JPH08107272A - Junction method of electronic part and junction device used for the method - Google Patents

Junction method of electronic part and junction device used for the method

Info

Publication number
JPH08107272A
JPH08107272A JP26089594A JP26089594A JPH08107272A JP H08107272 A JPH08107272 A JP H08107272A JP 26089594 A JP26089594 A JP 26089594A JP 26089594 A JP26089594 A JP 26089594A JP H08107272 A JPH08107272 A JP H08107272A
Authority
JP
Japan
Prior art keywords
wiring
electrode
solder
laser light
reducing gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26089594A
Other languages
Japanese (ja)
Inventor
Osamu Kuwabara
治 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP26089594A priority Critical patent/JPH08107272A/en
Publication of JPH08107272A publication Critical patent/JPH08107272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To provide a junction method capable of performing efficient solder junction step using no flux at all in order to junction an electronic part with a wiring substrate. CONSTITUTION: The electrode 17 of a film carrier tape 16 is mounted on the wiring 13 of a wiring substrate 11 to be irradiated with laser beams while supporting the electrode 17 by a protrusion of a junction device. At this time, the junction part is fed with hydrogen gas mixed with argon to reduce the oxide film formed on the junction part. Through these procedures, solder junction step can be performed using no flux at all, thereby eliminating the cleaning step of a transparent member 22.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、電子部品の接合方法
及びそれに用いられる接合装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining electronic parts and a joining device used for the same.

【０００２】[0002]

【従来の技術】従来、この種の電子部品の接合方法とし
ては、例えば図６に示すような方法が知られている。こ
の方法では、まずＩＣチップ（図示省略する）が搭載さ
れたフィルムキャリアテープ１の所定の接続部分の樹脂
テープ２を除去して、その部分において銅箔パターンで
なる電極３の表裏両面を露出させたものを用意する。同
図中２Ａは、フィルムキャリアテープ１の接続部分の樹
脂テープ２が除去されて形成された孔２Ａである。ま
た、フィルムキャリアテープ１が接合される配線基板４
を用意する。この配線基板４は、絶縁基板５の表面に配
線６のパターンが形成されている。なお、この配線６に
おける接続部分（接続パッド）の表面には、ハンダメッ
キ層７が形成されている。ここで、フィルムキャリアテ
ープ１と配線基板４とを接合するに当たり、接続部分の
酸化を防止するために、配線基板４の接続部分の配線
（ハンダメッキ層７）６の表面にフラックス（図示省略
する）を塗布する。その後、フィルムキャリアテープ１
の電極３と、配線基板４の配線（接続パッドのハンダメ
ッキ層７）６とを当接させ、図６に示すように、ヒート
ブロック８で電極３を押えつつ加熱処理を施す。この方
法によって、ハンダメッキ層７が溶融し、やがて冷却さ
れることにより配線３、６どうしが固着されてフィルム
キャリアテープ１と配線基板４とが電気的に接続した状
態で接合される。2. Description of the Related Art Conventionally, as a method of joining electronic components of this type, for example, a method shown in FIG. 6 has been known. In this method, first, the resin tape 2 at a predetermined connection portion of the film carrier tape 1 on which an IC chip (not shown) is mounted is removed to expose both the front and back surfaces of the electrode 3 having a copper foil pattern at that portion. Prepare the items. In the figure, 2A is a hole 2A formed by removing the resin tape 2 at the connecting portion of the film carrier tape 1. Further, the wiring board 4 to which the film carrier tape 1 is joined
To prepare. In this wiring board 4, a pattern of wiring 6 is formed on the surface of an insulating substrate 5. A solder plating layer 7 is formed on the surface of the connection portion (connection pad) of the wiring 6. Here, when the film carrier tape 1 and the wiring board 4 are joined, a flux (not shown) is formed on the surface of the wiring (solder plating layer 7) 6 in the connection portion of the wiring board 4 in order to prevent oxidation of the connection portion. ) Is applied. After that, film carrier tape 1
The electrode 3 and the wiring (solder plating layer 7 of the connection pad) 6 of the wiring board 4 are brought into contact with each other, and as shown in FIG. 6, heat treatment is performed while pressing the electrode 3 with the heat block 8. By this method, the solder plating layer 7 is melted and then cooled, so that the wirings 3 and 6 are fixed to each other and the film carrier tape 1 and the wiring board 4 are electrically connected to each other.

