JP2001148378A5 - - Google Patents

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Publication number
JP2001148378A5
JP2001148378A5 JP1999331496A JP33149699A JP2001148378A5 JP 2001148378 A5 JP2001148378 A5 JP 2001148378A5 JP 1999331496 A JP1999331496 A JP 1999331496A JP 33149699 A JP33149699 A JP 33149699A JP 2001148378 A5 JP2001148378 A5 JP 2001148378A5
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JP
Japan
Prior art keywords
plasma
processing
current path
opening
processing apparatus
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Pending
Application number
JP1999331496A
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English (en)
Japanese (ja)
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JP2001148378A (ja
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Publication date
Application filed filed Critical
Priority to JP33149699A priority Critical patent/JP2001148378A/ja
Priority claimed from JP33149699A external-priority patent/JP2001148378A/ja
Priority to PCT/JP2000/007459 priority patent/WO2001041182A1/en
Priority to US09/739,623 priority patent/US20010054484A1/en
Publication of JP2001148378A publication Critical patent/JP2001148378A/ja
Publication of JP2001148378A5 publication Critical patent/JP2001148378A5/ja
Pending legal-status Critical Current

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JP33149699A 1999-11-22 1999-11-22 プラズマ処理装置、クラスターツールおよびプラズマ制御方法 Pending JP2001148378A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP33149699A JP2001148378A (ja) 1999-11-22 1999-11-22 プラズマ処理装置、クラスターツールおよびプラズマ制御方法
PCT/JP2000/007459 WO2001041182A1 (en) 1999-11-22 2000-10-25 Plasma processor, cluster tool, and method of controlling plasma
US09/739,623 US20010054484A1 (en) 1999-11-22 2000-12-20 Plasma processor, cluster tool, and method of controlling plasma

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33149699A JP2001148378A (ja) 1999-11-22 1999-11-22 プラズマ処理装置、クラスターツールおよびプラズマ制御方法

Publications (2)

Publication Number Publication Date
JP2001148378A JP2001148378A (ja) 2001-05-29
JP2001148378A5 true JP2001148378A5 (https=) 2006-11-30

Family

ID=18244302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33149699A Pending JP2001148378A (ja) 1999-11-22 1999-11-22 プラズマ処理装置、クラスターツールおよびプラズマ制御方法

Country Status (3)

Country Link
US (1) US20010054484A1 (https=)
JP (1) JP2001148378A (https=)
WO (1) WO2001041182A1 (https=)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002176310A (ja) * 2000-12-06 2002-06-21 Nippon Antenna Co Ltd ２共振アンテナ
JP2002367969A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置
US6899787B2 (en) 2001-06-29 2005-05-31 Alps Electric Co., Ltd. Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and system
US6800172B2 (en) 2002-02-22 2004-10-05 Micron Technology, Inc. Interfacial structure for semiconductor substrate processing chambers and substrate transfer chambers and for semiconductor substrate processing chambers and accessory attachments, and semiconductor substrate processor
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus
US6858264B2 (en) 2002-04-24 2005-02-22 Micron Technology, Inc. Chemical vapor deposition methods
US6838114B2 (en) 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6821347B2 (en) 2002-07-08 2004-11-23 Micron Technology, Inc. Apparatus and method for depositing materials onto microelectronic workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US6926775B2 (en) * 2003-02-11 2005-08-09 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7647886B2 (en) 2003-10-15 2010-01-19 Micron Technology, Inc. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US7584942B2 (en) 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7699932B2 (en) 2004-06-02 2010-04-20 Micron Technology, Inc. Reactors, systems and methods for depositing thin films onto microfeature workpieces
JP4680619B2 (ja) * 2005-02-09 2011-05-11 株式会社アルバック プラズマ成膜装置
US20070221128A1 (en) * 2006-03-23 2007-09-27 Soo Young Choi Method and apparatus for improving uniformity of large-area substrates
KR100994463B1 (ko) * 2006-04-10 2010-11-16 엘아이지에이디피 주식회사 플라즈마 처리장치
JP2009088298A (ja) * 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
KR100822462B1 (ko) 2007-12-20 2008-04-16 아셈테크 주식회사 반도체 기판의 에싱장치
CN101779269B (zh) * 2008-07-23 2014-05-07 新动力等离子体株式会社 多工件处理室以及包括该多工件处理室的工件处理系统
KR101289770B1 (ko) * 2009-01-09 2013-07-26 가부시키가이샤 아루박 플라즈마 처리 장치
JP5490435B2 (ja) * 2009-03-31 2014-05-14 東京エレクトロン株式会社 ゲートバルブ装置
JP5700632B2 (ja) * 2010-11-04 2015-04-15 東京エレクトロン株式会社 プラズマ処理装置
KR101170626B1 (ko) * 2010-12-30 2012-08-03 엘아이지에이디피 주식회사 플라즈마를 이용한 기판처리장치
CN104851772A (zh) * 2015-04-03 2015-08-19 沈阳拓荆科技有限公司 一种可升降陶瓷挡板结构
TW201823613A (zh) 2016-08-22 2018-07-01 美商應用材料股份有限公司 具有可膨脹密封件之真空腔室
KR102310460B1 (ko) * 2017-10-26 2021-10-13 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20190046327A (ko) 2017-10-26 2019-05-07 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644309B2 (ja) * 1988-11-04 1997-08-25 株式会社東芝 半導体製造装置
JP3033787B2 (ja) * 1991-06-04 2000-04-17 キヤノン株式会社 プラズマ処理装置
JPH07106093A (ja) * 1993-03-16 1995-04-21 Applied Materials Inc 改良された弁クロージュアを有するプラズマチャンバ
US6153524A (en) * 1997-07-29 2000-11-28 Silicon Genesis Corporation Cluster tool method using plasma immersion ion implantation

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