JP2023005724A - Manufacturing method of assembly, and manufacturing apparatus of assembly - Google Patents

Manufacturing method of assembly, and manufacturing apparatus of assembly Download PDF

Info

Publication number
JP2023005724A
JP2023005724A JP2021107850A JP2021107850A JP2023005724A JP 2023005724 A JP2023005724 A JP 2023005724A JP 2021107850 A JP2021107850 A JP 2021107850A JP 2021107850 A JP2021107850 A JP 2021107850A JP 2023005724 A JP2023005724 A JP 2023005724A
Authority
JP
Japan
Prior art keywords
substrate
laminate
pressing
pressing member
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021107850A
Other languages
Japanese (ja)
Inventor
徹 白神
Toru Shiragami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP2021107850A priority Critical patent/JP2023005724A/en
Priority to PCT/JP2022/020545 priority patent/WO2023276473A1/en
Priority to KR1020237032727A priority patent/KR20240026437A/en
Priority to CN202280032050.0A priority patent/CN117355492A/en
Priority to TW111119646A priority patent/TW202306199A/en
Publication of JP2023005724A publication Critical patent/JP2023005724A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06Joining glass to glass by processes other than fusing
    • C03C27/10Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

To enhance adhesion between a sealing material and each substrate in manufacturing an assembly by irradiating the sealing material positioned between substrates with a laser beam.SOLUTION: A joining process in a production method of an assembly includes a supporting step for holding a laminate on a support device and a pressing step for pressing the laminate. A press member of the support device is a circular transparent glass plate. A seal member of the support device is composed so as to circularly enclose the laminate between the press member and a base member. In the pressing step, air pressure in a housing space is reduced by an air pressure regulator to adhere the press member to the seal member and to press the laminate using the press member.SELECTED DRAWING: Figure 4

Description

本発明は、基板を接合することによって接合体を製造する方法及び装置に関する。 The present invention relates to a method and apparatus for manufacturing a bonded body by bonding substrates.

周知のように、LED素子その他の電子素子は、劣化防止のために気密パッケージ内に収容される。気密パッケージは、例えば基材である第一基板と、ガラス基板からなる第二基板とを接合することで、接合体として構成される。 As is well known, LED devices and other electronic devices are housed in hermetic packages to prevent deterioration. The airtight package is configured as a bonded body by bonding, for example, a first substrate, which is a base material, and a second substrate, which is a glass substrate.

例えば特許文献1には、基材(接合対象部材)である第一基板と、ガラス部材からなる第二基板との間に封着材料(接合材)を介在させ、封着材料を加熱することで接合体を製造する方法が開示されている。 For example, in Patent Document 1, a sealing material (bonding material) is interposed between a first substrate which is a base material (member to be bonded) and a second substrate made of a glass member, and the sealing material is heated. is disclosed.

この製造方法では、第一基板と第二基板との間に封着材料を配置した積層体を準備し、この積層体を治具に装着し、治具の内部の気圧を調整することで積層体を押圧する。さらに、積層体を押圧した状態で、封着材料にレーザ光を照射し、封着材料から接合部を形成することで、接合体が製造される(同文献の段落0036~0046参照)。 In this manufacturing method, a laminate is prepared by disposing a sealing material between a first substrate and a second substrate, this laminate is mounted on a jig, and lamination is performed by adjusting the air pressure inside the jig. press the body. Further, while the laminate is pressed, the sealing material is irradiated with a laser beam to form a joint portion from the sealing material, thereby manufacturing a joined body (see paragraphs 0036 to 0046 of the same document).

この製造方法に使用される治具は、積層体を支持する治具本体と、積層体を押圧する治具本体用蓋体とを備える。図23(同文献の図3に相当)に示すように、治具本体101は、積層体LMを収容する凹部102と、凹部102内に配置されるとともに積層体LMが載置される付勢部103と、を備える。 The jig used in this manufacturing method includes a jig body that supports the laminate and a jig body lid that presses the laminate. As shown in FIG. 23 (equivalent to FIG. 3 of the same document), the jig body 101 includes a recess 102 that accommodates the laminate LM, and a biasing member that is arranged in the recess 102 and on which the laminate LM is placed. a unit 103;

また、図23に示すように、治具本体101は、その周壁部の先端部(上端部)にシール部材(パッキング材)104を有する(同文献の段落0041参照)。シール部材104は、治具本体101の周壁部の形状に応じて、付勢部103及び積層体LMを囲むように平面視四角形状に構成されている。 Further, as shown in FIG. 23, the jig body 101 has a sealing member (packing material) 104 at the tip (upper end) of the peripheral wall (see paragraph 0041 of the same document). The seal member 104 is configured in a quadrangular shape in plan view so as to surround the biasing portion 103 and the laminate LM according to the shape of the peripheral wall portion of the jig body 101 .

治具本体用蓋体は、治具本体101及びシール部材104の形状に応じて四角形状に構成される(同文献の図4参照)。治具本体用蓋体は、治具本体101に取り付けられる際に、シール部材104に載置される。 The jig main body cover is formed in a rectangular shape according to the shapes of the jig main body 101 and the sealing member 104 (see FIG. 4 of the same document). The jig body cover is placed on the seal member 104 when attached to the jig body 101 .

特許文献1に係る接合体の製造方法では、凹部102の気体をポンプにより排出し、凹部102の気圧を低下させることで、治具本体用蓋体をシール部材104に密着させるとともに、この治具本体用蓋体を撓ませて、積層体LMを押圧することができる。 In the method for manufacturing a joined body according to Patent Document 1, the gas in the recess 102 is discharged by a pump, and the air pressure in the recess 102 is lowered to bring the jig body lid into close contact with the seal member 104 and to The laminate body LM can be pressed by bending the main body cover.

特開2021-31306号公報Japanese Unexamined Patent Application Publication No. 2021-31306

上記のような従来の接合体の製造方法では、シール部材104が四角形状に形成され、治具本体用蓋体も四角形状に構成されていたため、以下のような問題が生じるおそれがあった。 In the above-described conventional bonded body manufacturing method, the seal member 104 is formed in a square shape, and the jig main body lid is also formed in a square shape, so that the following problems may occur.

すなわち、図23に示すように、四角形状に配されるシール部材104の一辺の中間部の位置P1から積層体LMの中心Oまでの距離D1と、シール部材104の角部の位置P2から積層体LMの中心Oまでの距離D2とが異なる。このような距離D1,D2の違いが主な原因となって、積層体LMに対する治具本体用蓋体の押圧力にばらつきが生じるおそれがあった。この押圧力のばらつきは、積層体LMが大型化する程、顕著になる。 That is, as shown in FIG. 23, the distance D1 from the center position P1 of one side of the sealing member 104 arranged in a square shape to the center O of the laminate LM and the stacking distance from the position P2 of the corner of the sealing member 104 It differs from the distance D2 to the center O of the body LM. Mainly due to the difference between the distances D1 and D2, there is a possibility that the pressing force of the jig main body cover against the laminated body LM may vary. This variation in pressing force becomes more pronounced as the size of the laminate LM increases.

上記のように治具本体用蓋体による積層体の押圧力にばらつきが生じると、第一基板と第二基板との間に位置する封着材料に、各基板との密着が不十分な部分が発生し、接合不良の原因となる。 As described above, when the pressing force of the laminated body by the lid for the jig main body varies, the sealing material located between the first substrate and the second substrate does not adhere sufficiently to each substrate. occurs, resulting in poor bonding.

本発明は上記の事情に鑑みて為されたものであり、基板間に介在する封着材料にレーザ光を照射することによって接合体を製造する場合に、封着材料と各基板との密着性を向上させることを技術的課題とする。 The present invention has been made in view of the above circumstances. The technical task is to improve

本発明は上記の課題を解決するためのものであり、第一基板と、第二基板と、前記第一基板と前記第二基板とを接合する封着層と、を備える接合体を製造する方法であって、前記第一基板と前記第二基板との間に封着材料を介在させるとともに、前記第一基板と前記第二基板とを重ね合わせることにより積層体を形成する積層工程と、前記積層体における前記封着材料にレーザ光を照射することにより前記封着層を形成する接合工程と、を備え、前記接合工程は、前記積層体を支持装置に装着する支持工程と、前記積層体を押圧する押圧工程と、前記封着材料に前記レーザ光を照射するレーザ照射工程と、を備え、前記支持装置は、前記積層体を押圧する押圧部材と、前記押圧部材を支持するベース部材と、前記押圧部材と前記ベース部材との間に配されるシール部材と、前記押圧部材と前記ベース部材との間に形成される、前記積層体の収容空間と、前記収容空間の気圧を調整する気圧調整装置と、を備え、前記押圧部材は、円形に構成される透明なガラス板であり、前記シール部材は、前記押圧部材と前記ベース部材との間で、前記積層体を円形に囲むように構成されており、前記押圧工程では、前記気圧調整装置によって前記収容空間の気圧を低下させることで、前記押圧部材を前記シール部材に密着させ、かつ前記押圧部材によって前記積層体を押圧することを特徴とする。 The present invention is intended to solve the above problems, and manufactures a joined body comprising a first substrate, a second substrate, and a sealing layer that joins the first substrate and the second substrate. a lamination step of interposing a sealing material between the first substrate and the second substrate, and forming a laminate by laminating the first substrate and the second substrate; a bonding step of forming the sealing layer by irradiating the sealing material in the laminate with a laser beam, wherein the bonding step comprises a supporting step of mounting the laminate on a support device; and a laser irradiation step of irradiating the sealing material with the laser beam. The supporting device includes a pressing member that presses the laminate and a base member that supports the pressing member a seal member disposed between the pressing member and the base member; a space for accommodating the stack formed between the pressing member and the base member; and air pressure adjustment in the accommodation space. and an air pressure adjusting device, wherein the pressing member is a transparent glass plate configured in a circular shape, and the sealing member surrounds the laminate in a circular shape between the pressing member and the base member. In the pressing step, the air pressure in the housing space is lowered by the air pressure adjusting device, so that the pressing member is brought into close contact with the sealing member, and the stack is pressed by the pressing member. It is characterized by

かかる構成によれば、押圧部材を円形の透明なガラス板とし、ベース部材とこの押圧部材との間に位置するシール部材を、積層体を円形に囲むように構成することで、押圧工程において、押圧部材が積層体を押圧する力のばらつきを可及的に小さくすることが可能となる。これにより、積層体における封着材料の各基板に対する密着性を向上させることが可能となる。 According to this configuration, the pressing member is a circular transparent glass plate, and the sealing member positioned between the base member and the pressing member is configured to surround the laminate in a circular shape, so that in the pressing step, Variation in the force with which the pressing member presses the laminate can be minimized. This makes it possible to improve the adhesion of the sealing material in the laminate to each substrate.

