JP2001116806A5 - - Google Patents
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- Publication number
- JP2001116806A5 JP2001116806A5 JP2000253063A JP2000253063A JP2001116806A5 JP 2001116806 A5 JP2001116806 A5 JP 2001116806A5 JP 2000253063 A JP2000253063 A JP 2000253063A JP 2000253063 A JP2000253063 A JP 2000253063A JP 2001116806 A5 JP2001116806 A5 JP 2001116806A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99116493.0 | 1999-08-23 | ||
| EP99116493A EP0999450B1 (en) | 1999-08-23 | 1999-08-23 | Modular interface between test and application equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001116806A JP2001116806A (ja) | 2001-04-27 |
| JP2001116806A5 true JP2001116806A5 (https=) | 2007-03-22 |
Family
ID=8238832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000253063A Pending JP2001116806A (ja) | 1999-08-23 | 2000-08-23 | インターフェイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6624646B2 (https=) |
| EP (1) | EP0999450B1 (https=) |
| JP (1) | JP2001116806A (https=) |
| DE (1) | DE69901220T2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10159165B4 (de) * | 2001-12-03 | 2007-02-08 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Vorrichtung zum Messen und/oder Kalibrieren eines Testkopfes |
| US7057410B1 (en) * | 2003-05-14 | 2006-06-06 | Credence Systems Corporation | Interface structure for semiconductor integrated circuit test equipment |
| DE102004009337A1 (de) * | 2004-02-26 | 2005-09-22 | Infineon Technologies Ag | Kontaktplatte zur Verwendung bei einer Kalibrierung von Testerkanälen eines Testersystems sowie ein Kalibriersystem mit einer solchen Kontaktplatte |
| DE602004021469D1 (de) | 2004-04-05 | 2009-07-23 | Verigy Pte Ltd Singapore | Vorrichtung zum lösbaren Verbinden eines Interfaces an einer Testeinrichtung |
| DE112004002826T5 (de) * | 2004-06-08 | 2007-04-26 | Advantest Corporation | Bildsensor-Prüfsystem |
| US7071724B2 (en) * | 2004-06-25 | 2006-07-04 | Infineon Technologies Ag | Wafer probecard interface |
| US7330040B2 (en) * | 2004-06-25 | 2008-02-12 | Infineon Technologies Ag | Test circuitry wafer |
| JP4534868B2 (ja) * | 2005-05-23 | 2010-09-01 | 横河電機株式会社 | Ｉｃテスタ |
| JP3875254B2 (ja) * | 2005-05-30 | 2007-01-31 | 株式会社アドバンテスト | 半導体試験装置及びインターフェースプレート |
| JP4607004B2 (ja) * | 2005-12-27 | 2011-01-05 | 株式会社ヨコオ | 検査ユニット |
| KR101013172B1 (ko) * | 2006-04-28 | 2011-02-10 | 니혼 하츠쵸 가부시키가이샤 | 도전성 접촉자 홀더 |
| US7764079B1 (en) * | 2007-01-31 | 2010-07-27 | SemiProbe LLC | Modular probe system |
| CN101738508B (zh) * | 2008-11-12 | 2012-07-18 | 京元电子股份有限公司 | 一种探针塔与其制作方法 |
| US8901950B2 (en) * | 2009-02-19 | 2014-12-02 | Advantest America, Inc | Probe head for a microelectronic contactor assembly, and methods of making same |
| JP7209938B2 (ja) * | 2018-02-27 | 2023-01-23 | 株式会社東京精密 | プローバ |
| KR102646621B1 (ko) * | 2020-03-26 | 2024-03-11 | 주식회사 아도반테스토 | 고주파 부품, 특히, 검사 대상 실리콘 포토닉 디바이스 검사를 위한 검사 배열체 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4724180A (en) | 1985-08-05 | 1988-02-09 | Teradyne, Inc. | Electrically shielded connectors |
| JPH0726716Y2 (ja) * | 1989-07-28 | 1995-06-14 | 株式会社アドバンテスト | Ｉｃテスト用接続具 |
| JP2847309B2 (ja) * | 1990-01-08 | 1999-01-20 | 東京エレクトロン株式会社 | プローブ装置 |
| DE69100204T2 (de) | 1991-11-11 | 1994-01-13 | Hewlett Packard Gmbh | Einrichtung zur Erzeugung von Testsignalen. |
| US5633597A (en) * | 1992-03-10 | 1997-05-27 | Virginia Panel Corporation | Micro interface technology system utilizing slide engagement mechanism |
| DE4305442C2 (de) | 1993-02-23 | 1999-08-05 | Hewlett Packard Gmbh | Verfahren und Vorrichtung zum Erzeugen eines Testvektors |
| US5546012A (en) * | 1994-04-15 | 1996-08-13 | International Business Machines Corporation | Probe card assembly having a ceramic probe card |
| JPH08139142A (ja) * | 1994-11-09 | 1996-05-31 | Tokyo Electron Ltd | プローブ装置 |
| JP2720146B2 (ja) * | 1995-08-29 | 1998-02-25 | ミナトエレクトロニクス株式会社 | ウェーハプローバ用接続リング |
| US5924898A (en) * | 1997-05-29 | 1999-07-20 | Raychem Corporation | Modular connector |
| US6246245B1 (en) | 1998-02-23 | 2001-06-12 | Micron Technology, Inc. | Probe card, test method and test system for semiconductor wafers |
| US6037787A (en) | 1998-03-24 | 2000-03-14 | Teradyne, Inc. | High performance probe interface for automatic test equipment |
| EP1060398B1 (en) * | 1998-03-04 | 2002-06-26 | Teradyne, Inc. | Coaxial probe interface for automatic test equipment |
| US6166553A (en) | 1998-06-29 | 2000-12-26 | Xandex, Inc. | Prober-tester electrical interface for semiconductor test |
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1999
- 1999-08-23 EP EP99116493A patent/EP0999450B1/en not_active Expired - Lifetime
- 1999-08-23 DE DE69901220T patent/DE69901220T2/de not_active Expired - Lifetime
-
2000
- 2000-08-23 JP JP2000253063A patent/JP2001116806A/ja active Pending
-
2002
- 2002-09-23 US US10/251,860 patent/US6624646B2/en not_active Expired - Lifetime