it can be produced efficiently.
- Example 1 a container having a bottom part and a side wall part and made of aluminum nitride was prepared. Subsequently, the side wall portion of the container was irradiated with atmospheric pressure plasma in a nitrogen gas atmosphere for 24 hours to form an oxide layer. The output of atmospheric pressure plasma was 45 W, and the irradiation range was a range of 0.5 mm in diameter. Moreover, atmospheric pressure plasma was irradiated only to the area
- EDS energy dispersive X-ray spectrometer
- a sealing material was printed on the oxide layer on the side wall of the container. After printing, the sealing material was sintered by drying and heat treatment to form a sealing material layer.
- a sealing material a mixed powder of glass powder, low expansion refractory filler powder and laser absorber was used. The specific composition of the mixed powder is shown in Table 1 below.
- a glass lid was placed on the side wall of the container where the sealing material was provided. Then, in the state which has arrange
- Example 1 An airtight package was obtained in the same manner as in Example 1 except that the atmospheric pressure plasma was not irradiated and the oxide layer was not formed.
- FIG. 8 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Example 1.
- FIG. 9 is a stereomicrograph at a magnification of 50 ⁇ of the portion where the sealing material layer is provided in the hermetic package obtained in Comparative Example 1.
- the portion shown in white is the region where the sealing material layer is provided. 8 and 9, it can be seen that in the region where the sealing material layer is provided, many bubbles were observed in Comparative Example 1, whereas in Example 1, the generation of bubbles was suppressed. Therefore, the hermetic package of Example 1 has high hermeticity without reducing the bonding strength between the container and the glass lid. On the other hand, in the airtight package of Comparative Example 1, the bonding strength between the side wall portion of the container and the glass lid was lowered, and sufficient airtightness was not obtained.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Provided is an airtight package having excellent airtightness and heat dissipation. An airtight package 1 for sealing an element 6 which has been mounted therein, the airtight package 1 comprising: a container 2 that has a bottom section 2a on which the element 6 is mounted and frame-like sidewall sections 2b positioned on the bottom section 2a, and that is composed of aluminum nitride; a glass lid 3 that is positioned at the top of the sidewall sections 2b of the container 2, and is for sealing the inside of the container 2; and a sealing material layer 4 that is disposed between the sidewall sections 2b of the container and the glass lid 3. In the sidewall sections 2b of the container 2, at least part of the area where the sealing material layer 4 is disposed is provided with an oxide layer 5 of a component included in the container 2. In the bottom section 2a of the container 2, the oxide layer 5 is not provided to the area where the element 6 is mounted.
Description
本発明は、素子を搭載して封止するための気密パッケージ及び該気密パッケージの製造方法に関する。
The present invention relates to an airtight package for mounting and sealing an element and a method for manufacturing the airtight package.
従来、LEDなどの素子を搭載して封止するために、気密パッケージが用いられている。このような気密パッケージは、素子を搭載することができる容器と、容器内を封止するためのカバー部材が接合されることにより構成されている。
Conventionally, an airtight package is used for mounting and sealing an element such as an LED. Such an airtight package is configured by joining a container in which an element can be mounted and a cover member for sealing the inside of the container.
下記の特許文献1には、ガラスセラミックス基板と、カバーガラスとが、封着材料を介して接合されてなる気密パッケージが開示されている。特許文献1では、上記封着材料として、低融点の封着ガラスが用いられている。また、特許文献1における気密パッケージは、上記封着材料にレーザーを照射して軟化させ、ガラスセラミックス基板とカバーガラスとを接合することにより作製される。
The following Patent Document 1 discloses an airtight package in which a glass ceramic substrate and a cover glass are bonded via a sealing material. In Patent Document 1, a low-melting-point sealing glass is used as the sealing material. Further, the hermetic package in Patent Document 1 is manufactured by irradiating the sealing material with a laser to soften it and bonding a glass ceramic substrate and a cover glass.
また、下記の特許文献2には、窒化アルミニウムからなるセラミックス基板と、セラミックスキャップとが封着ガラスにより接合されてなる気密パッケージが開示されている。特許文献2では、セラミックス基板と封着ガラスの濡れ性を改善するために、セラミックス基板の表面全体を覆うように酸化物層が形成されている。上記酸化物層は、セラミックス基板に熱処理を施すことにより形成されている。
Further, Patent Document 2 below discloses an airtight package in which a ceramic substrate made of aluminum nitride and a ceramic cap are joined by a sealing glass. In Patent Document 2, an oxide layer is formed so as to cover the entire surface of the ceramic substrate in order to improve the wettability between the ceramic substrate and the sealing glass. The oxide layer is formed by subjecting a ceramic substrate to a heat treatment.
しかしながら、特許文献1のように、ガラスセラミックス基板を容器として用いる場合、素子から発生した熱を効率よく外部に放熱することが難しい。
However, as in Patent Document 1, when a glass ceramic substrate is used as a container, it is difficult to efficiently dissipate the heat generated from the element to the outside.
他方、特許文献2のようにセラミックス基板の表面全体が酸化物層によって覆われている場合、素子などから発生した熱を十分に放熱できない場合があった。
On the other hand, when the entire surface of the ceramic substrate is covered with an oxide layer as in Patent Document 2, the heat generated from the element or the like may not be sufficiently dissipated.
本発明の目的は、気密性及び放熱性に優れる、気密パッケージを提供することにある。
An object of the present invention is to provide an airtight package that is excellent in airtightness and heat dissipation.