前記支持装置は、前記収容空間内で前記積層体を支持する支持部材を備え、前記支持部材は、前記積層体を収容する収容部を有し、前記支持工程では、前記第一基板を前記収容部に収容するとともに、前記第二基板の厚さ方向の一部が前記収容部から前記押圧部材に向かって食み出るように前記第二基板を前記収容部に収容してもよい。ここで、収容部は、積層体を収容可能な凹部であってもよく、積層体を位置決めできる形態であれば特に制限はなく、例えば支持部材表面に位置決め用突出部を複数設け、その内側の空間を収容部としてもよい。 The support device includes a support member that supports the laminate within the accommodation space, the support member has an accommodation portion that accommodates the laminate, and the support step includes: accommodating the first substrate; The second substrate may be accommodated in the accommodation portion such that a portion of the second substrate in the thickness direction protrudes from the accommodation portion toward the pressing member. Here, the accommodating portion may be a concave portion capable of accommodating the laminate, and is not particularly limited as long as it is in a form capable of positioning the laminate. The space may be used as the accommodation section.

積層体を構成する第二基板をガラス基板とし、第二基板の厚さ方向の一部を支持部材の収容部から食み出させることで、押圧工程において、押圧部材は、積層体の第二基板に対して確実に接触し、効果的に積層体を押圧することが可能となる。 A glass substrate is used as the second substrate constituting the laminate, and a part of the second substrate in the thickness direction protrudes from the accommodating portion of the support member. It is possible to reliably contact the substrate and effectively press the laminate.

また、第二基板は、上記のように収容部から食み出る部分以外の他の部分が収容部に収容されることで、支持工程及び押圧工程において、位置ずれを生じることなく収容部に係止されることとなる。これにより、積層体の封着材料に対してレーザ光を精度良く照射することができる。 In addition, since the second substrate is housed in the housing portion other than the portion protruding from the housing portion as described above, the second substrate can be engaged with the housing portion without positional deviation in the supporting step and the pressing step. will be stopped. Thereby, the sealing material of the laminate can be accurately irradiated with the laser beam.

前記第二基板の厚さ方向の一部が前記収容部から食み出る寸法は、前記第二基板の厚さ寸法の0.05~0.95倍であってもよい。 A dimension by which a portion of the second substrate in the thickness direction protrudes from the accommodating portion may be 0.05 to 0.95 times the thickness dimension of the second substrate.

本方法では、前記収容空間の気圧は、好ましくは100~95,000Pa、より好ましくは1,000~85,000Paである。 In this method, the air pressure in the housing space is preferably 100-95,000 Pa, more preferably 1,000-85,000 Pa.

前記押圧部材の厚さは、3~10mmであってもよい。また、前記押圧部材のヤング率は、好ましくは50~80GPa、より好ましくは60~70GPaである。これにより、押圧工程において、押圧部材は、適度な撓みによって積層体を好適に押圧することが可能となる。 The thickness of the pressing member may be 3-10 mm. Also, the Young's modulus of the pressing member is preferably 50 to 80 GPa, more preferably 60 to 70 GPa. As a result, in the pressing step, the pressing member can appropriately press the layered product with moderate deflection.

前記支持工程において、前記収容空間にドライエアが充填されてもよい。これにより、製造された接合体に形成されるキャビティ内を水分の少ない状態にすることができ、気密パッケージ内のLED素子等の電子素子の性能が劣化することを回避することができる。 In the supporting step, the accommodation space may be filled with dry air. As a result, the inside of the cavity formed in the manufactured bonded body can be made to have less moisture, and deterioration in the performance of electronic elements such as LED elements in the hermetic package can be avoided.

更に、前記第一基板は、高熱伝導性基板であり、前記第二基板は、ガラス基板であることが好ましい。 Furthermore, it is preferable that the first substrate is a highly thermally conductive substrate and the second substrate is a glass substrate.

本発明は上記の課題を解決するためのものであり、第一基板と、第二基板と、前記第一基板と前記第二基板とを接合する封着層と、を備える接合体を製造する装置であって、前記第一基板と前記第二基板との間に封着材料を介在させるとともに、前記第一基板と前記第二基板とを重ね合わせることにより構成される積層体を支持する支持装置と、前記積層体における前記封着材料にレーザ光を照射することにより前記封着層を形成するレーザ照射装置と、を備え、前記支持装置は、前記積層体を押圧する押圧部材と、前記押圧部材を支持するベース部材と、前記押圧部材と前記ベース部材との間に配されるシール部材と、前記押圧部材と前記ベース部材との間に形成される、前記積層体の収容空間と、前記収容空間の気圧を調整する気圧調整装置と、を備え、前記押圧部材は、円形に構成される透明なガラス板であり、前記シール部材は、前記押圧部材と前記ベース部材との間で、前記積層体を円形に囲むように構成されており、前記気圧調整装置によって前記収容空間の気圧を低下させることで、前記押圧部材を前記シール部材に密着させ、かつ前記押圧部材によって前記積層体を押圧するように構成されることを特徴とする。 The present invention is intended to solve the above problems, and manufactures a joined body comprising a first substrate, a second substrate, and a sealing layer that joins the first substrate and the second substrate. A device, wherein a sealing material is interposed between the first substrate and the second substrate, and a support for supporting a laminate constructed by overlapping the first substrate and the second substrate. and a laser irradiation device that forms the sealing layer by irradiating the sealing material in the laminate with a laser beam, wherein the support device includes a pressing member that presses the laminate; a base member that supports the pressing member; a sealing member that is arranged between the pressing member and the base member; and an accommodation space for the stacked body that is formed between the pressing member and the base member; an air pressure adjustment device that adjusts the air pressure in the housing space, wherein the pressing member is a transparent glass plate configured in a circular shape, and the sealing member is provided between the pressing member and the base member, The stack is configured to surround the stack in a circle, and the pressing member is brought into close contact with the sealing member by reducing the pressure in the housing space with the pressure adjusting device, and the stack is pressed by the pressing member. It is characterized by being configured to be pressed.

かかる構成によれば、押圧部材を円形の透明なガラス板とし、ベース部材とこの押圧部材との間に位置するシール部材を、積層体を円形に囲むように構成することで、押圧部材が積層体を押圧する力のばらつきを可及的に小さくすることが可能となる。これにより、積層体における封着材料の各基板に対する密着性を向上させることが可能となる。 According to this configuration, the pressing member is a circular transparent glass plate, and the sealing member positioned between the base member and the pressing member is configured to surround the laminate in a circular shape, so that the pressing member is laminated. It is possible to minimize variations in the force that presses the body. This makes it possible to improve the adhesion of the sealing material in the laminate to each substrate.

本発明によれば、基板間に介在する封着材料にレーザ光を照射することによって接合体を製造する場合に、封着材料と各基板との密着性を向上させることができる。 ADVANTAGE OF THE INVENTION According to this invention, when manufacturing a joined body by irradiating a laser beam to the sealing material interposed between the board|substrates, the adhesiveness of a sealing material and each board|substrate can be improved.

接合体の平面図である。FIG. 4 is a plan view of a joined body; 図1のII-II矢視線に係る断面図である。FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1; 第二基板の底面図である。It is a bottom view of a second substrate. 接合体の製造装置を示す断面図である。FIG. 3 is a cross-sectional view showing a bonded body manufacturing apparatus; 支持装置の一部を示す平面図である。It is a top view which shows a part of support apparatus. 図5のVI-VI矢視線に係る断面図である。FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5; 支持部材の平面図である。It is a top view of a support member. 押圧部材の平面図である。4 is a plan view of a pressing member; FIG. 枠体の平面図である。It is a top view of a frame. 支持部材をベース部材に取り付ける方法を示す断面図である。FIG. 5 is a cross-sectional view showing how the support member is attached to the base member; 支持部材をベース部材に取り付ける方法を示す平面図である。FIG. 4 is a plan view showing a method of attaching the support member to the base member; 図11のXII-XII矢視線に係る断面図である。FIG. 12 is a cross-sectional view along the XII-XII arrow line of FIG. 11; 接合体の製造方法を示すフローチャートである。4 is a flow chart showing a method for manufacturing a joined body; 積層工程を示す断面図である。It is sectional drawing which shows a lamination process. 接合工程を示すフローチャートである。It is a flow chart which shows a joining process. 支持工程を示す断面図である。It is sectional drawing which shows a support process. 支持工程を示す断面図である。It is sectional drawing which shows a support process. 第二実施形態に係る接合体の製造装置を示す平面図である。FIG. 10 is a plan view showing a bonded body manufacturing apparatus according to a second embodiment; 支持部材の平面図である。It is a top view of a support member. 支持部材をベース部材に取り付ける方法を示す断面図である。FIG. 5 is a cross-sectional view showing how the support member is attached to the base member; 支持工程を示す断面図である。It is sectional drawing which shows a support process. 支持工程を示す断面図である。It is sectional drawing which shows a support process. 従来の接合体の製造装置の一部を示す平面図である。FIG. 3 is a plan view showing a part of a conventional bonded body manufacturing apparatus;

以下、本発明を実施するための形態について、図面を参照しながら説明する。図1乃至図17は、本発明に係る接合体の製造方法及び製造装置の第一実施形態を示す。 EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated, referring drawings. 1 to 17 show a first embodiment of a method and apparatus for manufacturing a joined body according to the present invention.

図1及び図2は、本発明によって製造される接合体として、気密パッケージを例示する。接合体1は、基材となる第一基板2と、第一基板2に重ねられる第二基板3と、第一基板2と第二基板3とを接合する複数の封着層4と、第一基板2と第二基板3との間であって封着層4の内側に収容される素子5と、を備える。 1 and 2 exemplify a hermetic package as a joint produced by the present invention. The joined body 1 includes a first substrate 2 as a base material, a second substrate 3 superimposed on the first substrate 2, a plurality of sealing layers 4 for joining the first substrate 2 and the second substrate 3, a device 5 housed between the first substrate 2 and the second substrate 3 and inside the sealing layer 4 .

第一基板2は、例えば矩形状に構成されるが、この形状に限定されるものではない。第一基板2は、素子5が設置される第一主面2aと、第一主面2aの反対側に位置する第二主面2bとを有する。第一主面2aは、素子5を収容可能な凹部を有していてもよい。 The first substrate 2 has, for example, a rectangular shape, but is not limited to this shape. The first substrate 2 has a first main surface 2a on which the element 5 is installed and a second main surface 2b located on the opposite side of the first main surface 2a. The first main surface 2a may have a recess that can accommodate the element 5 .