【０００３】しかし、上記接合方法では、ヒ−トブロッ
ク８の位置がずれて、ヒートブロック８が樹脂テープ２
に接触すると樹脂テープ２を損傷させる問題がある。ま
た、ヒートブロック８で電極３を押えた状態で加熱と冷
却（ハンダの融点未満の温度まで）を行うため、接合に
時間を要する問題がある。そこで、これらの問題を解決
する接合方法として図７に示すような技術が知られてい
る。この従来技術は、上記した接合方法と同様なフィル
ムキャリアテープ１及び配線基板４を同様にフラックス
（図示せず）を塗布して当接させ、フィルムキャリアテ
ープ１の孔２Ａを覆うようにガラス板９を配置する。次
に、このガラス板９で樹脂テープ２を押えながらレーザ
光を電極３に照射することにより、電極３と配線６とを
ハンダ接合を行う。ここで、フラックスはフィルムキャ
リアテープ１に設けられた電極３の接続部分表面の酸化
膜を還元させて、ハンダとの密着性を良くするためのも
のである。However, in the above joining method, the position of the heat block 8 is displaced and the heat block 8 is replaced by the resin tape 2.
There is a problem that the resin tape 2 is damaged when it comes into contact with. In addition, since heating and cooling (up to a temperature lower than the melting point of solder) are performed while the electrode 3 is being held by the heat block 8, there is a problem that it takes time to join. Therefore, as a joining method for solving these problems, a technique as shown in FIG. 7 is known. In this conventional technique, a film carrier tape 1 and a wiring board 4 similar to the above-mentioned joining method are coated with flux (not shown) and brought into contact with each other, and a glass plate is formed so as to cover the hole 2A of the film carrier tape 1. Place 9 Next, by irradiating the electrode 3 with laser light while pressing the resin tape 2 with the glass plate 9, the electrode 3 and the wiring 6 are soldered. Here, the flux is for reducing the oxide film on the surface of the connection portion of the electrode 3 provided on the film carrier tape 1 to improve the adhesion to the solder.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、上記し
たレーザ照射による接合方法では、フラックスが配線基
板上に残存した場合、フラックスが空気中の水分を経時
的に吸収して導電性を持ち、この導電性を持ったフラッ
クスを介してハンダ接合部付近の隣接する電極間などで
ショ−トが発生する問題があった。このためハンダ接合
を行った後に残存するフラックスを洗浄する必要があっ
た。また、ガラス板９を接合部分の上に配置するため、
このガラス板９がともするとフラックスで汚れガラス板
９の光透過性が悪化し、レーザ光の透過量を減少させる
問題があった。このため、ハンダ接合の後にガラス板９
に付着したフラックスを除去するための洗浄工程が必要
となる場合があり、実装プロセスをコスト高にする弊害
があった。However, in the above-mentioned joining method by laser irradiation, when the flux remains on the wiring board, the flux absorbs moisture in the air over time and has conductivity. There has been a problem that shorts are generated between adjacent electrodes in the vicinity of the soldered joint through the flux having a property. For this reason, it is necessary to wash the residual flux after soldering. Further, since the glass plate 9 is arranged on the joint portion,
If this glass plate 9 is also attached, there is a problem that the light transmittance of the dirty glass plate 9 is deteriorated by the flux and the transmission amount of laser light is reduced. For this reason, the glass plate
There is a case where a cleaning step for removing the flux attached to the wafer may be required, which has a bad effect on increasing the cost of the mounting process.

【０００５】この発明が解決しようとする課題は、電子
部品と配線基板とを接合するのに、フラックスを用いず
に能率のよいハンダ接合が行える方法と、接合装置とを
得るには、どのような手段を講じればよいかという点に
ある。The problem to be solved by the present invention is to provide a method and a joining device for efficiently soldering an electronic component and a wiring board without using flux. There is a point that should be taken.

【０００６】[0006]