本発明に係る気密パッケージは、素子を搭載して封止するための気密パッケージであって、前記素子が搭載される底部及び該底部上に配置された枠状の側壁部を有し、かつ窒化アルミニウムにより構成されている、容器と、前記容器の側壁部の上部に配置されており、前記容器内を封止するためのガラス蓋と、前記容器の側壁部と、前記ガラス蓋との間に配置されている、封着材料層と、を備え、前記容器の側壁部において、前記封着材料層が配置される領域の少なくとも一部に、前記容器に含まれる成分の酸化物層が設けられており、前記容器の底部において、前記素子が搭載される領域に前記酸化物層が設けられていないことを特徴としている。
An airtight package according to the present invention is an airtight package for mounting and sealing an element, and includes a bottom portion on which the element is mounted and a frame-like side wall portion disposed on the bottom portion, and is nitrided The container, which is made of aluminum, is arranged on the upper part of the side wall of the container, and is disposed between the glass lid for sealing the inside of the container, the side wall of the container, and the glass lid. A sealing material layer, and an oxide layer of a component contained in the container is provided in at least a part of a region where the sealing material layer is disposed in a side wall portion of the container. In the bottom of the container, the oxide layer is not provided in a region where the element is mounted.
本発明に係る気密パッケージは、好ましくは、前記酸化物層が、酸化アルミニウムを含む。
In the hermetic package according to the present invention, preferably, the oxide layer includes aluminum oxide.
本発明に係る気密パッケージは、好ましくは、前記封着材料層が、ビスマス系ガラスを含む。
In the hermetic package according to the present invention, the sealing material layer preferably contains bismuth glass.
本発明に係る気密パッケージの製造方法は、本発明に従って構成される気密パッケージの製造方法であって、前記容器の側壁部において、前記封着材料層が配置される領域の少なくとも一部に大気圧プラズマを照射し、前記酸化物層を形成する工程と、前記容器の前記側壁部において、前記酸化物層が形成されている部分の上に、封着材料を介して前記ガラス蓋を配置し、レーザーを照射することにより前記封着材料を軟化させ、前記容器の側壁部及び前記ガラス蓋を接合させる工程と、を備える。
A method for manufacturing an airtight package according to the present invention is a method for manufacturing an airtight package according to the present invention, wherein at least a part of a region where the sealing material layer is disposed is provided on the side wall portion of the container. The step of irradiating with plasma to form the oxide layer, and in the side wall portion of the container, the glass lid is disposed via a sealing material on the portion where the oxide layer is formed, Irradiating a laser to soften the sealing material, and joining the side wall of the container and the glass lid.
本発明に係る気密パッケージの製造方法では、前記酸化物層を形成する工程の前に、前記容器の底部に前記素子を搭載してもよい。
In the method for manufacturing an airtight package according to the present invention, the element may be mounted on the bottom of the container before the step of forming the oxide layer.
本発明に係る気密パッケージの製造方法では、前記レーザーの波長が、600nm~1600nmであってもよい。
In the method for manufacturing an airtight package according to the present invention, the wavelength of the laser may be 600 nm to 1600 nm.
本発明に係る気密パッケージの製造方法では、前記封着材料が、ビスマス系ガラス粉末を含んでいることが好ましい。
In the method for manufacturing an airtight package according to the present invention, the sealing material preferably contains bismuth-based glass powder.
本発明によれば、気密性及び放熱性に優れる、気密パッケージを提供することができる。
According to the present invention, an airtight package having excellent airtightness and heat dissipation can be provided.
以下、好ましい実施形態について説明する。但し、以下の実施形態は単なる例示であり、本発明は以下の実施形態に限定されるものではない。また、各図面において、実質的に同一の機能を有する部材は同一の符号で参照する場合がある。
Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. Moreover, in each drawing, the member which has the substantially the same function may be referred with the same code | symbol.
(気密パッケージ)
図1は、本発明の一実施形態に係る気密パッケージを示す模式的平面図である。図2は、図1のA-A線に沿う模式的断面図である。図1及び図2に示すように、気密パッケージ1は、容器2、ガラス蓋3及び封着材料層4を備える。気密パッケージ1内には、素子6が搭載され、封止されている。なお、素子6としては、深紫外線LEDや、MEMSなどを搭載することができる。 (Airtight package)
FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG. As shown in FIGS. 1 and 2, theairtight package 1 includes a container 2, a glass lid 3, and a sealing material layer 4. An element 6 is mounted in the hermetic package 1 and sealed. In addition, as the element 6, deep ultraviolet LED, MEMS, etc. can be mounted.
図1は、本発明の一実施形態に係る気密パッケージを示す模式的平面図である。図2は、図1のA-A線に沿う模式的断面図である。図1及び図2に示すように、気密パッケージ1は、容器2、ガラス蓋3及び封着材料層4を備える。気密パッケージ1内には、素子6が搭載され、封止されている。なお、素子6としては、深紫外線LEDや、MEMSなどを搭載することができる。 (Airtight package)
FIG. 1 is a schematic plan view showing an airtight package according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along the line AA in FIG. As shown in FIGS. 1 and 2, the
容器2は、窒化アルミニウムにより構成されている。容器2は、底部2a及び側壁部2bを有する。底部2aは、容器2において素子6が搭載される部分である。底部2a上に、枠状の側壁部2bが配置されている。また、側壁部2bの上面2b1上には、ガラス蓋3が配置されている。ガラス蓋3は、容器2内を封止するための部材である。なお、側壁部2bと、ガラス蓋3との間には、封着材料層4が設けられている。封着材料層4によって、側壁部2bと、ガラス蓋3とが、接合されている。なお、封着材料層4は、ビスマス系ガラスを含んでいる。もっとも、本発明において、封着材料層4は他のガラスを含んでいてもよく、特に限定されない。
The container 2 is made of aluminum nitride. The container 2 has a bottom 2a and a side wall 2b. The bottom portion 2a is a portion on which the element 6 is mounted in the container 2. A frame-like side wall 2b is disposed on the bottom 2a. A glass lid 3 is disposed on the upper surface 2b1 of the side wall 2b. The glass lid 3 is a member for sealing the inside of the container 2. A sealing material layer 4 is provided between the side wall 2b and the glass lid 3. The side wall 2b and the glass lid 3 are joined by the sealing material layer 4. The sealing material layer 4 includes bismuth glass. But in this invention, the sealing material layer 4 may contain other glass, and is not specifically limited.