第一基板2は、高熱伝導性基板、例えばシリコン基板により構成されるが、これらに限定されず、他の金属基板、セラミックス基板、半導体基板その他の各種基板により構成されてもよい。なお、第一基板2の厚さは、0.1~5.0mmの範囲内であるが、この範囲に限定されない。 The first substrate 2 is composed of a highly thermally conductive substrate such as a silicon substrate, but is not limited thereto, and may be composed of other metal substrates, ceramic substrates, semiconductor substrates, and other various substrates. The thickness of the first substrate 2 is within the range of 0.1 to 5.0 mm, but is not limited to this range.

第一基板2の熱伝導率は、第二基板3の熱伝導率よりも高くてもよい。第一基板2の20℃における熱伝導率は、好ましくは10~500W/m・K、より好ましくは30~300W/m・K、更に好ましくは70~250W/m・K、特に好ましくは100~200W/m・Kであるが、この範囲に限定されるものではない。 The thermal conductivity of the first substrate 2 may be higher than that of the second substrate 3 . The thermal conductivity of the first substrate 2 at 20° C. is preferably 10 to 500 W/m·K, more preferably 30 to 300 W/m·K, still more preferably 70 to 250 W/m·K, particularly preferably 100 to 300 W/m·K. 200 W/m·K, but not limited to this range.

第二基板3は、例えば矩形状の透明なガラス基板により構成されるが、この形状に限定されるものではない。第二基板3は、第一主面3aと、第一主面3aの反対側に位置する第二主面3bとを有する。 The second substrate 3 is composed of, for example, a rectangular transparent glass substrate, but is not limited to this shape. The second substrate 3 has a first major surface 3a and a second major surface 3b located on the opposite side of the first major surface 3a.

第二基板3を構成するガラスとしては、例えば、無アルカリガラス、ホウケイ酸ガラス、ソーダ石灰ガラス、石英ガラス、低熱膨張係数を有する結晶化ガラスなどを用いることができる。第二基板3の厚さは、特に限定されるものではないが、例えば0.01~2.0mmの範囲内のものが用いられる。第二基板3の20℃における熱伝導率は、好ましくは0.5~5W/m・Kであるが、この範囲に限定されない。 As the glass forming the second substrate 3, for example, non-alkali glass, borosilicate glass, soda lime glass, quartz glass, crystallized glass having a low coefficient of thermal expansion, or the like can be used. Although the thickness of the second substrate 3 is not particularly limited, a thickness within a range of 0.01 to 2.0 mm is used, for example. The thermal conductivity of the second substrate 3 at 20° C. is preferably 0.5 to 5 W/m·K, but is not limited to this range.

複数の封着層4は、所定の配列パターンによって接合体1に形成されている。封着層4は、複数の封着材料を第一基板2と第二基板3との間に介在させ、当該封着材料にレーザ光を照射し、加熱により軟化流動させることによって形成される。 A plurality of sealing layers 4 are formed on the joined body 1 in a predetermined arrangement pattern. The sealing layer 4 is formed by interposing a plurality of sealing materials between the first substrate 2 and the second substrate 3, irradiating the sealing materials with laser light, and softening and flowing them by heating.

図3は、第一基板2に接合される前の第二基板3の底面図を示す。第一基板2と第二基板3との間に封着材料を介在させる場合において、例えば第二基板3の第一主面3aに封着材料6を予め固着してもよい。これに限らず、封着材料は、第一基板2に予め固着されてもよく、シート状の封着材料を第一基板2と第二基板3との間に介在させてもよい。 3 shows a bottom view of the second substrate 3 before being bonded to the first substrate 2. FIG. When the sealing material is interposed between the first substrate 2 and the second substrate 3, the sealing material 6 may be adhered to the first main surface 3a of the second substrate 3 in advance, for example. Alternatively, the sealing material may be fixed to the first substrate 2 in advance, or a sheet-like sealing material may be interposed between the first substrate 2 and the second substrate 3 .

封着材料として、種々の材料が使用可能である。その中でも、封着強度を高める観点から、ビスマス系ガラス粉末と耐火性フィラー粉末を含む複合材料(ガラスフリット)を用いることが好ましい。ビスマス系ガラスだけでなく、銀リン酸系ガラス、テルル系ガラス等のガラス粉末を封着材料として使用することもできる。 Various materials can be used as the sealing material. Among them, from the viewpoint of increasing the sealing strength, it is preferable to use a composite material (glass frit) containing bismuth-based glass powder and refractory filler powder. Not only bismuth-based glass, but also glass powder such as silver phosphate-based glass and tellurium-based glass can be used as the sealing material.

耐火性フィラー粉末としては、種々の材料が使用可能であるが、その中でも、コーディライト、ジルコン、酸化錫、酸化ニオブ、リン酸ジルコニウム系セラミック、ウイレマイト、β-ユークリプタイト、β-石英固溶体から選ばれる一種又は二種以上の材料により構成されることが好ましい。 Various materials can be used as the refractory filler powder. It is preferably composed of one or two or more selected materials.

図1に示すように、封着層4は、素子5を収容する空間を接合するように、閉曲線状に構成されている。本発明において、「閉曲線」の用語は、曲線のみによって構成される形状のみならず、曲線と直線との組み合わせにより構成される形状、直線のみによって構成される形状(例えば四角形状その他の多角形状)を含む。 As shown in FIG. 1, the sealing layer 4 is formed in the shape of a closed curve so as to join the space in which the element 5 is accommodated. In the present invention, the term "closed curve" means not only a shape composed only of curved lines, but also a shape composed of a combination of curved lines and straight lines, and a shape composed only of straight lines (for example, quadrilateral and other polygonal shapes). including.

封着層4の厚さは、1μm~20μmであることが好ましく、より好ましくは、3~8μmである。封着層4の幅寸法Wは、50~2000μmであることが好ましく、より好ましく100~1000μmである。 The thickness of the sealing layer 4 is preferably 1 μm to 20 μm, more preferably 3 to 8 μm. The width W of the sealing layer 4 is preferably 50-2000 μm, more preferably 100-1000 μm.

素子5は、第一基板2の第一主面2aに搭載される。また、素子5は、第一基板2の第一主面2a、第二基板3の第一主面3a及び封着層4によって区画される空間(キャビティ)に配置される。素子5としては、深紫外LED(Light Emitting Diode)等の発光素子、MEMS(Micro Electro Mechanical Systems)素子、CCD(Charge Coupled Device)素子などの各種素子が使用され得る。 The element 5 is mounted on the first major surface 2 a of the first substrate 2 . Further, the element 5 is arranged in a space (cavity) defined by the first main surface 2 a of the first substrate 2 , the first main surface 3 a of the second substrate 3 and the sealing layer 4 . As the element 5, various elements such as a light emitting element such as a deep ultraviolet LED (Light Emitting Diode), a MEMS (Micro Electro Mechanical Systems) element, a CCD (Charge Coupled Device) element, and the like can be used.

図4乃至図12は、接合体1の製造装置7を示す。図4に示すように、製造装置7は、封着材料6を介して第一基板2と第二基板3をと積層することにより構成される積層体LMを支持する支持装置8と、積層体LMの封着材料6にレーザ光Lを照射することにより封着層4を形成するレーザ照射装置9と、を備える。 4 to 12 show the manufacturing apparatus 7 for the joined body 1. FIG. As shown in FIG. 4, the manufacturing apparatus 7 includes a support device 8 for supporting a laminate LM formed by laminating a first substrate 2 and a second substrate 3 with a sealing material 6 interposed therebetween; and a laser irradiation device 9 for forming the sealing layer 4 by irradiating the sealing material 6 of the LM with the laser light L.

図4乃至図9に示すように、支持装置8は、積層体LMを支持する支持部材10と、積層体LMを押圧する押圧部材11と、押圧部材11を支持するベース部材12と、支持部材10をベース部材12に固定する固定機構13と、押圧部材11をベース部材12に固定する枠体14と、押圧部材11とベース部材12との間に配されるシール部材15と、押圧部材11とベース部材12との間に形成される、積層体LMの収容空間16と、収容空間16の気圧を調整する気圧調整装置17と、を備える。 As shown in FIGS. 4 to 9, the support device 8 includes a support member 10 that supports the laminate LM, a pressing member 11 that presses the laminate LM, a base member 12 that supports the pressing member 11, and a support member. 10 to the base member 12; a frame 14 to fix the pressing member 11 to the base member 12; a sealing member 15 arranged between the pressing member 11 and the base member 12; and the base member 12 , an accommodation space 16 for the laminated body LM, and an air pressure adjustment device 17 for adjusting the air pressure in the accommodation space 16 .

支持部材10は、積層体LMとともに収容空間16に配される。支持部材10は、例えば金属(ステンレス鋼等)により、円形状の板部材により構成される(図7参照)。支持部材10の材質及び形状は本実施形態に限定されない。支持部材10は、第一面10aと、第一面10aの反対側に位置する第二面10bとを有する。第一面10aは、積層体LMを収容する収容部18を有する。本実施形態において、収容部18は、積層体LMを収容可能な凹部により構成されるが、収容部18の構成は、積層体LMを位置決めできる形態であれば特に制限はなく、例えば支持部材10の第一面10aに位置決め用突出部を複数設け、その内側の空間を収容部18としてもよい。 The support member 10 is arranged in the accommodation space 16 together with the laminate LM. The support member 10 is configured by a circular plate member made of metal (such as stainless steel), for example (see FIG. 7). The material and shape of the support member 10 are not limited to those of this embodiment. The support member 10 has a first surface 10a and a second surface 10b opposite the first surface 10a. The first surface 10a has an accommodation portion 18 that accommodates the laminate LM. In the present embodiment, the accommodation portion 18 is configured by a concave portion capable of accommodating the laminate LM, but the configuration of the accommodation portion 18 is not particularly limited as long as it can position the laminate LM. A plurality of positioning protrusions may be provided on the first surface 10a of the , and the space inside the protrusions may be used as the housing portion 18 .

図8に示すように、押圧部材11は、例えば円形に構成される透明なガラス板である。押圧部材11の厚さは、例えば3~10mmとされることが好ましい。押圧部材11のヤング率は、好ましくは50~80GPa、より好ましくは60~70GPaである。これにより、後述する押圧工程において、押圧部材は、適度な撓みによって積層体を好適に押圧することが可能となる。押圧部材11は、シール部材15及び積層体LMに接触する第一面11aと、枠体14に接触する第二面11bとを有する。 As shown in FIG. 8, the pressing member 11 is, for example, a circular transparent glass plate. The thickness of the pressing member 11 is preferably 3 to 10 mm, for example. The Young's modulus of the pressing member 11 is preferably 50-80 GPa, more preferably 60-70 GPa. As a result, in the pressing step, which will be described later, the pressing member can suitably press the laminated body with moderate bending. The pressing member 11 has a first surface 11 a that contacts the seal member 15 and the laminate LM, and a second surface 11 b that contacts the frame 14 .

