JP2001119147A5 - - Google Patents

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Publication number
JP2001119147A5
JP2001119147A5 JP1999293023A JP29302399A JP2001119147A5 JP 2001119147 A5 JP2001119147 A5 JP 2001119147A5 JP 1999293023 A JP1999293023 A JP 1999293023A JP 29302399 A JP29302399 A JP 29302399A JP 2001119147 A5 JP2001119147 A5 JP 2001119147A5
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JP
Japan
Prior art keywords
built
electronic component
multilayer board
shows
views showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999293023A
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English (en)
Japanese (ja)
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JP2001119147A (ja
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Publication date
Application filed filed Critical
Priority to JP29302399A priority Critical patent/JP2001119147A/ja
Priority claimed from JP29302399A external-priority patent/JP2001119147A/ja
Publication of JP2001119147A publication Critical patent/JP2001119147A/ja
Publication of JP2001119147A5 publication Critical patent/JP2001119147A5/ja
Pending legal-status Critical Current

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JP29302399A 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法 Pending JP2001119147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29302399A JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29302399A JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2001119147A JP2001119147A (ja) 2001-04-27
JP2001119147A5 true JP2001119147A5 (enExample) 2006-04-27

Family

ID=17789496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29302399A Pending JP2001119147A (ja) 1999-10-14 1999-10-14 電子部品内蔵多層基板及びその製造方法

Country Status (1)

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JP (1) JP2001119147A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100488412B1 (ko) 2001-06-13 2005-05-11 가부시키가이샤 덴소 내장된 전기소자를 갖는 인쇄 배선 기판 및 그 제조 방법
JP2003060354A (ja) * 2001-08-10 2003-02-28 Multi:Kk 部品内蔵プリント回路板及びその製造方法
JP3870778B2 (ja) * 2001-12-20 2007-01-24 ソニー株式会社 素子内蔵基板の製造方法および素子内蔵基板
JP2003249763A (ja) 2002-02-25 2003-09-05 Fujitsu Ltd 多層配線基板及びその製造方法
JP4372407B2 (ja) * 2002-11-12 2009-11-25 イビデン株式会社 多層プリント配線板
JP4509645B2 (ja) * 2003-05-16 2010-07-21 パナソニック株式会社 回路部品内蔵モジュールおよびその製造方法
JP2005158770A (ja) * 2003-11-20 2005-06-16 Matsushita Electric Ind Co Ltd 積層基板とその製造方法及び前記積層基板を用いたモジュールの製造方法とその製造装置
JP4626445B2 (ja) * 2004-08-24 2011-02-09 ソニー株式会社 半導体パッケージの製造方法
JP4598573B2 (ja) * 2005-03-17 2010-12-15 大日本印刷株式会社 受動部品内蔵モジュールの製造方法
JP2006324568A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 多層モジュールとその製造方法
JP2007173446A (ja) * 2005-12-21 2007-07-05 Hitachi Aic Inc 部品内蔵基板
KR100796523B1 (ko) * 2006-08-17 2008-01-21 삼성전기주식회사 전자부품 내장형 다층 인쇄배선기판 및 그 제조방법
JP4593599B2 (ja) * 2007-07-30 2010-12-08 大日本印刷株式会社 電子部品内蔵配線基板の製造方法
JP2010034588A (ja) * 2009-11-09 2010-02-12 Panasonic Corp 回路部品内蔵基板の製造方法
JP4978709B2 (ja) * 2010-03-12 2012-07-18 大日本印刷株式会社 電子部品内蔵配線基板
JP2012109447A (ja) * 2010-11-18 2012-06-07 Dainippon Printing Co Ltd 電子モジュール
JP2012109615A (ja) * 2012-02-27 2012-06-07 Dainippon Printing Co Ltd 電子部品内蔵配線基板

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