本実施形態では、容器2の側壁部2bにおいて、封着材料層4が配置される領域に、容器2に含まれる成分の酸化物層5が設けられており、一方、容器2の底部2aの素子6が搭載される領域には、酸化物層5が設けられていない。
In the present embodiment, the oxide layer 5 of the component contained in the container 2 is provided in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2, while the bottom 2a of the container 2 is The oxide layer 5 is not provided in the region where the element 6 is mounted.
気密パッケージ1では、容器2の側壁部2bにおいて、封着材料層4が配置される領域に酸化物層5が設けられているので、気密性が高められている。また、容器2は、窒化アルミニウムにより構成されており、しかも素子6が搭載される領域に酸化物層5が設けられていないので、素子6から発生した熱を効率よく外部に放熱することができる。従って、気密パッケージ1は、気密性及び放熱性に優れている。
In the hermetic package 1, the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed on the side wall 2b of the container 2, so that the hermeticity is enhanced. Further, since the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 is excellent in airtightness and heat dissipation.
なお、酸化物層5を設けることにより、気密性が高められる理由については以下のようにして説明することができる。
The reason why the airtightness is improved by providing the oxide layer 5 can be explained as follows.
気密パッケージ1のように、容器2が窒化アルミニウムにより構成される場合、窒化アルミニウムとガラスとの濡れ性が十分でないことから、容器2とガラス蓋3との接合強度が十分でなく、気密性を十分に高めることが難しい。また、ビスマス系ガラスは非常に低温で軟化するため、レーザー照射を用いた封着の場合に好ましいものであるが、焼成時に容器2を構成する窒化アルミニウム表層を酸化して窒素ガスを発生させやすいという性質を有している。そのため、封着材料層4中に発泡が生じ、容器2とガラス蓋3の接合強度が低下し、気密性が低下することが考えられる。
When the container 2 is made of aluminum nitride as in the airtight package 1, the wettability between the aluminum nitride and the glass is not sufficient, so that the bonding strength between the container 2 and the glass lid 3 is not sufficient, and the airtightness is reduced. It is difficult to raise enough. Bismuth-based glass softens at a very low temperature and is preferable in the case of sealing using laser irradiation. However, it is easy to generate nitrogen gas by oxidizing the aluminum nitride surface layer constituting the container 2 during firing. It has the property of For this reason, foaming occurs in the sealing material layer 4, the bonding strength between the container 2 and the glass lid 3 is lowered, and the airtightness is lowered.
これに対して、本実施形態では、封着材料層4が配置される領域に酸化物層5が設けられているので、容器2と封着ガラスの濡れ性が改善される。また、酸化物層5が設けられることにより、ビスマス系ガラスが窒化アルミニウムと直接接触し難くなるので、窒素ガスの発生を抑制することができる。そのため、容器2とガラス蓋3との接合強度が低下し難く、気密性も低下し難い。よって、気密パッケージ1は、気密性に優れている。
On the other hand, in the present embodiment, the oxide layer 5 is provided in the region where the sealing material layer 4 is disposed, so that the wettability between the container 2 and the sealing glass is improved. In addition, since the oxide layer 5 is provided, the bismuth-based glass is less likely to come into direct contact with aluminum nitride, so that generation of nitrogen gas can be suppressed. Therefore, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease. Therefore, the airtight package 1 is excellent in airtightness.
なお、本実施形態では、封着材料層4が配置される領域の全てに酸化物層5が設けられているが、封着材料層4が配置される領域の少なくとも一部に酸化物層5が設けられていればよい。もっとも、気密性をより一層高める観点からは、本実施形態のように封着材料層4が配置される領域の全てに酸化物層5が設けられていることが好ましい。
In this embodiment, the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed, but the oxide layer 5 is formed in at least a part of the region where the sealing material layer 4 is disposed. Should just be provided. However, from the viewpoint of further improving the airtightness, it is preferable that the oxide layer 5 is provided in the entire region where the sealing material layer 4 is disposed as in the present embodiment.
また、容器2の表面において、素子6が搭載される領域以外の他の部分に酸化物層5が設けられていてもよい。もっとも、放熱性をより一層高める観点からは、封着材料層4が配置される領域のみに酸化物層5が設けられていることが好ましい。
Further, the oxide layer 5 may be provided on the surface of the container 2 in a portion other than the region where the element 6 is mounted. However, from the viewpoint of further improving heat dissipation, it is preferable that the oxide layer 5 is provided only in the region where the sealing material layer 4 is disposed.
以下、図3~図6を参照して、気密パッケージ1の製造方法について説明する。
Hereinafter, the manufacturing method of the hermetic package 1 will be described with reference to FIGS.
(気密パッケージの製造方法)
図3~図6は、本発明の一実施形態に係る気密パッケージの製造方法を説明するための模式的断面図である。 (Method for manufacturing airtight package)
3 to 6 are schematic cross-sectional views for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
図3~図6は、本発明の一実施形態に係る気密パッケージの製造方法を説明するための模式的断面図である。 (Method for manufacturing airtight package)
3 to 6 are schematic cross-sectional views for explaining a method for manufacturing an airtight package according to an embodiment of the present invention.
まず、図3に示すように、底部2a及び側壁部2bを有する容器2を用意する。
First, as shown in FIG. 3, a container 2 having a bottom 2a and a side wall 2b is prepared.