ベース部材12は、金属(例えばステンレス鋼)により構成されるが、他の材料により構成されてもよい。ベース部材12は、収容空間16を形成するための壁部19及び底部20を有する。 The base member 12 is made of metal (for example, stainless steel), but may be made of other materials. The base member 12 has a wall portion 19 and a bottom portion 20 for forming the accommodation space 16 .

図5は、固定機構13によって支持部材10が固定されたベース部材12の平面図を示す。ベース部材12の壁部19は、円筒状に構成されるが、この形状に限定されない。壁部19の内側の中途部には、シール部材15が取り付けられる支持座部21が形成されている。支持座部21は、ベース部材12に取り付けられる押圧部材11と対向する面である。この支持座部21には、シール部材15が取り付けられる平面視円環状の溝部21aが形成されている。 FIG. 5 shows a plan view of the base member 12 to which the support member 10 is fixed by the fixing mechanism 13. FIG. The wall portion 19 of the base member 12 is configured in a cylindrical shape, but is not limited to this shape. A support seat portion 21 to which the seal member 15 is attached is formed in the inner halfway portion of the wall portion 19 . The support seat portion 21 is a surface facing the pressing member 11 attached to the base member 12 . The support seat portion 21 is formed with an annular groove portion 21a in plan view to which the sealing member 15 is attached.

図4及び図5に示すように、壁部19は、端面19a(上面)と、内周面19b,19cと、外周面19dとを有する。 As shown in FIGS. 4 and 5, the wall portion 19 has an end surface 19a (upper surface), inner peripheral surfaces 19b and 19c, and an outer peripheral surface 19d.

壁部19の端面19aには、固定部材22を介して枠体14が固定される。固定部材22は、例えばボルト、ねじ部材により構成され、頭部22a及び軸部22bを有する。この端面19aには、固定部材22の軸部22bが係合する複数のねじ穴23が形成されている。 The frame 14 is fixed to the end surface 19 a of the wall portion 19 via the fixing member 22 . The fixing member 22 is configured by, for example, a bolt or a screw member, and has a head portion 22a and a shaft portion 22b. The end face 19a is formed with a plurality of screw holes 23 with which the shaft portion 22b of the fixing member 22 is engaged.

壁部19の内周面19b,19cは、押圧部材11を支持座部21に案内するガイド面として機能する第一内周面19bと、支持部材10を挿通可能な第二内周面19cとを含む。第一内周面19bの直径は、押圧部材11の直径よりも大きい。第二内周面19cの直径は、支持部材10の直径よりも大きい。 The inner peripheral surfaces 19b and 19c of the wall portion 19 are composed of a first inner peripheral surface 19b functioning as a guide surface for guiding the pressing member 11 to the support seat portion 21 and a second inner peripheral surface 19c through which the support member 10 can be inserted. including. The diameter of the first inner peripheral surface 19 b is larger than the diameter of the pressing member 11 . The diameter of the second inner peripheral surface 19 c is larger than the diameter of the support member 10 .

ベース部材12の底部20は、円筒状の壁部19の内側に形成されている。底部20は平面視円形の面により構成される。 A bottom portion 20 of the base member 12 is formed inside the cylindrical wall portion 19 . The bottom portion 20 is configured by a circular surface in plan view.

図4乃至図6に示すように、固定機構13は、支持部材10を支持する弾性部材24と、支持部材10をベース部材12に固定する固定部材25と、支持部材10に形成されるとともに固定部材25の一部を挿通可能な挿通孔26と、支持部材10に形成されるとともに固定部材25の一部を係止する係止凹部27と、支持部材10に形成されるとともに固定部材25を挿通孔26と係止凹部27との間で相対的に移動させる案内溝28と、を含む。 As shown in FIGS. 4 to 6, the fixing mechanism 13 includes an elastic member 24 that supports the support member 10, a fixing member 25 that fixes the support member 10 to the base member 12, and a fixing member 25 that is formed on and fixed to the support member 10. An insertion hole 26 through which a part of the member 25 can be inserted, an engaging recess 27 formed in the supporting member 10 and engaging a part of the fixing member 25, and an engaging recess 27 formed in the supporting member 10 and engaging the fixing member 25. and a guide groove 28 for relatively moving between the insertion hole 26 and the locking recess 27 .

弾性部材24は、ベース部材12の底部20に取り付けられている。底部20には、複数の弾性部材24が配される。弾性部材24は、例えば圧縮コイルばねにより構成されるが、これに限らず、他のばねや、ゴムその他の材料により構成されてもよい。底部20には、弾性部材24の一部を収容する複数の取付凹部29が形成されている。弾性部材24は、一端部が取付凹部29に挿入され、他端部が底部20から突出している。この弾性部材24は、その弾性復元力により、支持部材10を付勢する機能を有する。 A resilient member 24 is attached to the bottom portion 20 of the base member 12 . A plurality of elastic members 24 are arranged on the bottom portion 20 . The elastic member 24 is composed of, for example, a compression coil spring, but is not limited to this, and may be composed of other springs, rubber, or other materials. A plurality of mounting recesses 29 that accommodate portions of the elastic members 24 are formed in the bottom portion 20 . One end of the elastic member 24 is inserted into the mounting recess 29 and the other end protrudes from the bottom 20 . This elastic member 24 has a function of urging the support member 10 by its elastic restoring force.

固定部材25は、例えばボルト、ねじ部材により構成され、頭部25a及び軸部25bを有する。頭部25aは、軸部25bの直径よりも大きな寸法(直径)を有する。軸部25bは、雄ねじ部30を有する。軸部25bは、ベース部材12の底部20に固定される。ベース部材12の底部20には、この軸部25bが嵌まるねじ穴31が形成されている。 The fixing member 25 is configured by, for example, a bolt or a screw member, and has a head portion 25a and a shaft portion 25b. The head portion 25a has a dimension (diameter) larger than the diameter of the shaft portion 25b. The shaft portion 25 b has a male thread portion 30 . The shaft portion 25 b is fixed to the bottom portion 20 of the base member 12 . The bottom portion 20 of the base member 12 is formed with a threaded hole 31 into which the shaft portion 25b is fitted.

図7に示すように、挿通孔26は、平面視において円形状に構成されるが、この形状に限定されない。挿通孔26は、固定部材25の頭部25a及び軸部25bを挿通することができるように、頭部25aの寸法(直径)よりも大きな直径を有する。 As shown in FIG. 7, the insertion hole 26 is configured in a circular shape in plan view, but is not limited to this shape. The insertion hole 26 has a diameter larger than the size (diameter) of the head portion 25a so that the head portion 25a and the shaft portion 25b of the fixing member 25 can be inserted.

係止凹部27は、固定部材25の頭部25aを挿入することが可能な側壁面27aと、この頭部25aを係止する底面27bとを有する。側壁面27aは、平面視において円形に構成されるが、この形状に限定されない。側壁面27aは、固定部材25の頭部25aに接触しないように、頭部25aの寸法よりも大きな直径を有する。底面27bは、頭部25aに接触するように構成される。 The locking recess 27 has a side wall surface 27a into which the head 25a of the fixing member 25 can be inserted, and a bottom surface 27b that locks the head 25a. The side wall surface 27a has a circular shape in plan view, but is not limited to this shape. The side wall surface 27a has a diameter larger than the size of the head 25a of the fixing member 25 so as not to contact the head 25a. Bottom surface 27b is configured to contact head 25a.

案内溝28は、固定部材25の軸部25bが挿通されるように、支持部材10をその厚さ方向に貫通している。案内溝28は、固定部材25の軸部25bを挿通孔26と係止凹部27との間で相対的に移動させるように、固定部材25の挿通孔26と係止凹部27の底面27bとに繋がっている。具体的には、案内溝28の一端部は、挿通孔26の内周面と連通している。案内溝28の他端部は、係止凹部27の底面27bの中心に位置する。 The guide groove 28 penetrates the support member 10 in its thickness direction so that the shaft portion 25b of the fixing member 25 is inserted therethrough. The guide groove 28 is formed between the insertion hole 26 of the fixing member 25 and the bottom surface 27b of the locking recess 27 so that the shaft portion 25b of the fixing member 25 can move relatively between the insertion hole 26 and the locking recess 27. It is connected. Specifically, one end of the guide groove 28 communicates with the inner peripheral surface of the insertion hole 26 . The other end of the guide groove 28 is positioned at the center of the bottom surface 27 b of the locking recess 27 .

案内溝28は、平面視において円弧状又は直線状に構成される。案内溝28は、支持部材10をその中心まわりに回転させることにより、固定部材25の軸部25bを、挿通孔26と係止凹部27との間で相対的に移動させることができる。 The guide groove 28 is configured in an arc shape or a straight line shape in plan view. The guide groove 28 allows the shaft portion 25b of the fixing member 25 to move relatively between the insertion hole 26 and the locking recess 27 by rotating the support member 10 around its center.

図9に示すように、枠体14は、平面視円環状に構成される板状部材である。枠体14は、固定部材22によってベース部材12の壁部19の端面19aに固定される。枠体14は、固定部材22の軸部22bが挿通される挿通孔32と、固定部材22の頭部22aを収容する係止凹部33と、筒部34と、開口部35と、を備える。 As shown in FIG. 9, the frame 14 is a plate-like member having an annular shape in plan view. The frame 14 is fixed to the end face 19 a of the wall portion 19 of the base member 12 by the fixing member 22 . The frame 14 includes an insertion hole 32 through which the shaft portion 22b of the fixing member 22 is inserted, an engaging recess 33 that accommodates the head portion 22a of the fixing member 22, a tubular portion 34, and an opening portion 35.

図4及び図9に示すように、挿通孔32及び係止凹部33は、平面視において同心状に形成される。枠体14には、複数の挿通孔32及び係止凹部33が形成されている。筒部34は、ベース部材12の壁部19に形状に対応するように、円筒状に構成される。筒部34の内周面の直径は、ベース部材12の壁部19における外周面19dの直径よりも大きい。開口部35は、平面視において円形に構成されている。開口部35の直径は、押圧部材11の直径よりも小さい。 As shown in FIGS. 4 and 9, the insertion hole 32 and the locking recess 33 are formed concentrically in plan view. A plurality of insertion holes 32 and locking recesses 33 are formed in the frame 14 . The cylindrical portion 34 is configured in a cylindrical shape so as to correspond to the shape of the wall portion 19 of the base member 12 . The diameter of the inner peripheral surface of the tubular portion 34 is larger than the diameter of the outer peripheral surface 19 d of the wall portion 19 of the base member 12 . The opening 35 is circular in plan view. The diameter of the opening 35 is smaller than the diameter of the pressing member 11 .