【課題を解決するための手段】そこで、請求項１記載の
発明は、電子部品の電極と配線基板の配線とをハンダを
用いて接合させる方法において、前記電極をハンダを介
して前記配線に当接するように支持し、該電極が該ハン
ダを介して該配線に当接する部分に還元性ガスを供給し
つつレーザ光を照射することを、その解決手段としてい
る。また、請求項２記載の発明は、前記レ−ザ光の照射
終了後も前記還元性ガスの供給を所定時間継続すること
を特徴としている。また、請求項３記載の発明は、前記
還元性ガスは不活性ガスに混ぜて供給されることを特徴
としている。さらに、請求項４記載の発明は、電子部品
の電極をハンダを介して配線基板の配線に当接させる押
え手段と、該電極が該ハンダを介して該配線に当接する
部分にレーザ光を照射するレーザ光照射手段と、該当接
部分に還元性ガスを供給する還元性ガス供給手段と、を
備えることを、解決手段としている。またさらに、請求
項５記載の発明は、前記押え部材を透明部材の一端部に
突出するように設け、前記レーザ光照射手段から照射さ
れるレーザ光を該透明部材の他端部側から該一端部側に
透過させ前記当接部分にレーザ光を照射させることを特
徴としている。また、請求項６記載の発明は、前記還元
性ガス供給手段は前記透明部材に設けられたガス供給路
を有することを特徴としている。In view of the above, the invention according to claim 1 is a method of joining electrodes of an electronic component and wiring of a wiring board by using solder, in which the electrode is applied to the wiring through the solder. The solution is to irradiate with laser light while supporting the electrodes in contact with each other and supplying the reducing gas to the portion where the electrode contacts the wiring through the solder. The invention according to claim 2 is characterized in that the supply of the reducing gas is continued for a predetermined time even after the irradiation of the laser light is completed. Further, the invention according to claim 3 is characterized in that the reducing gas is supplied by being mixed with an inert gas. Further, according to the invention of claim 4, a pressing means for bringing the electrode of the electronic component into contact with the wiring of the wiring substrate through the solder, and a portion where the electrode comes into contact with the wiring through the solder are irradiated with laser light. The solution means is to provide the laser light irradiating means and the reducing gas supply means for supplying the reducing gas to the contact portion. Still further, in the invention according to claim 5, the pressing member is provided so as to project from one end of the transparent member, and the laser light emitted from the laser light irradiating means is applied from the other end side of the transparent member to the one end. It is characterized in that the laser light is transmitted to the side and the contact portion is irradiated with laser light. Further, the invention according to claim 6 is characterized in that the reducing gas supply means has a gas supply path provided in the transparent member.

【０００７】[0007]

【作用】請求項１記載の発明においては、電子部品の電
極を配線基板の配線に当接させた状態でレーザ光を照射
するため、ハンダを瞬時に溶融させる作用がある。ま
た、レーザ光の照射を受けた部分のみが加熱されるた
め、電極と配線との当接部分のの周囲の余熱による影響
を受けず、冷却速度が従来のヒートブロックに比べて速
くなる。そして、レーザ光照射の際に、還元性ガスを電
極と配線との当接部分に供給するため、ハンダ接合が行
われる際にこの部分の表面の酸化膜を還元させて、ハン
ダの密着性が向上する作用がある。加えて、レーザ光の
照射を停止した後も、還元性ガスの供給を行えば、接合
部分を冷却して固化を速める作用も奏する。また、請求
項２記載の発明においては、レ−ザ光照射終了後も還元
性ガスの供給を所定時間継続することにより、レ−ザ光
照射により溶融したハンダを還元性ガスで早期に冷却す
る作用を奏する。さらに、請求項３記載の発明におい
て、例えば水素（Ｈ2）を還元性ガスとして選択する場
合、この水素を例えばアルゴン（Ａｒ）などの不活性ガ
スに混ぜて用いることにより、水素の爆発を回避するこ
とができる。According to the first aspect of the invention, since the laser beam is applied in a state where the electrode of the electronic component is in contact with the wiring of the wiring board, there is an action of instantly melting the solder. Further, since only the portion irradiated with the laser beam is heated, the cooling speed becomes faster than that of the conventional heat block without being affected by the residual heat around the contact portion between the electrode and the wiring. Then, when the laser light is irradiated, a reducing gas is supplied to the contact portion between the electrode and the wiring. Therefore, when soldering is performed, the oxide film on the surface of this portion is reduced to improve the solder adhesion. Has the effect of improving. In addition, if the reducing gas is supplied even after the irradiation of the laser beam is stopped, the bonding portion is cooled and solidification is accelerated. Further, in the invention according to claim 2, by continuing the supply of the reducing gas for a predetermined time even after the laser light irradiation is completed, the solder melted by the laser light irradiation is cooled early by the reducing gas. Play an action. Further, in the invention according to claim 3, for example, when hydrogen (H 2 ) is selected as the reducing gas, by using this hydrogen mixed with an inert gas such as argon (Ar), the explosion of hydrogen is avoided. can do.