次に、容器2における側壁部2bの上面2b1に、大気圧下で発生させたプラズマである大気圧プラズマを照射し、図4に示す酸化物層5を形成する。この際、大気圧プラズマ処理は、容器2の側壁部2bにおいて、封着材料層4が配置される領域に酸化物層5が形成されるように行うものとする。また、容器2の底部2aにおいて、素子6が搭載される領域には酸化物層5が形成されないように行うものとする。例えば、酸化物層を形成したくない領域(素子が搭載される領域等)に予めマスキングすることで、所望する領域のみに酸化物層を形成することができる。なお、大気圧プラズマの照射は、素子6を搭載してから行ってもよい。
Next, the upper surface 2b1 of the side wall 2b of the container 2 is irradiated with atmospheric pressure plasma, which is plasma generated under atmospheric pressure, to form the oxide layer 5 shown in FIG. At this time, the atmospheric pressure plasma treatment is performed such that the oxide layer 5 is formed in the region where the sealing material layer 4 is disposed in the side wall 2b of the container 2. In addition, the oxide layer 5 is not formed in the region where the element 6 is mounted on the bottom 2a of the container 2. For example, an oxide layer can be formed only in a desired region by masking in advance a region where an oxide layer is not desired to be formed (a region where an element is mounted or the like). Note that the atmospheric pressure plasma irradiation may be performed after the element 6 is mounted.
次に、図5に示すように、容器2の側壁部2bにおける酸化物層5上に、封着材料を印刷する。さらに封着材料の印刷後、乾燥、熱処理して封着材料を焼結させ、封着材料層4を形成する。なお、封着材料層4は、ガラス蓋3側に形成してもよく、或いは容器2及びガラス蓋3の両方に形成してもよい。
Next, as shown in FIG. 5, a sealing material is printed on the oxide layer 5 in the side wall 2 b of the container 2. Further, after printing the sealing material, the sealing material is sintered by drying and heat treatment to form the sealing material layer 4. The sealing material layer 4 may be formed on the glass lid 3 side, or may be formed on both the container 2 and the glass lid 3.
次に、容器2の底部2a上に、素子6を搭載する。
Next, the element 6 is mounted on the bottom 2 a of the container 2.
続いて、図6に示すように、側壁部2bの上面2b1上の封着材料層4が設けられている部分に、ガラス蓋3を配置する。なお、ガラス蓋3は、平面視において、封着材料層4が設けられている部分と少なくとも一部が重なるように配置すればよい。もっとも、ガラス蓋3は、平面視において、封着材料層4が設けられている部分と完全に重なるように配置することが好ましい。
Subsequently, as shown in FIG. 6, the glass lid 3 is disposed on the portion where the sealing material layer 4 is provided on the upper surface 2 b 1 of the side wall 2 b. Note that the glass lid 3 may be arranged so that at least a part thereof overlaps the portion where the sealing material layer 4 is provided in plan view. But it is preferable to arrange | position the glass cover 3 so that it may overlap with the part in which the sealing material layer 4 is provided in planar view.
次に、側壁部2bの上面2b1上に封着材料層4を介してガラス蓋3を配置した状態で、レーザー光源からレーザーを照射し、封着材料層4を軟化させ、容器2の側壁部2b及びガラス蓋3を接合させる。それによって、容器2の内部を気密封止して、図1及び図2に示す気密パッケージ1を得る。この方法によれば、封着材料層4のみを局所的に加熱することが可能であることから、深紫外線LEDや、MEMSなどの耐熱性の低い素子を劣化させることなくパッケージを気密封止することができる。上記レーザーとしては、例えば、波長が、600nm~1600nmのレーザーを用いることができる。レーザーの照射方法については、以下、図7を参照して、より詳細に説明する。
Next, in a state where the glass lid 3 is disposed on the upper surface 2b1 of the side wall 2b via the sealing material layer 4, the laser light is irradiated from the laser light source to soften the sealing material layer 4 and the side wall of the container 2 2b and the glass lid 3 are joined. Thereby, the inside of the container 2 is hermetically sealed, and the hermetic package 1 shown in FIGS. 1 and 2 is obtained. According to this method, since only the sealing material layer 4 can be locally heated, the package is hermetically sealed without degrading a low heat resistance element such as a deep ultraviolet LED or MEMS. be able to. As the laser, for example, a laser having a wavelength of 600 nm to 1600 nm can be used. Hereinafter, the laser irradiation method will be described in more detail with reference to FIG.
図7は、本発明の一実施形態に係る気密パッケージの製造方法におけるレーザーの照射方法を説明するための模式的平面図である。
FIG. 7 is a schematic plan view for explaining a laser irradiation method in the method for manufacturing an airtight package according to the embodiment of the present invention.
レーザーの照射に際しては、まず、レーザー光源7からレーザー8を始点9に照射する。続いて、矢印Bの方向に沿ってレーザーを走査して周回させる。周回させたレーザーは、始点9を超える位置まで照射する。それによって、容器2を封止する。本実施形態のように、レーザーの終点は、レーザーを周回させた後の始点9を超える位置であってもよいし、始点9と同じ位置であってもよい。
When irradiating the laser, first, the laser 9 is irradiated with the laser 8 from the laser light source 7. Subsequently, the laser is scanned along the direction of the arrow B and is rotated. The circulated laser irradiates to a position exceeding the starting point 9. Thereby, the container 2 is sealed. As in the present embodiment, the end point of the laser may be a position beyond the start point 9 after the laser is circulated, or may be the same position as the start point 9.