シール部材15は、ゴム等の弾性部材(例えばOリング)により構成される。図4及び図5に示すように、シール部材15は、ベース部材12の支持座部21に形成される円環状の溝部21aに配される。シール部材15は、押圧部材11と密着することにより、収容空間16を密閉する。 The seal member 15 is composed of an elastic member such as rubber (for example, an O-ring). As shown in FIGS. 4 and 5 , the seal member 15 is arranged in an annular groove 21 a formed in the support seat 21 of the base member 12 . The seal member 15 seals the accommodation space 16 by being in close contact with the pressing member 11 .

図8に示すように、シール部材15は、押圧部材11とベース部材12との間で、積層体LMを円形に囲むように構成される。シール部材15の円形状におけるその直径は、押圧部材11の直径よりも小さく、支持部材10の直径よりも大きい。 As shown in FIG. 8 , the sealing member 15 is configured to circularly surround the laminate LM between the pressing member 11 and the base member 12 . The diameter of the circular shape of the sealing member 15 is smaller than the diameter of the pressing member 11 and larger than the diameter of the supporting member 10 .

積層体LMの収容空間16は、押圧部材11と、ベース部材12と、シール部材15とによって形成される空間である。収容空間16は、ベース部材12の支持座部21に取り付けられたシール部材15に押圧部材11を密着させることにより、気密な状態となる。収容空間16には、積層体LM、支持部材10及び固定機構13が収容され得る。 The accommodation space 16 for the laminate LM is a space formed by the pressing member 11 , the base member 12 , and the sealing member 15 . The housing space 16 becomes airtight by bringing the pressing member 11 into close contact with the sealing member 15 attached to the support seat portion 21 of the base member 12 . The accommodation space 16 can accommodate the laminate LM, the support member 10 and the fixing mechanism 13 .

図4に示すように、気圧調整装置17は、ベース部材12に形成されるとともに、収容空間16内の気体を流出させる流路36と、この流路36に接続される配管37と、配管37の中途部に設けられる調整弁38と、ポンプ39とを主に備える。流路36は、ベース部材12の底部20に形成される吸引口36aと、ベース部材12の外面に形成される排気口36bとを含む。気圧調整装置17は、ポンプ39により収容空間16内の空気を吸引することで、収容空間16内の気圧を低下させ、収容空間16を大気に対して負圧にすることができる。 As shown in FIG. 4 , the atmospheric pressure adjustment device 17 is formed in the base member 12 and includes a channel 36 for discharging the gas in the housing space 16, a pipe 37 connected to the channel 36, and a pipe 37 It mainly includes a regulating valve 38 and a pump 39 provided in the middle of the . The flow path 36 includes a suction port 36 a formed in the bottom portion 20 of the base member 12 and an exhaust port 36 b formed in the outer surface of the base member 12 . The atmospheric pressure adjusting device 17 sucks the air in the housing space 16 with the pump 39 to lower the pressure in the housing space 16 and make the housing space 16 have a negative pressure with respect to the atmosphere.

レーザ照射装置9としては、半導体レーザを照射するものが好適に使用されるが、これに限らず、YAGレーザ、グリーンレーザ、超短パルスレーザ等の各種レーザを照射する装置を使用してもよい。 As the laser irradiation device 9, a device that emits a semiconductor laser is preferably used, but is not limited to this, and a device that emits various lasers such as a YAG laser, a green laser, and an ultrashort pulse laser may be used. .

以下、固定機構13によって支持部材10をベース部材12に固定する方法について説明する。まず、図10に示すように、固定部材25の軸部25bをベース部材12のねじ穴31に取り付けた状態で、支持部材10をベース部材12に対し、その上方から接近させる。その後、支持部材10を下降させつつ、図11及び図12に示すように、挿通孔26を固定部材25の頭部25a及び軸部25bに挿通する。この場合において、ベース部材12に取り付けられている弾性部材24の上端部が支持部材10の第二面10bに接触する。 A method for fixing the support member 10 to the base member 12 by the fixing mechanism 13 will be described below. First, as shown in FIG. 10, with the shaft portion 25b of the fixing member 25 attached to the screw hole 31 of the base member 12, the support member 10 is brought close to the base member 12 from above. Thereafter, while lowering the support member 10, the head portion 25a and the shaft portion 25b of the fixing member 25 are inserted through the insertion hole 26 as shown in FIGS. In this case, the upper end of the elastic member 24 attached to the base member 12 contacts the second surface 10b of the support member 10. As shown in FIG.

その後、固定部材25の頭部25aが図12に示すように支持部材10の第一面10aから突出するように、支持部材10を弾性部材24に押し付ける。弾性部材24は、弾性変形しながら収縮する。これにより、弾性部材24は、支持部材10を押し付ける力に抗する弾性復元力が生じる。 Thereafter, the support member 10 is pressed against the elastic member 24 so that the head portion 25a of the fixing member 25 protrudes from the first surface 10a of the support member 10 as shown in FIG. The elastic member 24 contracts while being elastically deformed. As a result, the elastic member 24 generates an elastic restoring force that resists the force that presses the support member 10 .

次に、頭部25aが突出した状態を維持しつつ、図11において矢印で示すように、支持部材10を平面視において反時計回りに回転させる。これにより、挿通孔26に挿通されていた軸部25bは、案内溝28を通じて係止凹部27に向かって相対的に移動する。図12において二点鎖線で示すように、案内溝28によって係止凹部27に向かって相対的に移動した固定部材25は、頭部25aが係止凹部27の上方に位置することとなる。 Next, while maintaining the protruding state of the head portion 25a, the support member 10 is rotated counterclockwise in plan view as indicated by the arrow in FIG. As a result, the shaft portion 25b that has been inserted through the insertion hole 26 relatively moves toward the locking recess portion 27 through the guide groove 28. As shown in FIG. As indicated by the two-dot chain line in FIG. 12 , the head portion 25 a of the fixing member 25 relatively moved toward the engaging recess 27 by the guide groove 28 is positioned above the engaging recess 27 .

その後、支持部材10を弾性部材24に押し付ける力を解除すると、弾性部材24の付勢力によって、支持部材10が押し上げられる。これにより、固定部材25の頭部25aが係止凹部27に入る。係止凹部27は、底面27bがこの頭部25aに接触することで固定部材25に係止される。この状態において、弾性部材24は自由長まで戻らず、弾性復元力により支持部材10を付勢し続けることが望ましい。 After that, when the force pressing the support member 10 against the elastic member 24 is released, the support member 10 is pushed up by the biasing force of the elastic member 24 . As a result, the head portion 25 a of the fixing member 25 enters the locking recess 27 . The locking recess 27 is locked to the fixing member 25 by contacting the bottom surface 27b with the head 25a. In this state, it is desirable that the elastic member 24 does not return to its free length and that the elastic restoring force continues to urge the support member 10 .

弾性部材24が支持部材10を付勢する力は、固定部材25を軸心まわりに回転させ、軸心方向における頭部25aの位置を変更することで、調整することが可能である。この位置調整が可能となるように、固定部材25の軸部25bの端部は、ベース部材12に形成されるねじ穴31に底部に位置することなく、ねじ穴31の中途部に位置することが好ましい。 The force with which the elastic member 24 biases the support member 10 can be adjusted by rotating the fixing member 25 around the axis and changing the position of the head 25a in the axial direction. To enable this position adjustment, the end of the shaft portion 25b of the fixing member 25 should not be positioned at the bottom of the screw hole 31 formed in the base member 12, but should be positioned in the middle of the screw hole 31. is preferred.

支持部材10をベース部材12から取り外す際には、支持部材10を弾性部材24に対して押し付け、弾性部材24を収縮させるとともに、固定部材25の頭部25aが係止凹部27から出るように支持部材10を下方に移動させる。その後、支持部材10を平面視において時計回りに回転させる。これにより、固定部材25の軸部25bが案内溝28に係合する。その後、支持部材10と固定部材25の相対的な移動により、軸部25bは、挿通孔26に配置される。 When the support member 10 is removed from the base member 12, the support member 10 is pressed against the elastic member 24 to contract the elastic member 24, and the head portion 25a of the fixing member 25 is supported so as to protrude from the locking recess 27. Move member 10 downward. After that, the support member 10 is rotated clockwise in plan view. Thereby, the shaft portion 25 b of the fixing member 25 is engaged with the guide groove 28 . After that, the supporting member 10 and the fixing member 25 are moved relative to each other, so that the shaft portion 25b is arranged in the insertion hole 26. As shown in FIG.

次に、第一面10a側から第二面10b側に向かって固定部材25の頭部25aが挿通孔26を通過するように、支持部材10を持ち上げる。これにより、支持部材10は、ベース部材12から取り外される。 Next, the support member 10 is lifted so that the head portion 25a of the fixing member 25 passes through the insertion hole 26 from the first surface 10a side toward the second surface 10b side. The support member 10 is thereby removed from the base member 12 .

上記のように、固定機構13によって、支持部材10をベース部材12に対する取り付け、又は取り外しを容易に行うことが可能となる。また、ねじ穴31に対する固定部材25の位置を調節することで、積層体LMの厚さに応じて、支持部材10の固定位置を調整することが可能となる。 As described above, the fixing mechanism 13 allows the support member 10 to be easily attached to or removed from the base member 12 . Further, by adjusting the position of the fixing member 25 with respect to the screw hole 31, it is possible to adjust the fixing position of the support member 10 according to the thickness of the laminate LM.

以下、上記構成の製造装置7を使用して接合体1を製造する方法について、図13乃至図17を参照しながら説明する。図13に示すように、本方法は、積層工程S1と、接合工程S2とを備える。 A method of manufacturing the joined body 1 using the manufacturing apparatus 7 having the above configuration will be described below with reference to FIGS. 13 to 17. FIG. As shown in FIG. 13, the method includes a lamination step S1 and a bonding step S2.

図14に示すように、積層工程S1では、まず、第一基板2の第一主面2aと、第二基板3の第一主面3aとが対向するように、第一基板2と第二基板3とを重ね合わせる。なお、第一基板2の第一主面2aには、予め素子5が設置されている。素子5が封着材料6の内側に位置するように、第一基板2と第二基板3とが積層されることで、積層体LMが形成される。 As shown in FIG. 14, in the lamination step S1, first, the first substrate 2 and the second substrate 3 are placed so that the first main surface 2a of the first substrate 2 and the first main surface 3a of the second substrate 3 face each other. The substrate 3 is overlaid. In addition, the element 5 is installed in advance on the first main surface 2 a of the first substrate 2 . The laminate LM is formed by laminating the first substrate 2 and the second substrate 3 such that the element 5 is positioned inside the sealing material 6 .