【０００８】また、請求項４記載の発明においては、押
え手段が、電子部品の電極を配線基板の配線に当接させ
た状態で支持する作用を有する。そして、請求項５記載
の発明においては、押え手段で支持した状態で、レーザ
光を透明部材を介して電極と配線との当接部に照射する
作用を有する。さらに、還元性ガス供給手段により、還
元性ガスを上記当接部に供給することにより、該当接部
の表面の酸化膜を還元させる作用を有する。このため、
ハンダ接合の際にフラックスを用いる必要がなくなる。
また、請求項６記載の発明においては、還元性ガスを前
記透明部材に設けたガス供給路を介して供給することに
より、接合装置のコンパクト化を図ることができる。Further, in the invention as set forth in claim 4, the holding means has a function of supporting the electrode of the electronic component in a state of being brought into contact with the wiring of the wiring board. Further, in the invention according to claim 5, it has an effect of irradiating the contact portion between the electrode and the wiring with the laser beam through the transparent member while being supported by the holding means. Furthermore, by supplying reducing gas to the contact portion by the reducing gas supply means, it has an action of reducing the oxide film on the surface of the contact portion. For this reason,
There is no need to use flux when soldering.
In the invention according to claim 6, the reducing device can be made compact by supplying the reducing gas through the gas supply passage provided in the transparent member.

【０００９】[0009]

【実施例】以下、この発明に係る電子部品の接合方法及
びその接合装置の詳細を図面に示す実施例に基づいて説
明する。 （実施例１）本実施例は、ＩＣチップを搭載したフィル
ムキャリアテープの一端部が液晶パネル側に接合したも
のを用意し、このフィルムキャリアテープの他端部を配
線基板にハンダを用いて接合させる場合に本発明を適用
した例である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the method for joining electronic parts and the joining apparatus therefor according to the present invention will be described below with reference to the embodiments shown in the drawings. (Example 1) In this example, a film carrier tape having an IC chip mounted, one end of which is bonded to the liquid crystal panel side, is prepared, and the other end of the film carrier tape is bonded to a wiring board by soldering. This is an example in which the present invention is applied to the case.

【００１０】本実施例の電子部品の接合方法は、まず、
図１に示すように、ステージ１０の上に、配線基板１１
と液晶パネル１２とを載置する。配線基板１１は、例え
ばガラスエポキシ、紙エポキシ、セラミックなどでなる
基板の表面に配線１３がパターン形成され、さらに配線
１３の接続パッド部の表面にはハンダメッキ層１４が形
成されている。液晶パネル１２の周辺部のＩＴＯ配線
（図示省略する）には、ＩＣチップ１５を搭載したフィ
ルムキャリアテープ１６の一端部の電極が、例えば異方
性導電接着剤により接続されている。ここで、フィルム
キャリアテープ１６の他端部の電極（接合リード）１７
が、配線基板１１表面の配線（接続パッド）１３の表面
のハンダメッキ層１４上に重なるように位置決めする。
なお、フィルムキャリアテープ１６は、樹脂テープ１８
の一側表面に銅箔パターンでなる電極１７を形成したも
のであり、配線基板１１の配線１３とハンダ接合させる
部分の樹脂テープ１８が除去してある。The method of joining electronic components of this embodiment is as follows.
As shown in FIG. 1, a wiring board 11 is provided on the stage 10.
And the liquid crystal panel 12 are mounted. The wiring board 11 has a wiring 13 patterned on the surface of a board made of, for example, glass epoxy, paper epoxy, or ceramic, and a solder plating layer 14 is formed on the surface of the connection pad portion of the wiring 13. An electrode at one end of the film carrier tape 16 on which the IC chip 15 is mounted is connected to the ITO wiring (not shown) in the peripheral portion of the liquid crystal panel 12 by, for example, an anisotropic conductive adhesive. Here, the electrode (bonding lead) 17 at the other end of the film carrier tape 16
Are positioned so as to overlap the solder plating layer 14 on the surface of the wiring (connection pad) 13 on the surface of the wiring board 11.
The film carrier tape 16 is a resin tape 18
An electrode 17 having a copper foil pattern is formed on the surface on one side, and the resin tape 18 at a portion to be soldered to the wiring 13 of the wiring board 11 is removed.

【００１１】次に、フィルムキャリアテープ１６の他端
部の電極１７と配線基板１１の配線１３とを接合させる
部分の電極１７上に、図１に示すように接合装置１９を
載せてハンダ接合を行う。この接合装置１９は、レーザ
光２０を照射するレーザ光照射手段２１と、レーザ光２
０を透過させて電極１７と配線１３とを接合させる部分
にレーザ光２０を導く透明部材２２と、電極１７を配線
基板１１側に支持する押え手段としての押え板２３と、
還元性ガス供給手段としてのガス供給路２４とを備えて
いる。また、押え板２３と透明部材２２は、ホルダ２５
で一体的に支持されている。Next, as shown in FIG. 1, a joining device 19 is placed on the electrode 17 at the portion for joining the electrode 17 at the other end of the film carrier tape 16 and the wiring 13 of the wiring substrate 11 for solder joining. To do. This joining device 19 includes a laser light irradiation means 21 for irradiating a laser light 20 and a laser light 2
A transparent member 22 that guides the laser light 20 to a portion where 0 is transmitted and the electrode 17 and the wiring 13 are joined, and a holding plate 23 as a holding means for supporting the electrode 17 on the wiring substrate 11 side,
And a gas supply path 24 as a reducing gas supply means. In addition, the holding plate 23 and the transparent member 22 are attached to the holder 25.
It is integrally supported by.