本実施形態の気密パッケージ1の製造方法では、容器2の側壁部2bにおいて、封着材料層4が配置される領域が大気圧プラズマにより処理されており、それによって酸化物層5が形成されているので、容器2とガラス蓋3との接合強度が高められている。また、酸化物層5が設けられることにより、容器2に含まれる窒化アルミニウムと封着材料が反応し難くなるので、窒素ガスの発生も抑制することができる。そのため、容器2とガラス蓋3の接合強度が低下し難く、気密性も低下し難い。また、容器2は、窒化アルミニウムにより構成されており、しかも素子6が搭載される領域に酸化物層5が設けられていないので、素子6から発生した熱を効率よく外部に放熱することができる。よって、本実施形態の製造方法により得られた気密パッケージ1は、気密性及び放熱性に優れている。
In the manufacturing method of the hermetic package 1 according to the present embodiment, the region where the sealing material layer 4 is disposed is treated with the atmospheric pressure plasma in the side wall portion 2b of the container 2, and thereby the oxide layer 5 is formed. As a result, the bonding strength between the container 2 and the glass lid 3 is enhanced. Further, since the oxide layer 5 is provided, the aluminum nitride contained in the container 2 and the sealing material do not easily react with each other, so that generation of nitrogen gas can be suppressed. For this reason, the bonding strength between the container 2 and the glass lid 3 is difficult to decrease, and the airtightness is also difficult to decrease. Further, since the container 2 is made of aluminum nitride and the oxide layer 5 is not provided in the region where the element 6 is mounted, the heat generated from the element 6 can be efficiently radiated to the outside. . Therefore, the airtight package 1 obtained by the manufacturing method of this embodiment is excellent in airtightness and heat dissipation.
以下、本発明で用いられる各部材の詳細を説明する。
Hereinafter, details of each member used in the present invention will be described.
容器;
容器は、窒化アルミニウムにより構成されている。容器には、窒化アルミニウムを焼結する際の焼結助剤として、イットリウム化合物、タングステン化合物などが含まれていてもよい。 container;
The container is made of aluminum nitride. The container may contain an yttrium compound, a tungsten compound, or the like as a sintering aid when sintering aluminum nitride.
容器は、窒化アルミニウムにより構成されている。容器には、窒化アルミニウムを焼結する際の焼結助剤として、イットリウム化合物、タングステン化合物などが含まれていてもよい。 container;
The container is made of aluminum nitride. The container may contain an yttrium compound, a tungsten compound, or the like as a sintering aid when sintering aluminum nitride.
容器は、底部及び側壁部を有する。容器は、底部及び側壁部が一体成形されたものであってもよいし、底部及び側壁部がそれぞれ別々に成形されたものを接着剤などにより接合されたものであってもよい。
The container has a bottom part and a side wall part. The container may be one in which the bottom and the side wall are integrally molded, or may be one in which the bottom and the side wall are separately molded and bonded together with an adhesive or the like.
ガラス蓋;
ガラス蓋を構成するガラスとしては、例えば、SiO2-B2O3-RO(RはMg、Ca、SrまたはBa)系ガラス、SiO2-B2O3-R’2O(R’はLi、NaまたはKa)系ガラス、SiO2-B2O3-RO-R’2O(R’はLi、NaまたはKa)系ガラス、SnO-P2O5系ガラス、TeO2系ガラス又はBi2O3系ガラスなどを用いることができる。 Glass lid;
Examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ is Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na or Ka) glass, SnO—P 2 O 5 glass, TeO 2 glass or Bi 2 O 3 glass or the like can be used.
ガラス蓋を構成するガラスとしては、例えば、SiO2-B2O3-RO(RはMg、Ca、SrまたはBa)系ガラス、SiO2-B2O3-R’2O(R’はLi、NaまたはKa)系ガラス、SiO2-B2O3-RO-R’2O(R’はLi、NaまたはKa)系ガラス、SnO-P2O5系ガラス、TeO2系ガラス又はBi2O3系ガラスなどを用いることができる。 Glass lid;
Examples of the glass constituting the glass lid include SiO 2 —B 2 O 3 —RO (R is Mg, Ca, Sr or Ba) -based glass, SiO 2 —B 2 O 3 —R ′ 2 O (R ′ is Li, Na or Ka) glass, SiO 2 —B 2 O 3 —RO—R ′ 2 O (R ′ is Li, Na or Ka) glass, SnO—P 2 O 5 glass, TeO 2 glass or Bi 2 O 3 glass or the like can be used.
封着材料層;
封着材料層を形成するための封着材料としては、Bi2O3系ガラス粉末、SnO-P2O5系ガラス粉末、V2O5-TeO2系ガラス粉末等の低融点の封着ガラスを含んでいることが好ましい。特に、レーザーを照射して封着する場合、封着材料をより一層短時間の加熱で軟化させる必要性と接合強度の点から、封着ガラスには、非常に軟化点の低いビスマス系ガラス粉末を用いることがより好ましい。また、封着材料には、低膨張耐火性フィラーや、レーザー吸収材などが含まれていてもよい。低膨張耐火性フィラーとしては、例えば、コーディエライト、ウイレマイト、アルミナ、リン酸ジルコニウム系化合物、ジルコン、ジルコニア、酸化スズ、石英ガラス、β-石英固溶体、β-ユークリプタイト、スポジュメンが挙げられる。また、レーザー吸収材としては、例えば、Fe、Mn、Cuなどから選ばれる少なくとも1種の金属または該金属を含む酸化物等の化合物が挙げられる。 Sealing material layer;
As a sealing material for forming the sealing material layer, low melting point sealing such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, V 2 O 5 —TeO 2 glass powder, etc. It preferably contains glass. In particular, when sealing is performed by irradiating a laser, bismuth-based glass powder with a very low softening point is used for sealing glass because of the necessity of softening the sealing material by heating for a shorter time and the strength of bonding. It is more preferable to use Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like. Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, β-quartz solid solution, β-eucryptite, and spodumene. Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
封着材料層を形成するための封着材料としては、Bi2O3系ガラス粉末、SnO-P2O5系ガラス粉末、V2O5-TeO2系ガラス粉末等の低融点の封着ガラスを含んでいることが好ましい。特に、レーザーを照射して封着する場合、封着材料をより一層短時間の加熱で軟化させる必要性と接合強度の点から、封着ガラスには、非常に軟化点の低いビスマス系ガラス粉末を用いることがより好ましい。また、封着材料には、低膨張耐火性フィラーや、レーザー吸収材などが含まれていてもよい。低膨張耐火性フィラーとしては、例えば、コーディエライト、ウイレマイト、アルミナ、リン酸ジルコニウム系化合物、ジルコン、ジルコニア、酸化スズ、石英ガラス、β-石英固溶体、β-ユークリプタイト、スポジュメンが挙げられる。また、レーザー吸収材としては、例えば、Fe、Mn、Cuなどから選ばれる少なくとも1種の金属または該金属を含む酸化物等の化合物が挙げられる。 Sealing material layer;
As a sealing material for forming the sealing material layer, low melting point sealing such as Bi 2 O 3 glass powder, SnO—P 2 O 5 glass powder, V 2 O 5 —TeO 2 glass powder, etc. It preferably contains glass. In particular, when sealing is performed by irradiating a laser, bismuth-based glass powder with a very low softening point is used for sealing glass because of the necessity of softening the sealing material by heating for a shorter time and the strength of bonding. It is more preferable to use Further, the sealing material may contain a low expansion refractory filler, a laser absorber and the like. Examples of the low expansion refractory filler include cordierite, willemite, alumina, zirconium phosphate compounds, zircon, zirconia, tin oxide, quartz glass, β-quartz solid solution, β-eucryptite, and spodumene. Examples of the laser absorbing material include compounds such as at least one metal selected from Fe, Mn, Cu and the like or an oxide containing the metal.