図15に示すように、接合工程S2は、支持工程S21と、押圧工程S22と、レーザ照射工程S23とを備える。 As shown in FIG. 15, the joining step S2 includes a supporting step S21, a pressing step S22, and a laser irradiation step S23.

支持工程S21では、積層工程S1によって形成された積層体LMを支持装置8に装着する。すなわち、図16に示すように、まず、固定機構13によってベース部材12に取り付けられている支持部材10の収容部18に積層体LMを収容する。 In the supporting step S21, the laminate LM formed in the laminating step S1 is mounted on the supporting device 8. As shown in FIG. That is, as shown in FIG. 16 , first, the laminate LM is accommodated in the accommodation portion 18 of the support member 10 attached to the base member 12 by the fixing mechanism 13 .

図17に示すように、積層体LMの厚さ寸法TLMは、収容部18の深さ寸法Dよりも大きいことが好ましい。積層体LMは、第二基板3の厚さ方向の一部が収容部18から押圧部材11に向かって食み出るように収容部18に収容される。第二基板3の厚さ方向の一部が凹部から食み出る寸法PD1は、第二基板3の厚さ寸法Tの0.05~0.95倍(0.05T≦PD1≦0.95T)とされることが好ましい。 As shown in FIG. 17 , the thickness dimension TLM of the laminate LM is preferably larger than the depth dimension D of the accommodating portion 18 . The laminated body LM is accommodated in the accommodating portion 18 so that a portion of the second substrate 3 in the thickness direction protrudes from the accommodating portion 18 toward the pressing member 11 . The dimension PD1 at which a portion of the second substrate 3 in the thickness direction protrudes from the concave portion is 0.05 to 0.95 times the thickness dimension T of the second substrate 3 (0.05T≦PD1≦0.95T). It is preferable that

次に、押圧部材11をベース部材12の支持座部21に取り付けられているシール部材15に載置する。これにより、押圧部材11の第一面11aがシール部材15に接触する。この場合において、押圧部材11と、シール部材15と、積層体LMとが同心状になるように配されることが好ましい。また、この状態において、押圧部材11の第一面11aが積層体LMにおける第二基板3の第二主面3bに接触してもよい。 Next, the pressing member 11 is placed on the sealing member 15 attached to the support seat portion 21 of the base member 12 . As a result, the first surface 11 a of the pressing member 11 comes into contact with the sealing member 15 . In this case, it is preferable that the pressing member 11, the sealing member 15, and the laminate LM are arranged concentrically. Also, in this state, the first surface 11a of the pressing member 11 may come into contact with the second main surface 3b of the second substrate 3 in the laminate LM.

その後、ベース部材12における壁部19の端面19aに枠体14を載せ、固定部材22によって枠体14を壁部19に固定する。すなわち、枠体14の挿通孔32をベース部材12の壁部19のねじ穴23に一致させ、固定部材22の軸部22bを挿通孔32に挿通した後にねじ穴23に係合させ、固定部材22を締め付ける。この状態において、枠体14は、シール部材15とともに押圧部材11を挟持する。また、枠体14の開口部35は、押圧部材11の第二面11bの一部をレーザ照射装置9に向かって露出させる。これにより、積層体LMの支持装置8への装着が完了する。これにより、積層体LMは、支持部材10とともに収容空間16内に収容された状態となる。 After that, the frame 14 is placed on the end face 19 a of the wall portion 19 of the base member 12 , and the frame 14 is fixed to the wall portion 19 by the fixing member 22 . That is, the insertion hole 32 of the frame body 14 is aligned with the screw hole 23 of the wall portion 19 of the base member 12, the shaft portion 22b of the fixing member 22 is inserted through the insertion hole 32 and then engaged with the screw hole 23, and the fixing member is mounted. Tighten 22. In this state, the frame 14 sandwiches the pressing member 11 together with the sealing member 15 . Further, the opening 35 of the frame 14 exposes a part of the second surface 11 b of the pressing member 11 toward the laser irradiation device 9 . This completes the attachment of the laminate LM to the supporting device 8 . As a result, the laminated body LM is housed in the housing space 16 together with the support member 10 .

なお、支持工程S21において、収容空間16内には、例えばドライエアが充填されてもよい。ドライエアとは、乾燥処理により水分が除去された気体をいい、圧力が変動しても水が生じない気体を意味する。ドライエアとしては、例えば、製造装置7が配された環境の気体を乾燥したものや高純度の窒素ガス等を使用することができる。 In addition, in the supporting step S21, the accommodation space 16 may be filled with, for example, dry air. Dry air is a gas from which moisture has been removed by drying, and means a gas that does not generate water even if the pressure fluctuates. As the dry air, for example, a dried gas in the environment where the manufacturing apparatus 7 is arranged, high-purity nitrogen gas, or the like can be used.

例えばドライエアが満たされた作業空間に支持装置8を配置し、この作業空間内で上記の支持工程S21を行うことで、収容空間16内に充填されることが好ましい。これにより収容空間16内だけでなく、積層体LMにおける第一基板2と第二基板3との間であって、封着材料6の内側の空間(素子5の収容空間)にもドライエアが充填されることになる。 For example, it is preferable that the storage space 16 is filled with the supporting device 8 in a working space filled with dry air and performing the supporting step S21 in the working space. As a result, the dry air fills not only the accommodation space 16 but also the space inside the sealing material 6 (accommodation space of the element 5) between the first substrate 2 and the second substrate 3 in the laminate LM. will be

その後の押圧工程S22では、収容空間16内の気体を、気圧調整装置17の流路36を通じてポンプ39により吸引し、外部に排出する。これにより、収容空間16の気圧が低下し、大気に対し負圧となる。この負圧の作用により、押圧部材11の第一面11aは、シール部材15に密着するとともに積層体LMの第二基板3を押圧する。なお、押圧工程S22では、調整弁38を操作することにより、収容空間16内の圧力を調整することができる。収容空間16の気圧は、好ましくは100~95,000Pa、より好ましくは1,000~85,000Paである。 In the subsequent pressing step S22, the gas in the housing space 16 is sucked by the pump 39 through the flow path 36 of the air pressure adjusting device 17 and discharged to the outside. As a result, the air pressure in the accommodation space 16 is lowered to become a negative pressure with respect to the atmosphere. Due to the action of this negative pressure, the first surface 11a of the pressing member 11 is brought into close contact with the sealing member 15 and presses the second substrate 3 of the laminate LM. In addition, in the pressing step S22, the pressure in the accommodation space 16 can be adjusted by operating the adjustment valve . The atmospheric pressure of the housing space 16 is preferably 100-95,000 Pa, more preferably 1,000-85,000 Pa.

押圧工程S22において、押圧部材11は、収容空間16の大気に対する負圧の作用により、積層体LMを押圧するように撓むことが好ましい。 In the pressing step S<b>22 , it is preferable that the pressing member 11 bends so as to press the laminate LM due to the action of the negative pressure against the atmosphere in the housing space 16 .

図4に示すように、レーザ照射工程S23では、レーザ照射装置9からレーザ光Lを積層体LMの封着材料6に照射することにより、この封着材料6を加熱する(加熱工程)。レーザ光Lは、押圧部材11及び第二基板3を透過して封着材料6に照射される。接合工程S2では、レーザ光Lの照射により封着材料6の軟化点以上の温度又は封着材料6が軟化流動する温度で封着材料6を加熱する。レーザ光Lは、封着材料6の閉曲線に沿って周回するように照射される。 As shown in FIG. 4, in the laser irradiation step S23, the sealing material 6 of the laminate LM is heated by irradiating the sealing material 6 of the laminate LM with the laser light L from the laser irradiation device 9 (heating step). The laser light L is transmitted through the pressing member 11 and the second substrate 3 to irradiate the sealing material 6 . In the bonding step S2, the sealing material 6 is heated by irradiation with the laser light L to a temperature equal to or higher than the softening point of the sealing material 6 or to a temperature at which the sealing material 6 softens and flows. The laser light L is irradiated so as to circulate along the closed curve of the sealing material 6 .

レーザ光Lの波長は、600~1600nmであることが好ましい。使用されるレーザとしては、半導体レーザが好適に使用されるが、これに限らず、YAGレーザ、グリーンレーザ、超短パルスレーザ等の各種レーザを使用してもよい。 The wavelength of the laser light L is preferably 600-1600 nm. As a laser to be used, a semiconductor laser is preferably used, but not limited to this, various lasers such as a YAG laser, a green laser, and an ultrashort pulse laser may be used.

レーザ光Lにより加熱されることで、封着材料6は、軟化流動し、その後に固化する。これにより、第一基板2と第二基板3とを気密に接合する封着層4が形成される。以上により、第一基板2、第二基板3及び封着層4を備える接合体1が製造される。接合体1は、枠体14及び押圧部材11がベース部材12から取り外された後に、支持部材10から取り外される。 By being heated by the laser light L, the sealing material 6 softens and flows, and then solidifies. Thereby, the sealing layer 4 that airtightly joins the first substrate 2 and the second substrate 3 is formed. As described above, the joined body 1 including the first substrate 2, the second substrate 3, and the sealing layer 4 is manufactured. The joined body 1 is removed from the support member 10 after the frame 14 and the pressing member 11 are removed from the base member 12 .

以上説明した本実施形態に係る接合体1の製造方法及び製造装置7によれば、支持装置8の押圧部材11を円形に構成し、この押圧部材11とベース部材12との間で、シール部材15を、積層体LMを円形に囲むように構成することで、従来のように押圧部材(治具本体用蓋体)及びシール部材(パッキング材)が四角形状とされた場合と比較して、積層体LMに対する押圧部材11の押圧力のばらつきを可及的に低減することができる。これにより、積層体LMにおける封着材料6と各基板2,3との密着が不十分な部分が発生することによる接合不良を低減することが可能となる。 According to the manufacturing method and the manufacturing apparatus 7 of the joined body 1 according to the present embodiment described above, the pressing member 11 of the supporting device 8 is formed in a circular shape, and the sealing member 11 is formed between the pressing member 11 and the base member 12. 15 so as to enclose the laminated body LM in a circular shape, compared to the conventional case where the pressing member (jig main body cover) and the sealing member (packing material) are rectangular, Variation in the pressing force of the pressing member 11 against the laminate LM can be reduced as much as possible. As a result, it is possible to reduce defective bonding due to the occurrence of portions where the adhesion between the sealing material 6 and the substrates 2 and 3 in the laminate LM is insufficient.