【００１２】以下、図２〜図４を用いてこの接合装置の
構成の詳細を説明する。なお、図２は接合装置１９の側
面図、図３は図２のＡ−Ａ断面図、図４は底面図であ
る。透明部材２２は、直方体形状の例えばガラス板でな
る。この透明部材２２の両側面のそれぞれには、還元性
ガスとしての水素（Ｈ2）と不活性ガスとしてのアルゴ
ン（Ａｒ）との混合ガスがホルダ２５側から導入される
ガス供給溝２６Ａ、２６Ｂが形成されている。ガス供給
溝２６Ａは、図２に示すように、透明部材２２の側面上
部に幅方向に渡って形成された１本の溝であり、ガス供
給溝２６Ｂは上記ガス供給溝２６Ａより透明部材側面の
下縁に向けて形成された５本の溝である。この透明部材
２２は、例えばセラミックでなる長方形状の押え板２
３、２３で挟まれ、さらにその上部外周をホルダ２５で
囲むことにより支持されている。この押え板２３は、透
明部材２２を挟んだ状態で透明部材２２の下端より下方
にやや突出する突出部２３Ａを有している。また、押え
板２３及びホルダ２５にはガス供給溝２６Ａに連通する
ガス供給路２４が形成されている。なお、ガス供給溝２
６Ａ、２６Ｂは押え板２３が溝を塞ぐためガス流通させ
る供給路となり、ホルダ２５のガス供給路２４側から供
給された還元性ガスを含む混合ガスを突出部２３Ａ側に
供給することができる。なお、ホルダ２５に形成された
ガス供給路２４は、図示しないが還元性ガス供給手段に
接続されている。なお、本実施例では、還元性ガスとし
て水素（Ｈ2）を用い、不活性ガスとしてアルゴン（Ａ
ｒ）を用いた。そして、この水素の混合率は３％とし
た。The details of the construction of this joining apparatus will be described below with reference to FIGS. 2 is a side view of the joining device 19, FIG. 3 is a sectional view taken along line AA of FIG. 2, and FIG. 4 is a bottom view. The transparent member 22 is, for example, a glass plate having a rectangular parallelepiped shape. Gas supply grooves 26A, 26B into which a mixed gas of hydrogen (H 2 ) as a reducing gas and argon (Ar) as an inert gas is introduced from the holder 25 side on each of both side surfaces of the transparent member 22. Are formed. As shown in FIG. 2, the gas supply groove 26A is one groove formed in the upper portion of the side surface of the transparent member 22 in the width direction, and the gas supply groove 26B is closer to the side surface of the transparent member than the gas supply groove 26A. It is five grooves formed toward the lower edge. The transparent member 22 is a rectangular holding plate 2 made of, for example, ceramic.
It is sandwiched between Nos. 3 and 23, and is supported by surrounding the upper outer periphery with a holder 25. The holding plate 23 has a protruding portion 23 </ b> A that slightly protrudes below the lower end of the transparent member 22 with the transparent member 22 sandwiched therebetween. Further, a gas supply passage 24 communicating with the gas supply groove 26A is formed in the holding plate 23 and the holder 25. The gas supply groove 2
6A and 26B are supply passages through which the holding plate 23 closes the groove to allow gas to flow, and mixed gas containing reducing gas supplied from the gas supply passage 24 side of the holder 25 can be supplied to the protruding portion 23A side. The gas supply path 24 formed in the holder 25 is connected to a reducing gas supply means (not shown). In this embodiment, hydrogen (H 2 ) is used as the reducing gas and argon (A 2 ) is used as the inert gas.
r) was used. Then, the mixing ratio of hydrogen was set to 3%.