酸化物層;
酸化物層を構成する酸化物としては、例えば、酸化アルミニウムや、上述した焼結助剤の酸化物が挙げられる。焼結助剤の酸化物としては、例えば、酸化イットリウムや、酸化タングステンなどが挙げられる。 An oxide layer;
Examples of the oxide constituting the oxide layer include aluminum oxide and the oxide of the sintering aid described above. Examples of the oxide of the sintering aid include yttrium oxide and tungsten oxide.
酸化物層を構成する酸化物としては、例えば、酸化アルミニウムや、上述した焼結助剤の酸化物が挙げられる。焼結助剤の酸化物としては、例えば、酸化イットリウムや、酸化タングステンなどが挙げられる。 An oxide layer;
Examples of the oxide constituting the oxide layer include aluminum oxide and the oxide of the sintering aid described above. Examples of the oxide of the sintering aid include yttrium oxide and tungsten oxide.
なお酸化物層を形成する方法は、前述した大気圧プラズマを照射する方法に限られるものではない。酸化物層を形成する別の方法として、例えば窒化アルミニウム容器における側壁部の上部にレーザーを照射し加熱する手法が挙げられる。このときのレーザー光の波長は3000nm以上であることが好ましく、5000~11000nmの範囲内であることがさらに好ましい。このような波長の範囲内とすることにより、効率良く窒化アルミニウム容器における側壁部の上部を加熱することができる。レーザー光を出射する光源としては、炭酸ガスレーザーが好ましく使用される。
Note that the method of forming the oxide layer is not limited to the above-described method of irradiating the atmospheric pressure plasma. As another method for forming the oxide layer, for example, there is a method in which an upper portion of a side wall portion in an aluminum nitride container is irradiated with a laser and heated. The wavelength of the laser beam at this time is preferably 3000 nm or more, and more preferably in the range of 5000 to 11000 nm. By setting it within such a wavelength range, the upper part of the side wall portion of the aluminum nitride container can be efficiently heated. As a light source for emitting laser light, a carbon dioxide laser is preferably used.
また、窒化アルミニウム容器が黒色顔料を含んだ状態で焼結されている場合、波長が1600nm以下のレーザー光により前記容器における側壁部の上部を加熱し酸化物層を形成することができる。この場合、封着材料層を加熱する波長600nm~1600nmのレーザー光を使用することができるため、効率良く生産することができる。
In addition, when the aluminum nitride container is sintered in a state containing a black pigment, an oxide layer can be formed by heating the upper part of the side wall portion of the container with a laser beam having a wavelength of 1600 nm or less. In this case, since a laser beam having a wavelength of 600 nm to 1600 nm for heating the sealing material layer can be used, it can be produced efficiently.
以下、本発明について、具体的な実施例に基づいて、さらに詳細に説明するが、本発明は以下の実施例に何ら限定されるものではなく、その要旨を変更しない範囲において適宜変更して実施することが可能である。
Hereinafter, the present invention will be described in more detail on the basis of specific examples. However, the present invention is not limited to the following examples, and may be appropriately modified and implemented without departing from the scope of the present invention. Is possible.
(実施例1)
まず、底部及び側壁部を有し、窒化アルミニウムにより構成されている容器を用意した。続いて、容器における側壁部に、窒素ガス雰囲気下で大気圧プラズマを24時間照射し、酸化物層を形成した。なお、大気圧プラズマの出力は45Wとし、照射範囲は直径0.5mmの範囲とした。また、大気圧プラズマは、容器の側壁部の上面において、封着材料層を形成する領域にのみ照射した。また、エネルギー分散型X線分光器(EDS)により、得られた酸化物層には、酸化アルミニウムや、容器を構成する窒化アルミニウムの焼結助剤であるイットリウムやタングステンの酸化物が含まれていることを確認した。 Example 1
First, a container having a bottom part and a side wall part and made of aluminum nitride was prepared. Subsequently, the side wall portion of the container was irradiated with atmospheric pressure plasma in a nitrogen gas atmosphere for 24 hours to form an oxide layer. The output of atmospheric pressure plasma was 45 W, and the irradiation range was a range of 0.5 mm in diameter. Moreover, atmospheric pressure plasma was irradiated only to the area | region which forms a sealing material layer in the upper surface of the side wall part of a container. Further, the oxide layer obtained by the energy dispersive X-ray spectrometer (EDS) contains aluminum oxide and oxides of yttrium and tungsten which are sintering aids of aluminum nitride constituting the container. I confirmed.