図18乃至図22は、本発明の第二実施形態を示す。本実施形態では、積層体LMの構成、及び製造装置7の支持装置8の構成が第一実施形態と異なる。 Figures 18-22 show a second embodiment of the invention. In this embodiment, the configuration of the laminate LM and the configuration of the supporting device 8 of the manufacturing apparatus 7 are different from those of the first embodiment.

図18に示すように、支持装置8の押圧部材11は、支持部材10の収容部18に挿入される凸部40を有する。凸部40は、押圧部材11の第一面11aに形成されている。凸部40は円柱状に構成されるが、この形状に限定されない。凸部40の突出寸法PD2は、収容部18の深さ寸法Dよりも小さい(図21参照)。凸部40は、積層体LMの第二基板3の第二主面3bに面接触する押圧面41を有する。 As shown in FIG. 18 , the pressing member 11 of the support device 8 has a convex portion 40 that is inserted into the housing portion 18 of the support member 10 . The convex portion 40 is formed on the first surface 11 a of the pressing member 11 . The convex portion 40 is configured in a columnar shape, but is not limited to this shape. A projection dimension PD2 of the convex portion 40 is smaller than a depth dimension D of the accommodating portion 18 (see FIG. 21). The convex portion 40 has a pressing surface 41 that is in surface contact with the second main surface 3b of the second substrate 3 of the laminate LM.

図19に示すように、支持装置8の支持部材10は、平面視円形状の収容部18を有する。積層体LMは、この収容部18に係合するように、平面視円形状に構成される(図示省略)。すなわち、積層体LMの第一基板2及び第二基板3は、円板状に構成される。 As shown in FIG. 19, the support member 10 of the support device 8 has a housing portion 18 that is circular in plan view. The laminated body LM is formed in a circular shape in plan view so as to be engaged with the accommodating portion 18 (not shown). That is, the first substrate 2 and the second substrate 3 of the laminate LM are configured in a disc shape.

図18乃至図22に示すように、固定機構13は、第一実施形態と同じ弾性部材24及び固定部材25の他、支持部材10に形成される、挿通孔26及び係止凹部27を有する。なお、本実施形態に係る支持部材10には、第一実施形態における案内溝28が形成されていない。 As shown in FIGS. 18 to 22, the fixing mechanism 13 has the same elastic member 24 and fixing member 25 as in the first embodiment, as well as insertion holes 26 and locking recesses 27 formed in the support member 10 . Note that the guide groove 28 in the first embodiment is not formed in the support member 10 according to the present embodiment.

挿通孔26の直径は、固定部材25の軸部25bの直径よりも大きく、頭部25aの直径よりも小さい。したがって、挿通孔26は、固定部材25の軸部25bを挿通させることはできるが、頭部25aを通過させることができない。 The diameter of the insertion hole 26 is larger than the diameter of the shaft portion 25b of the fixing member 25 and smaller than the diameter of the head portion 25a. Therefore, the insertion hole 26 allows the shaft portion 25b of the fixing member 25 to pass therethrough, but cannot allow the head portion 25a to pass therethrough.

係止凹部27は、第一実施形態と同様に、平面視円形の側壁面27aと、固定部材25の頭部25aを係止する底面27bとを有する。係止凹部27は、平面視において挿通孔26と同心状に形成される。 The engaging recess 27 has a circular side wall surface 27a in plan view and a bottom surface 27b for engaging the head portion 25a of the fixing member 25, as in the first embodiment. The locking recess 27 is formed concentrically with the insertion hole 26 in plan view.

本実施形態に係る支持部材10は、以下のようにしてベース部材12に取り付けられる。まず、図20に示すように、固定機構13の固定部材25をベース部材12のねじ穴31から取り外した状態で、支持部材10をベース部材12に取り付けられている弾性部材24に載置する。 The support member 10 according to this embodiment is attached to the base member 12 as follows. First, as shown in FIG. 20 , the support member 10 is placed on the elastic member 24 attached to the base member 12 with the fixing member 25 of the fixing mechanism 13 removed from the screw hole 31 of the base member 12 .

次に、平面視において、支持部材10の挿通孔26と、ベース部材12のねじ穴31と一致させ、挿通孔26に固定部材25の軸部25bを挿通する。その後、この軸部25bをねじ穴31に係合させる。これにより、固定部材25の頭部25aは、係止凹部27の底面27bに接触し、支持部材10を係止する。以上により、支持部材10は、固定機構13によってベース部材12に固定される。 Next, in plan view, the insertion hole 26 of the support member 10 and the screw hole 31 of the base member 12 are aligned with each other, and the shaft portion 25b of the fixing member 25 is inserted through the insertion hole 26 . After that, the shaft portion 25b is engaged with the screw hole 31. As shown in FIG. As a result, the head portion 25a of the fixing member 25 contacts the bottom surface 27b of the locking recess 27 to lock the support member 10. As shown in FIG. As described above, the support member 10 is fixed to the base member 12 by the fixing mechanism 13 .

図18、図21及び図22に示すように、支持装置8は、収容部18に係合する調整板42を備える。本実施形態では、一枚の調整板42を例示するが、複数の調整板42を使用してもよい。調整板42は、例えば円形のガラス板又は金属板により構成される。調整板42は、収容部18の底部に載置されることにより、収容部18の深さを調整する。この使用態様に限らず、調整板42を透明なガラス板とし、収容部18に収容された積層体LMにおける第二基板3の第二主面3bにこの調整板42を重ねて使用してもよい。 As shown in FIGS. 18, 21 and 22, the support device 8 comprises an adjustment plate 42 that engages the housing 18. As shown in FIGS. Although one adjustment plate 42 is illustrated in this embodiment, a plurality of adjustment plates 42 may be used. The adjusting plate 42 is composed of, for example, a circular glass plate or metal plate. The adjustment plate 42 adjusts the depth of the housing portion 18 by being placed on the bottom portion of the housing portion 18 . In addition to this usage mode, the adjustment plate 42 may be a transparent glass plate and may be used by overlapping the adjustment plate 42 on the second main surface 3b of the second substrate 3 in the laminate LM accommodated in the accommodation portion 18. good.

本実施形態に係る固定機構13及び調整板42は、第一実施形態の支持装置8に使用してもよい。 The fixing mechanism 13 and the adjusting plate 42 according to this embodiment may be used in the supporting device 8 according to the first embodiment.

以下、本実施形態に係る接合体の製造方法において、第一実施形態と異なる点について説明する。図21に示すように、本実施形態に係る接合体の製造方法では、支持工程S21において、支持部材10の収容部18に調整板42と収容し、その後、積層体LMをこの収容部18に収容する。 Differences from the first embodiment in the method for manufacturing a joined body according to the present embodiment will be described below. As shown in FIG. 21, in the method of manufacturing a joined body according to the present embodiment, in the supporting step S21, the adjustment plate 42 is accommodated in the accommodation portion 18 of the support member 10, and then the laminate LM is placed in the accommodation portion 18. accommodate.

図22に示すように、本実施形態に係る収容部18の深さ寸法Dは、積層体LMの厚さ寸法TLMよりも大きい。このため、積層体LMは、第二基板3の一部が収容部18から食み出ることもなく、その全てが収容部18に収容される。 As shown in FIG. 22, the depth dimension D of the accommodating portion 18 according to the present embodiment is larger than the thickness dimension TLM of the laminate LM. Therefore, the second substrate 3 of the laminate LM is entirely accommodated in the accommodation portion 18 without protruding from the accommodation portion 18 .

次に、押圧部材11をベース部材12に取り付けられたシール部材15に載置する。このとき、押圧部材11の凸部40は、支持部材10の収容部18に挿入される。凸部40の押圧面41は、収容部18に収容された積層体LMにおける第二基板3の第二主面3bに接触する。 Next, the pressing member 11 is placed on the sealing member 15 attached to the base member 12 . At this time, the convex portion 40 of the pressing member 11 is inserted into the accommodating portion 18 of the supporting member 10 . The pressing surface 41 of the convex portion 40 contacts the second main surface 3b of the second substrate 3 in the laminate LM accommodated in the accommodation portion 18 .

押圧工程S22において、この押圧面41は、積層体LMの第二基板3を押圧する。その後のレーザ照射工程S23において、レーザ光Lは、押圧部材11の凸部40及び積層体LMの第二基板3を透過して、封着材料6に照射される。 In the pressing step S22, the pressing surface 41 presses the second substrate 3 of the laminate LM. In the subsequent laser irradiation step S<b>23 , the laser light L is transmitted through the convex portion 40 of the pressing member 11 and the second substrate 3 of the laminate LM, and is irradiated onto the sealing material 6 .

本実施形態におけるその他の構成は、第一実施形態と同じである。本実施形態において第一実施形態と同じ構成要素には、共通の符号を付している。 Other configurations in this embodiment are the same as those in the first embodiment. In this embodiment, the same reference numerals are given to the same components as in the first embodiment.

なお、本発明は、上記実施形態の構成に限定されるものではなく、上記した作用効果に限定されるものでもない。本発明は、本発明の要旨を逸脱しない範囲で種々の変更が可能である。 In addition, the present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. Various modifications can be made to the present invention without departing from the gist of the present invention.