【００１３】次に、本実施例で用いた接合装置１９の作
用、動作を説明する。配線基板１１の配線１３のハンダ
メッキ層１４上に重ねたフィルムキャリアテープ１６の
電極１７に、接合装置１９の押え板２３の突出部２３Ａ
を当接させて所定圧力で押圧する。そして、レーザ光照
射手段２１からレーザ光２０を照射させ、このレーザ光
２０を透明部材２２を介して、フィルムキャリアテープ
１６の電極１７と配線基板１１の配線１３上のハンダメ
ッキ層１４とが当接する部分に照射させる。これによ
り、ハンダメッキ層１４は溶融し、固化した際に電極１
７と配線１３とをハンダ接合させる。なお、本実施例で
は、レーザとして、金属の熱吸収率が高くビーム径を絞
ることのできるＹＡＧレーザを用いた。このとき、還元
性ガスと不活性ガスとの混合ガスをガス供給路２４より
導入することにより、この混合ガスがガス供給溝２６Ａ
及び２６Ｂを通って上記当接部分に供給される。する
と、混合ガス中の還元性ガスの作用により、ハンダ接合
部の表面の酸化膜が以下の反応式にしたがって還元され
る。 ＭＯ＋Ｈ2→Ｍ＋Ｈ2Ｏ （Ｍ：金属） この結果、接合部分のハンダとの密着性は向上する。こ
の場合、発生したＨ2Ｏは蒸発する。従って、本実施例
では接合部分にフラックスが不要となる。Next, the operation and operation of the joining device 19 used in this embodiment will be described. On the electrode 17 of the film carrier tape 16 overlaid on the solder plating layer 14 of the wiring 13 of the wiring board 11, the protruding portion 23A of the holding plate 23 of the joining device 19 is provided.
And abut with a predetermined pressure. Then, the laser beam 20 is emitted from the laser beam irradiating means 21, and the electrode 17 of the film carrier tape 16 and the solder plating layer 14 on the wiring 13 of the wiring substrate 11 are brought into contact with each other via the transparent member 22. Irradiate the contact area. As a result, the solder plating layer 14 is melted and when solidified, the electrode 1
7 and the wiring 13 are soldered to each other. In this example, a YAG laser having a high metal heat absorption coefficient and a narrow beam diameter was used as the laser. At this time, by introducing a mixed gas of a reducing gas and an inert gas from the gas supply passage 24, the mixed gas is supplied to the gas supply groove 26A.
And 26B to be supplied to the abutting portion. Then, due to the action of the reducing gas in the mixed gas, the oxide film on the surface of the solder joint is reduced according to the following reaction formula. MO + H 2 → M + H 2 O (M: metal) As a result, the adhesion of the joint portion to the solder is improved. In this case, the generated H 2 O evaporates. Therefore, in this embodiment, no flux is required at the joint.

【００１４】なお、電極１７を配線基板１１の配線１３
に当接させた状態でレーザ光を照射するため、ハンダを
瞬時に溶融させる作用がある。また、レーザ光の照射を
受けた部分のみが加熱されるため、電極１７と配線１３
との当接部分の周囲が余熱による影響を受けず、冷却速
度が従来のヒートブロックに比べて速くなる。また、レ
ーザ光の照射を停止した後も、還元性ガスの供給を所定
時間行えば、接合部分を冷却する作用を持ち、ハンダの
固化を速めることができる。さらに、上記したようにハ
ンダ接合の際にフラックスを用いる必要がなくなるた
め、透明部材２２をハンダ接合の都度洗浄する必要がな
くなる。そして、還元性ガスを含む混合ガスを前記透明
部材２２に設けたガス供給溝２６Ａ、２６Ｂを介して供
給することにより、接合装置のコンパクト化を図ること
ができた。The electrode 17 is connected to the wiring 13 of the wiring board 11.
Since the laser beam is applied in a state of being in contact with the solder, it has an action of instantly melting the solder. Further, since only the portion irradiated with the laser beam is heated, the electrode 17 and the wiring 13
The surroundings of the contact portion with and are not affected by the residual heat, and the cooling rate becomes faster than that of the conventional heat block. Further, even after the irradiation of the laser beam is stopped, if the reducing gas is supplied for a predetermined time, it has a function of cooling the joint portion and the solidification of the solder can be accelerated. Further, since it is not necessary to use the flux at the time of soldering as described above, it is not necessary to wash the transparent member 22 each time soldering is performed. By supplying the mixed gas containing the reducing gas through the gas supply grooves 26A and 26B provided in the transparent member 22, the joining device can be made compact.