まず、底部及び側壁部を有し、窒化アルミニウムにより構成されている容器を用意した。続いて、容器における側壁部に、窒素ガス雰囲気下で大気圧プラズマを24時間照射し、酸化物層を形成した。なお、大気圧プラズマの出力は45Wとし、照射範囲は直径0.5mmの範囲とした。また、大気圧プラズマは、容器の側壁部の上面において、封着材料層を形成する領域にのみ照射した。また、エネルギー分散型X線分光器(EDS)により、得られた酸化物層には、酸化アルミニウムや、容器を構成する窒化アルミニウムの焼結助剤であるイットリウムやタングステンの酸化物が含まれていることを確認した。 Example 1
First, a container having a bottom part and a side wall part and made of aluminum nitride was prepared. Subsequently, the side wall portion of the container was irradiated with atmospheric pressure plasma in a nitrogen gas atmosphere for 24 hours to form an oxide layer. The output of atmospheric pressure plasma was 45 W, and the irradiation range was a range of 0.5 mm in diameter. Moreover, atmospheric pressure plasma was irradiated only to the area | region which forms a sealing material layer in the upper surface of the side wall part of a container. Further, the oxide layer obtained by the energy dispersive X-ray spectrometer (EDS) contains aluminum oxide and oxides of yttrium and tungsten which are sintering aids of aluminum nitride constituting the container. I confirmed.
次に、容器の側壁部における酸化物層上に、封着材料を印刷した。印刷後、乾燥、熱処理して封着材料を焼結させ、封着材料層を形成した。封着材料は、ガラス粉末、低膨張耐火性フィラー粉末及びレーザー吸収材の混合粉末を使用した。なお、混合粉末の具体的な組成を、下記の表1に示す。
Next, a sealing material was printed on the oxide layer on the side wall of the container. After printing, the sealing material was sintered by drying and heat treatment to form a sealing material layer. As a sealing material, a mixed powder of glass powder, low expansion refractory filler powder and laser absorber was used. The specific composition of the mixed powder is shown in Table 1 below.
次に、用意した容器の底部上に、素子としての深紫外線LEDを搭載した。
Next, a deep ultraviolet LED as an element was mounted on the bottom of the prepared container.
次に、容器における側壁部において、封着材料が設けられている部分に、ガラス蓋を配置した。続いて、容器における側壁部において、封着材料を介してガラス蓋を配置した状態で、レーザー光源からレーザーを照射し、封着材料を軟化させ、容器の側壁部及びガラス蓋を接合させた。それによって、容器の内部を封止し、気密パッケージを得た。
Next, a glass lid was placed on the side wall of the container where the sealing material was provided. Then, in the state which has arrange | positioned the glass cover through the sealing material in the side wall part in a container, the laser beam was irradiated from the laser light source, the sealing material was softened, and the side wall part and glass cover of the container were joined. Thereby, the inside of the container was sealed to obtain an airtight package.
(比較例1)
大気圧プラズマを照射せず、酸化物層を形成しなかったこと以外は、実施例1と同様にして気密パッケージを得た。 (Comparative Example 1)
An airtight package was obtained in the same manner as in Example 1 except that the atmospheric pressure plasma was not irradiated and the oxide layer was not formed.
大気圧プラズマを照射せず、酸化物層を形成しなかったこと以外は、実施例1と同様にして気密パッケージを得た。 (Comparative Example 1)
An airtight package was obtained in the same manner as in Example 1 except that the atmospheric pressure plasma was not irradiated and the oxide layer was not formed.
(評価)
実施例1及び比較例1で得られた気密パッケージについて、実体顕微鏡を用いて気泡の有無を観察した。 (Evaluation)
About the airtight package obtained in Example 1 and Comparative Example 1, the presence or absence of bubbles was observed using a stereomicroscope.
実施例1及び比較例1で得られた気密パッケージについて、実体顕微鏡を用いて気泡の有無を観察した。 (Evaluation)
About the airtight package obtained in Example 1 and Comparative Example 1, the presence or absence of bubbles was observed using a stereomicroscope.
図8は、実施例1で得られた気密パッケージにおいて、封着材料層が設けられている部分の倍率50倍における実体顕微鏡写真である。また、図9は、比較例1で得られた気密パッケージにおいて、封着材料層が設けられている部分の倍率50倍における実体顕微鏡写真である。なお、図8及び図9において、白色で示す部分が封着材料層が設けられている領域である。図8及び図9より、封着材料層が設けられている領域において、比較例1では多数の気泡が観察されたのに対し、実施例1では気泡の発生が抑制されていることがわかる。そのため、実施例1の気密パッケージでは、容器とガラス蓋との接合強度が低下することなく、高い気密性を有していた。他方、比較例1の気密パッケージでは、容器の側壁部とガラス蓋との接合強度が低下し、十分な気密性が得られなかった。
FIG. 8 is a stereomicrograph at a magnification of 50 × of the portion where the sealing material layer is provided in the hermetic package obtained in Example 1. FIG. 9 is a stereomicrograph at a magnification of 50 × of the portion where the sealing material layer is provided in the hermetic package obtained in Comparative Example 1. In FIGS. 8 and 9, the portion shown in white is the region where the sealing material layer is provided. 8 and 9, it can be seen that in the region where the sealing material layer is provided, many bubbles were observed in Comparative Example 1, whereas in Example 1, the generation of bubbles was suppressed. Therefore, the hermetic package of Example 1 has high hermeticity without reducing the bonding strength between the container and the glass lid. On the other hand, in the airtight package of Comparative Example 1, the bonding strength between the side wall portion of the container and the glass lid was lowered, and sufficient airtightness was not obtained.
