JP2001119147A - 電子部品内蔵多層基板及びその製造方法 - Google Patents

電子部品内蔵多層基板及びその製造方法

Info

Publication number
JP2001119147A
JP2001119147A JP29302399A JP29302399A JP2001119147A JP 2001119147 A JP2001119147 A JP 2001119147A JP 29302399 A JP29302399 A JP 29302399A JP 29302399 A JP29302399 A JP 29302399A JP 2001119147 A JP2001119147 A JP 2001119147A
Authority
JP
Japan
Prior art keywords
electronic component
board
component mounting
substrate
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29302399A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001119147A5 (enExample
Inventor
Yoichi Oya
洋一 大矢
Emi Nakamura
恵美 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP29302399A priority Critical patent/JP2001119147A/ja
Publication of JP2001119147A publication Critical patent/JP2001119147A/ja
Publication of JP2001119147A5 publication Critical patent/JP2001119147A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP29302399A 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法 Pending JP2001119147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29302399A JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29302399A JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2001119147A true JP2001119147A (ja) 2001-04-27
JP2001119147A5 JP2001119147A5 (enExample) 2006-04-27

Family

ID=17789496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29302399A Pending JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP2001119147A (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060354A (ja) * 2001-08-10 2003-02-28 Multi:Kk 部品内蔵プリント回路板及びその製造方法
JP2003188314A (ja) * 2001-12-20 2003-07-04 Sony Corp 素子内蔵基板の製造方法および素子内蔵基板
US6680441B2 (en) 2001-06-13 2004-01-20 Denso Corporation Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
JP2004165318A (ja) * 2002-11-12 2004-06-10 Ibiden Co Ltd 多層プリント配線板
JP2005005692A (ja) * 2003-05-16 2005-01-06 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールおよびその製造方法
JP2006093679A (ja) * 2004-08-24 2006-04-06 Sony Corp 半導体パッケージ
US7047634B2 (en) 2002-02-25 2006-05-23 Fujitsu Limited Method of making a multilayer wiring board
JP2006261373A (ja) * 2005-03-17 2006-09-28 Dainippon Printing Co Ltd 受動部品内蔵モジュール
JP2006324568A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 多層モジュールとその製造方法
JP2007173446A (ja) * 2005-12-21 2007-07-05 Hitachi Aic Inc 部品内蔵基板
JP2007295008A (ja) * 2007-07-30 2007-11-08 Dainippon Printing Co Ltd 電子部品内蔵配線基板の製造方法
JP2008047917A (ja) * 2006-08-17 2008-02-28 Samsung Electro Mech Co Ltd 電子部品内蔵型多層印刷配線基板及びその製造方法
EP1534054A3 (en) * 2003-11-20 2008-07-30 Matsushita Electric Industrial Co., Ltd. Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
JP2010034588A (ja) * 2009-11-09 2010-02-12 Panasonic Corp 回路部品内蔵基板の製造方法
JP2010166074A (ja) * 2010-03-12 2010-07-29 Dainippon Printing Co Ltd 電子部品内蔵配線基板
JP2012109447A (ja) * 2010-11-18 2012-06-07 Dainippon Printing Co Ltd 電子モジュール
JP2012109615A (ja) * 2012-02-27 2012-06-07 Dainippon Printing Co Ltd 電子部品内蔵配線基板

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7165321B2 (en) 2001-06-13 2007-01-23 Denso Corporation Method for manufacturing printed wiring board with embedded electric device
US6680441B2 (en) 2001-06-13 2004-01-20 Denso Corporation Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
JP2003060354A (ja) * 2001-08-10 2003-02-28 Multi:Kk 部品内蔵プリント回路板及びその製造方法
JP2003188314A (ja) * 2001-12-20 2003-07-04 Sony Corp 素子内蔵基板の製造方法および素子内蔵基板
US7047634B2 (en) 2002-02-25 2006-05-23 Fujitsu Limited Method of making a multilayer wiring board
US7091716B2 (en) 2002-02-25 2006-08-15 Fujitsu Limited Multilayer wiring board, manufacturing method therefor and test apparatus thereof
US7284311B2 (en) 2002-02-25 2007-10-23 Fujitsu Limited Multilayer wiring board, manufacturing method therefor and test apparatus thereof
JP2004165318A (ja) * 2002-11-12 2004-06-10 Ibiden Co Ltd 多層プリント配線板
JP2005005692A (ja) * 2003-05-16 2005-01-06 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールおよびその製造方法
EP1534054A3 (en) * 2003-11-20 2008-07-30 Matsushita Electric Industrial Co., Ltd. Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
JP2006093679A (ja) * 2004-08-24 2006-04-06 Sony Corp 半導体パッケージ
JP2006261373A (ja) * 2005-03-17 2006-09-28 Dainippon Printing Co Ltd 受動部品内蔵モジュール
JP2006324568A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 多層モジュールとその製造方法
JP2007173446A (ja) * 2005-12-21 2007-07-05 Hitachi Aic Inc 部品内蔵基板
JP2008047917A (ja) * 2006-08-17 2008-02-28 Samsung Electro Mech Co Ltd 電子部品内蔵型多層印刷配線基板及びその製造方法
JP2007295008A (ja) * 2007-07-30 2007-11-08 Dainippon Printing Co Ltd 電子部品内蔵配線基板の製造方法
JP2010034588A (ja) * 2009-11-09 2010-02-12 Panasonic Corp 回路部品内蔵基板の製造方法
JP2010166074A (ja) * 2010-03-12 2010-07-29 Dainippon Printing Co Ltd 電子部品内蔵配線基板
JP2012109447A (ja) * 2010-11-18 2012-06-07 Dainippon Printing Co Ltd 電子モジュール
JP2012109615A (ja) * 2012-02-27 2012-06-07 Dainippon Printing Co Ltd 電子部品内蔵配線基板

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