【００１５】（実施例２）次に、本発明の実施例２につ
いて説明する。この実施例は、接合方法の手順及び接合
装置の構成は、上記実施例１とほぼ同様であるが、接合
装置の上下を逆にした例である。上記実施例１と同様の
部分は同一の符号を付して説明を省略する。本実施例に
おいては、レーザ光の照射によって溶融したハンダが、
重力によってフィルムキャリアテープ１６の電極１７の
側壁に回り込んでハンダフィレットができるため、ハン
ダ接合強度を高めることができる。なお、本実施例にお
ける作用、動作は、上記実施例１と同様である。(Second Embodiment) Next, a second embodiment of the present invention will be described. In this embodiment, the procedure of the joining method and the structure of the joining apparatus are almost the same as those of the first embodiment, but the joining apparatus is turned upside down. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, the solder melted by the laser irradiation is
Gravity wraps around the side wall of the electrode 17 of the film carrier tape 16 to form a solder fillet, so that the solder joint strength can be increased. The operation and operation of this embodiment are similar to those of the first embodiment.

【００１６】以上、実施例１及び実施例２について説明
したが、本発明はこれらに限定されるものではなく、構
成の要旨に付随する各種の設計変更が可能である。例え
ば、上記両実施例では、電子部品としてフィルムキャリ
アテープ１６を配線基板１１の配線１３にハンダ接合さ
せる例に本発明を適用して説明したが、電極にレーザ光
の照射が可能な電子部品であれば他のものにも適用する
ことが可能である。また、上記両実施例では、配線１３
にハンダメッキ層１４を形成したものを用いたが、各種
の形態をとるハンダを介して接合を行う場合にも本発明
を適用することが可能である。さらに、上記両実施例で
は、水素をアルゴンに３％の割合で混合したが、その混
合率を１〜５％程度の範囲とすることができる。また、
上記両実施例においては、混合ガスの回収手段が開示さ
れていないが、接合工程をガス排気手段を備えたチャン
バ内で行うなどの周知の各種方法が適用できる。さらに
また、上記両実施例では、直方体状の透明部材２２を用
いたが、電極と配線とに有効にレーザ光を導入できる形
状であればこれに限定されるものではない。なお、レー
ザ光を配線１３と電極１７との当接部に導入できる構造
であればガラスなどの透明部材を用いなくともよい。Although the first and second embodiments have been described above, the present invention is not limited to these, and various design changes associated with the gist of the configuration can be made. For example, in both of the above embodiments, the present invention is applied to the example in which the film carrier tape 16 is soldered to the wiring 13 of the wiring board 11 as an electronic component. However, the electronic component capable of irradiating the electrodes with laser light is described. If applicable, it can be applied to other things. Further, in both of the above embodiments, the wiring 13
Although the one having the solder plating layer 14 formed thereon is used, the present invention can be applied to the case where the joining is performed through the solder having various forms. Furthermore, in both of the above examples, hydrogen was mixed with argon at a ratio of 3%, but the mixing ratio can be set within a range of about 1 to 5%. Also,
Although neither means for collecting the mixed gas is disclosed in the above-mentioned embodiments, various well-known methods such as performing the bonding step in a chamber equipped with a gas exhaust means can be applied. Furthermore, although the transparent member 22 having a rectangular parallelepiped shape is used in both of the above-mentioned embodiments, the shape is not limited to this as long as the laser light can be effectively introduced into the electrode and the wiring. Note that a transparent member such as glass may not be used as long as the structure allows the laser light to be introduced into the contact portion between the wiring 13 and the electrode 17.

【００１７】[0017]

【発明の効果】以上の説明から明らかなように、この発
明によれば、電子部品と配線基板とを接合するのに、フ
ラックスを用いずに能率のよいハンダ接合が行える効果
を有する。また、フラックスを用いずにハンダ接合が行
えるため、接合装置の透明部材の洗浄が不要となり、実
装プロセスの低コスト化を図ることができる。As is clear from the above description, according to the present invention, there is an effect that the soldering can be performed efficiently without using the flux for joining the electronic component and the wiring board. In addition, since solder bonding can be performed without using flux, cleaning of the transparent member of the bonding device is not required, and the cost of the mounting process can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例１を示す断面図。FIG. 1 is a sectional view showing a first embodiment of the present invention.

【図２】本発明の実施例１における接合装置の側面図。FIG. 2 is a side view of the joining device according to the first embodiment of the present invention.

【図３】図２のＡ−Ａ断面図。FIG. 3 is a sectional view taken along line AA of FIG. 2;

【図４】本発明の実施例１における接合装置の底面図。FIG. 4 is a bottom view of the bonding apparatus according to the first embodiment of the present invention.

【図５】本発明の実施例２を示す断面図。FIG. 5 is a sectional view showing a second embodiment of the present invention.

【図６】従来例の断面図。FIG. 6 is a sectional view of a conventional example.