1…気密パッケージ
2…容器
2a…底部
2b…側壁部
2b1…上面
3…ガラス蓋
4…封着材料層
5…酸化物層
6…素子
7…レーザー光源
8…レーザー
9…始点 DESCRIPTION OFSYMBOLS 1 ... Airtight package 2 ... Container 2a ... Bottom part 2b ... Side wall part 2b1 ... Upper surface 3 ... Glass cover 4 ... Sealing material layer 5 ... Oxide layer 6 ... Element 7 ... Laser light source 8 ... Laser 9 ... Starting point
2…容器
2a…底部
2b…側壁部
2b1…上面
3…ガラス蓋
4…封着材料層
5…酸化物層
6…素子
7…レーザー光源
8…レーザー
9…始点 DESCRIPTION OF
Claims (7)
- 素子を搭載して封止するための気密パッケージであって、
前記素子が搭載される底部及び該底部上に配置された枠状の側壁部を有し、かつ窒化アルミニウムにより構成されている、容器と、
前記容器の側壁部の上部に配置されており、前記容器内を封止するためのガラス蓋と、
前記容器の側壁部と、前記ガラス蓋との間に配置されている、封着材料層と、
を備え、
前記容器の側壁部において、前記封着材料層が配置される領域の少なくとも一部に、前記容器に含まれる成分の酸化物層が設けられており、
前記容器の底部において、前記素子が搭載される領域に前記酸化物層が設けられていない、気密パッケージ。 An airtight package for mounting and sealing the element,
A container having a bottom portion on which the element is mounted and a frame-like side wall portion disposed on the bottom portion and made of aluminum nitride;
A glass lid for sealing the inside of the container, which is disposed on an upper portion of the side wall of the container;
A sealing material layer disposed between the side wall of the container and the glass lid;
With
In the side wall portion of the container, an oxide layer of a component contained in the container is provided in at least a part of a region where the sealing material layer is disposed,
An airtight package in which the oxide layer is not provided in a region where the element is mounted at the bottom of the container. - 前記酸化物層が、酸化アルミニウムを含む、請求項1に記載の気密パッケージ。 The hermetic package according to claim 1, wherein the oxide layer includes aluminum oxide.
- 前記封着材料層が、ビスマス系ガラスを含む、請求項1又は2に記載の気密パッケージ。 The hermetic package according to claim 1 or 2, wherein the sealing material layer contains bismuth-based glass.
- 請求項1~3のいずれか1項に記載の気密パッケージの製造方法であって、
前記容器の側壁部において、前記封着材料層が配置される領域の少なくとも一部に大気圧プラズマを照射し、前記酸化物層を形成する工程と、
前記容器の側壁部において、前記酸化物層が形成されている部分の上に、封着材料を介して前記ガラス蓋を配置し、レーザーを照射することにより前記封着材料を軟化させ、前記容器の側壁部及び前記ガラス蓋を接合させる工程と、
を備える、気密パッケージの製造方法。 A method for manufacturing an airtight package according to any one of claims 1 to 3,
Irradiating at least a part of a region where the sealing material layer is disposed on the side wall of the container with atmospheric pressure plasma to form the oxide layer;
In the side wall portion of the container, the glass lid is disposed via a sealing material on a portion where the oxide layer is formed, and the sealing material is softened by irradiating a laser, and the container Bonding the side wall portion and the glass lid;
A method for manufacturing an airtight package. - 前記酸化物層を形成する工程の前に、前記容器の底部に前記素子を搭載する、請求項4に記載の気密パッケージの製造方法。 The method for manufacturing an airtight package according to claim 4, wherein the element is mounted on the bottom of the container before the step of forming the oxide layer.
- 前記レーザーの波長が、600nm~1600nmである、請求項4又は5に記載の気密パッケージの製造方法。 The method for manufacturing an airtight package according to claim 4 or 5, wherein the laser has a wavelength of 600 nm to 1600 nm.
- 前記封着材料が、ビスマス系ガラス粉末を含む、請求項4~6のいずれか1項に記載の気密パッケージの製造方法。 The method for manufacturing an airtight package according to any one of claims 4 to 6, wherein the sealing material contains bismuth-based glass powder.
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JPH0521627A (en) * | 1991-07-16 | 1993-01-29 | Sumitomo Electric Ind Ltd | Semiconductor device |
JP2014038970A (en) * | 2012-08-18 | 2014-02-27 | Seiko Epson Corp | Method for manufacturing electronic device and electronic device |
JP2016027610A (en) * | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | Package substrate, package, and electronic device |
-
2017
- 2017-03-10 JP JP2018519107A patent/JPWO2017203795A1/en active Pending
- 2017-03-10 WO PCT/JP2017/009641 patent/WO2017203795A1/en active Application Filing
- 2017-03-29 TW TW106110523A patent/TW201806089A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0521627A (en) * | 1991-07-16 | 1993-01-29 | Sumitomo Electric Ind Ltd | Semiconductor device |
JP2014038970A (en) * | 2012-08-18 | 2014-02-27 | Seiko Epson Corp | Method for manufacturing electronic device and electronic device |
JP2016027610A (en) * | 2014-06-27 | 2016-02-18 | 旭硝子株式会社 | Package substrate, package, and electronic device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020240907A1 (en) * | 2019-05-30 | 2020-12-03 | 株式会社村田製作所 | Electronic device and method of producing same |
WO2021121608A1 (en) * | 2019-12-19 | 2021-06-24 | Ev Group E. Thallner Gmbh | Individual encapsulated component and method for the production thereof |
Also Published As
Publication number | Publication date |
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JPWO2017203795A1 (en) | 2019-03-22 |
TW201806089A (en) | 2018-02-16 |
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