1 接合体
2 第一基板
3 第二基板
4 封着層
6 封着材料
8 支持装置
10 支持部材
11 押圧部材
12 ベース部材
15 シール部材
16 収容空間
17 気圧調整装置
18 収容部
L レーザ光
LM 積層体
PD1 第二基板の厚さ方向の一部が収容部から食み出る寸法
S1 積層工程
S2 接合工程
S21 支持工程
S22 押圧工程
S23 レーザ照射工程
1 Joined Body 2 First Substrate 3 Second Substrate 4 Sealing Layer 6 Sealing Material 8 Supporting Device 10 Supporting Member 11 Pressing Member 12 Base Member 15 Sealing Member 16 Accommodation Space 17 Atmospheric Pressure Adjustment Device 18 Accommodation Part L Laser Light LM Laminate PD1 Dimension in which part of the thickness direction of the second substrate protrudes from the accommodating portion S1 Lamination step S2 Bonding step S21 Supporting step S22 Pressing step S23 Laser irradiation step

Claims (9)

第一基板と、第二基板と、前記第一基板と前記第二基板とを接合する封着層と、を備える接合体を製造する方法であって、
前記第一基板と前記第二基板との間に封着材料を介在させるとともに、前記第一基板と前記第二基板とを重ね合わせることにより積層体を形成する積層工程と、前記積層体における前記封着材料にレーザ光を照射することにより前記封着層を形成する接合工程と、を備え、
前記接合工程は、前記積層体を支持装置に装着する支持工程と、前記積層体を押圧する押圧工程と、前記封着材料に前記レーザ光を照射するレーザ照射工程と、を備え、
前記支持装置は、前記積層体を押圧する押圧部材と、前記押圧部材を支持するベース部材と、前記押圧部材と前記ベース部材との間に配されるシール部材と、前記押圧部材と前記ベース部材との間に形成される、前記積層体の収容空間と、前記収容空間の気圧を調整する気圧調整装置と、を備え、
前記押圧部材は、円形に構成される透明なガラス板であり、
前記シール部材は、前記押圧部材と前記ベース部材との間で、前記積層体を円形に囲むように構成されており、
前記押圧工程では、前記気圧調整装置によって前記収容空間の気圧を低下させることで、前記押圧部材を前記シール部材に密着させ、かつ前記押圧部材によって前記積層体を押圧することを特徴とする接合体の製造方法。
A method for manufacturing a joined body comprising a first substrate, a second substrate, and a sealing layer that joins the first substrate and the second substrate,
a lamination step of forming a laminate by interposing a sealing material between the first substrate and the second substrate and overlapping the first substrate and the second substrate to form a laminate; a bonding step of forming the sealing layer by irradiating the sealing material with a laser beam,
The bonding step includes a supporting step of mounting the laminate on a support device, a pressing step of pressing the laminate, and a laser irradiation step of irradiating the sealing material with the laser beam,
The support device includes a pressing member that presses the laminate, a base member that supports the pressing member, a seal member disposed between the pressing member and the base member, and the pressing member and the base member. An accommodation space for the laminate formed between and an air pressure adjustment device for adjusting the air pressure in the accommodation space,
The pressing member is a circular transparent glass plate,
The sealing member is configured to circularly surround the laminate between the pressing member and the base member,
In the pressing step, the air pressure in the housing space is reduced by the air pressure adjusting device, thereby bringing the pressing member into close contact with the sealing member and pressing the laminate by the pressing member. manufacturing method.
前記支持装置は、前記収容空間内で前記積層体を支持する支持部材を備え、
前記支持部材は、前記積層体を収容する収容部を有し、
前記支持工程では、前記第一基板を前記収容部に収容するとともに、前記第二基板の厚さ方向の一部が前記収容部から前記押圧部材に向かって食み出るように前記第二基板を前記収容部に収容する請求項1に記載の接合体の製造方法。
The support device includes a support member that supports the laminate within the accommodation space,
The support member has an accommodation portion that accommodates the laminate,
In the supporting step, the first substrate is accommodated in the accommodating portion, and the second substrate is moved so that a portion of the second substrate in the thickness direction protrudes from the accommodating portion toward the pressing member. 2. The method for manufacturing a joined body according to claim 1, wherein the joined body is accommodated in the accommodating portion.
前記第二基板の厚さ方向の一部が前記収容部から食み出る寸法は、前記第二基板の厚さ寸法の0.05~0.95倍である請求項2に記載の接合体の製造方法。 3. The joined body according to claim 2, wherein a dimension in which a portion of said second substrate in the thickness direction protrudes from said accommodating portion is 0.05 to 0.95 times the thickness dimension of said second substrate. Production method. 前記収容空間の気圧を100~95,000Paとする請求項1から3のいずれか一項に記載の接合体の製造方法。 4. The method for manufacturing a joined body according to any one of claims 1 to 3, wherein the air pressure in the housing space is 100 to 95,000 Pa. 前記押圧部材の厚さは、3~10mmである請求項1から4のいずれか一項に記載の接合体の製造方法。 5. The method for manufacturing a joined body according to claim 1, wherein the pressing member has a thickness of 3 to 10 mm. 前記押圧部材のヤング率は、50~80GPaである請求項1から5のいずれか一項に記載の接合体の製造方法。 6. The method for manufacturing a joined body according to claim 1, wherein the pressing member has a Young's modulus of 50 to 80 GPa. 前記支持工程において、前記収容空間にドライエアが充填される請求項1から6のいずれか一項に記載の接合体の製造方法。 7. The method of manufacturing a joined body according to claim 1, wherein dry air is filled in said accommodation space in said supporting step. 前記第一基板は、高熱伝導性基板であり、前記第二基板は、ガラス基板である請求項1から7のいずれか一項に記載の接合体の製造方法。 8. The method of manufacturing a joined body according to claim 1, wherein the first substrate is a high thermal conductive substrate, and the second substrate is a glass substrate. 第一基板と、第二基板と、前記第一基板と前記第二基板とを接合する封着層と、を備える接合体を製造する装置であって、
前記第一基板と前記第二基板との間に封着材料を介在させるとともに、前記第一基板と前記第二基板とを重ね合わせることにより構成される積層体を支持する支持装置と、前記積層体における前記封着材料にレーザ光を照射することにより前記封着層を形成するレーザ照射装置と、を備え、
前記支持装置は、前記積層体を押圧する押圧部材と、前記押圧部材を支持するベース部材と、前記押圧部材と前記ベース部材との間に配されるシール部材と、前記押圧部材と前記ベース部材との間に形成される、前記積層体の収容空間と、前記収容空間の気圧を調整する気圧調整装置と、を備え、
前記押圧部材は、円形に構成される透明なガラス板であり、
前記シール部材は、前記押圧部材と前記ベース部材との間で、前記積層体を円形に囲むように構成されており、
前記気圧調整装置によって前記収容空間の気圧を低下させることで、前記押圧部材を前記シール部材に密着させ、かつ前記押圧部材によって前記積層体を押圧するように構成されることを特徴とする接合体の製造装置。
An apparatus for manufacturing a bonded body comprising a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate,
a support device for supporting a laminate formed by interposing a sealing material between the first substrate and the second substrate and stacking the first substrate and the second substrate; and a laser irradiation device that forms the sealing layer by irradiating the sealing material in the body with a laser beam,
The support device includes a pressing member that presses the laminate, a base member that supports the pressing member, a seal member disposed between the pressing member and the base member, and the pressing member and the base member. An accommodation space for the laminate formed between and an air pressure adjustment device for adjusting the air pressure in the accommodation space,
The pressing member is a circular transparent glass plate,
The sealing member is configured to circularly surround the laminate between the pressing member and the base member,
A joined body characterized in that the press member is brought into close contact with the seal member by lowering the air pressure in the housing space by the air pressure adjustment device, and the press member presses the laminate. manufacturing equipment.
JP2021107850A 2021-06-29 2021-06-29 Manufacturing method of assembly, and manufacturing apparatus of assembly Pending JP2023005724A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021107850A JP2023005724A (en) 2021-06-29 2021-06-29 Manufacturing method of assembly, and manufacturing apparatus of assembly
PCT/JP2022/020545 WO2023276473A1 (en) 2021-06-29 2022-05-17 Method for producing joined body and device for producing joined body
KR1020237032727A KR20240026437A (en) 2021-06-29 2022-05-17 Conjugate manufacturing method and conjugate manufacturing device
CN202280032050.0A CN117355492A (en) 2021-06-29 2022-05-17 Method and apparatus for manufacturing joined body
TW111119646A TW202306199A (en) 2021-06-29 2022-05-26 Method for producing joined body and device for producing joined body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021107850A JP2023005724A (en) 2021-06-29 2021-06-29 Manufacturing method of assembly, and manufacturing apparatus of assembly

Publications (1)

Publication Number Publication Date
JP2023005724A true JP2023005724A (en) 2023-01-18

Family

ID=84691103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021107850A Pending JP2023005724A (en) 2021-06-29 2021-06-29 Manufacturing method of assembly, and manufacturing apparatus of assembly

Country Status (5)

Country Link
JP (1) JP2023005724A (en)
KR (1) KR20240026437A (en)
CN (1) CN117355492A (en)
TW (1) TW202306199A (en)
WO (1) WO2023276473A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6329540B2 (en) * 2012-08-22 2018-05-23 コーニング インコーポレイテッド Processing of flexible glass substrate and substrate laminate including flexible glass substrate and carrier substrate
TWI635959B (en) * 2016-11-15 2018-09-21 致伸科技股份有限公司 Evacuating lamination device and manufactoring method of evacuating lamination fingerprint recognition module thereof
JP6972661B2 (en) * 2017-05-29 2021-11-24 日本電気硝子株式会社 Manufacturing method of airtight package
JP7351136B2 (en) * 2019-08-14 2023-09-27 日本電気硝子株式会社 Joined body manufacturing method and joined body manufacturing apparatus
JP7388112B2 (en) * 2019-10-10 2023-11-29 日本電気硝子株式会社 Joined body manufacturing method and joined body manufacturing apparatus

Also Published As

Publication number Publication date
TW202306199A (en) 2023-02-01
CN117355492A (en) 2024-01-05
KR20240026437A (en) 2024-02-28
WO2023276473A1 (en) 2023-01-05

Similar Documents

Publication Publication Date Title
TWI291219B (en) Packaging for an interferometric modulator
JP6328207B2 (en) Hermetic sealing method and hermetic sealing device
JP6564206B2 (en) Light emitting device
US7834438B2 (en) Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device
JP6112016B2 (en) Substrate holder and substrate bonding apparatus
JP2012038819A (en) Semiconductor laser device and optical apparatus
JP2012163912A5 (en)
JP2007206337A (en) Manufacturing method of optical module
JP2007206336A (en) Optical module and manufacturing method thereof
JP2007305736A (en) Manufacturing method of optical module
WO2023276473A1 (en) Method for producing joined body and device for producing joined body
JP2007304311A (en) Optical module and its manufacturing method
WO2023276478A1 (en) Method for manufacturing joined body and device for manufacturing joined body
JP7351136B2 (en) Joined body manufacturing method and joined body manufacturing apparatus
US7350988B2 (en) Optical module and method of manufacturing the same
WO2021070769A1 (en) Bonded body manufacturing method and bonded body manufacturing device
JP2007142176A (en) Manufacturing method of optical module
JP7480313B2 (en) LED light emitting device and its manufacturing method
CN112047295A (en) Producing MEMS devices with glass covers and MEMS devices
JP5797863B1 (en) Joining member manufacturing apparatus and joining member manufacturing method
WO2017029842A1 (en) Bonding method, optical module manufacturing method, and optical module
JP4557133B2 (en) Semiconductor optical device
JP2001189553A (en) Bonding device for substrate and method for bonding substrate using the same
JP2008270672A (en) Mounting method
JP2007214369A (en) Semiconductor device package and its manufacturing method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240227