【図７】他の従来例の断面図。FIG. 7 is a sectional view of another conventional example.

【符号の説明】 １１ 配線基板 １３ 配線 １４ ハンダメッキ層 １６ フィルムキャリアテープ（電子部品） １７ 電極 １８ 樹脂テープ １９ 接合装置 ２０ レーザ光 ２１ レーザ光照射手段 ２２ 透明部材 ２３ 押え部材 ２３Ａ 突出部 ２４ ガス供給路 ２６Ａ，２６Ｂ ガス供給溝[Explanation of Codes] 11 Wiring Board 13 Wiring 14 Solder Plating Layer 16 Film Carrier Tape (Electronic Component) 17 Electrode 18 Resin Tape 19 Bonding Device 20 Laser Light 21 Laser Light Irradiation Means 22 Transparent Member 23 Holding Member 23A Projection 24 Gas Supply Channel 26A, 26B Gas supply groove

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 電子部品の電極と配線基板の配線とをハ
ンダを用いて接合させる方法において、 前記電極をハンダを介して前記配線に当接するように支
持し、該電極が該ハンダを介して該配線に当接する部分
に還元性ガスを供給しつつレーザ光を照射することを特
徴とする電子部品の接合方法。1. A method of joining an electrode of an electronic component and a wiring of a wiring board by using solder, wherein the electrode is supported so as to contact the wiring via the solder, and the electrode is supported via the solder. A method of joining electronic parts, characterized in that a reducing gas is supplied to a portion in contact with the wiring while irradiating laser light. 【請求項２】 前記レ−ザ光の照射終了後も前記還元性
ガスの供給を所定時間継続することを特徴とする請求項
１記載の電子部品の接合方法。2. The method for joining electronic components according to claim 1, wherein the supply of the reducing gas is continued for a predetermined time even after the irradiation of the laser light is completed. 【請求項３】 前記還元性ガスは不活性ガスに混ぜて供
給されることを特徴とする請求項１記載の電子部品の接
合方法。3. The method for joining electronic components according to claim 1, wherein the reducing gas is supplied after being mixed with an inert gas. 【請求項４】 電子部品の電極をハンダを介して配線基
板の配線に当接させる押え手段と、該電極が該ハンダを
介して該配線に当接する部分にレーザ光を照射するレー
ザ光照射手段と、該当接部分に還元性ガスを供給する還
元性ガス供給手段と、を備えることを特徴とする接合装
置。4. A holding means for bringing an electrode of an electronic component into contact with a wiring of a wiring board via solder, and a laser beam irradiating means for irradiating a portion where the electrode comes into contact with the wiring via the solder with a laser beam. And a reducing gas supply means for supplying a reducing gas to the corresponding contact portion. 【請求項５】 前記押え部材を透明部材の一端部に突出
するように設け、前記レーザ光照射手段から照射される
レーザ光を該透明部材の他端部側から該一端部側に透過
させ前記当接部分にレーザ光を照射させることを特徴と
する請求項４記載の接合装置。5. The pressing member is provided so as to project from one end of a transparent member, and the laser light emitted from the laser light irradiation means is transmitted from the other end of the transparent member to the one end. The joining apparatus according to claim 4, wherein the abutting portion is irradiated with laser light. 【請求項６】 前記還元性ガス供給手段は前記透明部材
に設けられたガス供給路を有することを特徴とする請求
項５記載の接合装置。6. The joining apparatus according to claim 5, wherein the reducing gas supply means has a gas supply passage provided in the transparent member.
JP26089594A 1994-10-03 1994-10-03 Junction method of electronic part and junction device used for the method Pending JPH08107272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26089594A JPH08107272A (en) 1994-10-03 1994-10-03 Junction method of electronic part and junction device used for the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26089594A JPH08107272A (en) 1994-10-03 1994-10-03 Junction method of electronic part and junction device used for the method

Publications (1)

Publication Number Publication Date
JPH08107272A true JPH08107272A (en) 1996-04-23

Family

ID=17354251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26089594A Pending JPH08107272A (en) 1994-10-03 1994-10-03 Junction method of electronic part and junction device used for the method

Country Status (1)

Country Link
JP (1) JPH08107272A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site
WO2002019422A2 (en) * 2000-08-28 2002-03-07 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site
WO2002019422A2 (en) * 2000-08-28 2002-03-07 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
WO2002019422A3 (en) * 2000-08-28 2002-08-29 Transpo Electronics Inc Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
CN100362651C (en) * 2000-08-28 2008-01-16 朗斯勃电子有限公司 Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators

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