JP2001116806A - インターフェイス - Google Patents

インターフェイス

Info

Publication number
JP2001116806A
JP2001116806A JP2000253063A JP2000253063A JP2001116806A JP 2001116806 A JP2001116806 A JP 2001116806A JP 2000253063 A JP2000253063 A JP 2000253063A JP 2000253063 A JP2000253063 A JP 2000253063A JP 2001116806 A JP2001116806 A JP 2001116806A
Authority
JP
Japan
Prior art keywords
interface
segments
tower
segment
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000253063A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001116806A5 (https=
Inventor
Jochen Zaiser
ヨッヘン・ツァイザー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2001116806A publication Critical patent/JP2001116806A/ja
Publication of JP2001116806A5 publication Critical patent/JP2001116806A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2000253063A 1999-08-23 2000-08-23 インターフェイス Pending JP2001116806A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99116493.0 1999-08-23
EP99116493A EP0999450B1 (en) 1999-08-23 1999-08-23 Modular interface between test and application equipment

Publications (2)

Publication Number Publication Date
JP2001116806A true JP2001116806A (ja) 2001-04-27
JP2001116806A5 JP2001116806A5 (https=) 2007-03-22

Family

ID=8238832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000253063A Pending JP2001116806A (ja) 1999-08-23 2000-08-23 インターフェイス

Country Status (4)

Country Link
US (1) US6624646B2 (https=)
EP (1) EP0999450B1 (https=)
JP (1) JP2001116806A (https=)
DE (1) DE69901220T2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332081A (ja) * 2005-05-23 2006-12-07 Yokogawa Electric Corp Ｉｃテスタ
JP2007178164A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2007125974A1 (ja) * 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. 導電性接触子ホルダ
JP2019149447A (ja) * 2018-02-27 2019-09-05 株式会社東京精密 プローバ
KR20210122051A (ko) * 2020-03-26 2021-10-08 주식회사 아도반테스토 고주파 부품, 특히, 검사 대상 실리콘 포토닉 디바이스 검사를 위한 검사 배열체

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159165B4 (de) * 2001-12-03 2007-02-08 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Vorrichtung zum Messen und/oder Kalibrieren eines Testkopfes
US7057410B1 (en) * 2003-05-14 2006-06-06 Credence Systems Corporation Interface structure for semiconductor integrated circuit test equipment
DE102004009337A1 (de) * 2004-02-26 2005-09-22 Infineon Technologies Ag Kontaktplatte zur Verwendung bei einer Kalibrierung von Testerkanälen eines Testersystems sowie ein Kalibriersystem mit einer solchen Kontaktplatte
DE602004021469D1 (de) 2004-04-05 2009-07-23 Verigy Pte Ltd Singapore Vorrichtung zum lösbaren Verbinden eines Interfaces an einer Testeinrichtung
DE112004002826T5 (de) * 2004-06-08 2007-04-26 Advantest Corporation Bildsensor-Prüfsystem
US7071724B2 (en) * 2004-06-25 2006-07-04 Infineon Technologies Ag Wafer probecard interface
US7330040B2 (en) * 2004-06-25 2008-02-12 Infineon Technologies Ag Test circuitry wafer
JP3875254B2 (ja) * 2005-05-30 2007-01-31 株式会社アドバンテスト 半導体試験装置及びインターフェースプレート
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
CN101738508B (zh) * 2008-11-12 2012-07-18 京元电子股份有限公司 一种探针塔与其制作方法
US8901950B2 (en) * 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328478U (https=) * 1989-07-28 1991-03-20
JPH03205843A (ja) * 1990-01-08 1991-09-09 Tokyo Electron Ltd プローブ装置
JPH08139142A (ja) * 1994-11-09 1996-05-31 Tokyo Electron Ltd プローブ装置
JPH0964126A (ja) * 1995-08-29 1997-03-07 Minato Electron Kk ウェーハプローバ用接続リング

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724180A (en) 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
DE69100204T2 (de) 1991-11-11 1994-01-13 Hewlett Packard Gmbh Einrichtung zur Erzeugung von Testsignalen.
US5633597A (en) * 1992-03-10 1997-05-27 Virginia Panel Corporation Micro interface technology system utilizing slide engagement mechanism
DE4305442C2 (de) 1993-02-23 1999-08-05 Hewlett Packard Gmbh Verfahren und Vorrichtung zum Erzeugen eines Testvektors
US5546012A (en) * 1994-04-15 1996-08-13 International Business Machines Corporation Probe card assembly having a ceramic probe card
US5924898A (en) * 1997-05-29 1999-07-20 Raychem Corporation Modular connector
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
US6037787A (en) 1998-03-24 2000-03-14 Teradyne, Inc. High performance probe interface for automatic test equipment
EP1060398B1 (en) * 1998-03-04 2002-06-26 Teradyne, Inc. Coaxial probe interface for automatic test equipment
US6166553A (en) 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328478U (https=) * 1989-07-28 1991-03-20
JPH03205843A (ja) * 1990-01-08 1991-09-09 Tokyo Electron Ltd プローブ装置
JPH08139142A (ja) * 1994-11-09 1996-05-31 Tokyo Electron Ltd プローブ装置
JPH0964126A (ja) * 1995-08-29 1997-03-07 Minato Electron Kk ウェーハプローバ用接続リング

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332081A (ja) * 2005-05-23 2006-12-07 Yokogawa Electric Corp Ｉｃテスタ
JP2007178164A (ja) * 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2007125974A1 (ja) * 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. 導電性接触子ホルダ
US7845955B2 (en) 2006-04-28 2010-12-07 Nhk Spring Co., Ltd. Conductive contact holder
KR101013172B1 (ko) * 2006-04-28 2011-02-10 니혼 하츠쵸 가부시키가이샤 도전성 접촉자 홀더
JP5379474B2 (ja) * 2006-04-28 2013-12-25 日本発條株式会社 導電性接触子ホルダ
JP2019149447A (ja) * 2018-02-27 2019-09-05 株式会社東京精密 プローバ
JP7209938B2 (ja) 2018-02-27 2023-01-23 株式会社東京精密 プローバ
KR20210122051A (ko) * 2020-03-26 2021-10-08 주식회사 아도반테스토 고주파 부품, 특히, 검사 대상 실리콘 포토닉 디바이스 검사를 위한 검사 배열체
JP2023520159A (ja) * 2020-03-26 2023-05-16 株式会社アドバンテスト 高周波コンポーネント、とくには検査対象シリコンフォトニクスデバイスを検査するための検査装置
JP7406004B2 (ja) 2020-03-26 2023-12-26 株式会社アドバンテスト 高周波コンポーネント、とくには検査対象シリコンフォトニクスデバイスを検査するための検査装置
KR102646621B1 (ko) 2020-03-26 2024-03-11 주식회사 아도반테스토 고주파 부품, 특히, 검사 대상 실리콘 포토닉 디바이스 검사를 위한 검사 배열체

Also Published As

Publication number Publication date
DE69901220D1 (de) 2002-05-16
US6624646B2 (en) 2003-09-23
DE69901220T2 (de) 2003-02-06
EP0999450B1 (en) 2002-04-10
EP0999450A1 (en) 2000-05-10
US20030076124A1 (en) 2003-04-24

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