JP2001116806A5 - - Google Patents

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Publication number
JP2001116806A5
JP2001116806A5 JP2000253063A JP2000253063A JP2001116806A5 JP 2001116806 A5 JP2001116806 A5 JP 2001116806A5 JP 2000253063 A JP2000253063 A JP 2000253063A JP 2000253063 A JP2000253063 A JP 2000253063A JP 2001116806 A5 JP2001116806 A5 JP 2001116806A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000253063A
Other versions
JP2001116806A (ja
Filing date
Publication date
Priority claimed from EP99116493A external-priority patent/EP0999450B1/en
Application filed filed Critical
Publication of JP2001116806A publication Critical patent/JP2001116806A/ja
Publication of JP2001116806A5 publication Critical patent/JP2001116806A5/ja
Pending legal-status Critical Current

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JP2000253063A 1999-08-23 2000-08-23 インターフェイス Pending JP2001116806A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99116493A EP0999450B1 (en) 1999-08-23 1999-08-23 Modular interface between test and application equipment
EP99116493.0 1999-08-23

Publications (2)

Publication Number Publication Date
JP2001116806A JP2001116806A (ja) 2001-04-27
JP2001116806A5 true JP2001116806A5 (ja) 2007-03-22

Family

ID=8238832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000253063A Pending JP2001116806A (ja) 1999-08-23 2000-08-23 インターフェイス

Country Status (4)

Country Link
US (1) US6624646B2 (ja)
EP (1) EP0999450B1 (ja)
JP (1) JP2001116806A (ja)
DE (1) DE69901220T2 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10159165B4 (de) 2001-12-03 2007-02-08 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Vorrichtung zum Messen und/oder Kalibrieren eines Testkopfes
US7057410B1 (en) * 2003-05-14 2006-06-06 Credence Systems Corporation Interface structure for semiconductor integrated circuit test equipment
DE102004009337A1 (de) * 2004-02-26 2005-09-22 Infineon Technologies Ag Kontaktplatte zur Verwendung bei einer Kalibrierung von Testerkanälen eines Testersystems sowie ein Kalibriersystem mit einer solchen Kontaktplatte
DE602004021469D1 (de) 2004-04-05 2009-07-23 Verigy Pte Ltd Singapore Vorrichtung zum lösbaren Verbinden eines Interfaces an einer Testeinrichtung
CN1954202A (zh) * 2004-06-08 2007-04-25 株式会社爱德万测试 图像传感器用试验装置
US7071724B2 (en) * 2004-06-25 2006-07-04 Infineon Technologies Ag Wafer probecard interface
US7330040B2 (en) * 2004-06-25 2008-02-12 Infineon Technologies Ag Test circuitry wafer
JP4534868B2 (ja) * 2005-05-23 2010-09-01 横河電機株式会社 Ｉｃテスタ
JP3875254B2 (ja) * 2005-05-30 2007-01-31 株式会社アドバンテスト 半導体試験装置及びインターフェースプレート
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP5379474B2 (ja) * 2006-04-28 2013-12-25 日本発條株式会社 導電性接触子ホルダ
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
CN101738508B (zh) * 2008-11-12 2012-07-18 京元电子股份有限公司 一种探针塔与其制作方法
US8305101B2 (en) * 2009-02-19 2012-11-06 Advantest America, Inc Microelectronic contactor assembly, structures thereof, and methods of constructing same
US9239428B2 (en) 2011-09-28 2016-01-19 Ksaria Corporation Epoxy dispensing system and dispensing tip used therewith
JP7209938B2 (ja) * 2018-02-27 2023-01-23 株式会社東京精密 プローバ
JP7406004B2 (ja) 2020-03-26 2023-12-26 株式会社アドバンテスト 高周波コンポーネント、とくには検査対象シリコンフォトニクスデバイスを検査するための検査装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724180A (en) 1985-08-05 1988-02-09 Teradyne, Inc. Electrically shielded connectors
JPH0726716Y2 (ja) * 1989-07-28 1995-06-14 株式会社アドバンテスト Ｉｃテスト用接続具
JP2847309B2 (ja) * 1990-01-08 1999-01-20 東京エレクトロン株式会社 プローブ装置
DE69100204T2 (de) 1991-11-11 1994-01-13 Hewlett Packard Gmbh Einrichtung zur Erzeugung von Testsignalen.
US5633597A (en) * 1992-03-10 1997-05-27 Virginia Panel Corporation Micro interface technology system utilizing slide engagement mechanism
DE4305442C2 (de) 1993-02-23 1999-08-05 Hewlett Packard Gmbh Verfahren und Vorrichtung zum Erzeugen eines Testvektors
US5546012A (en) * 1994-04-15 1996-08-13 International Business Machines Corporation Probe card assembly having a ceramic probe card
JPH08139142A (ja) * 1994-11-09 1996-05-31 Tokyo Electron Ltd プローブ装置
JP2720146B2 (ja) * 1995-08-29 1998-02-25 ミナトエレクトロニクス株式会社 ウェーハプローバ用接続リング
US5924898A (en) * 1997-05-29 1999-07-20 Raychem Corporation Modular connector
US6246245B1 (en) 1998-02-23 2001-06-12 Micron Technology, Inc. Probe card, test method and test system for semiconductor wafers
US6037787A (en) 1998-03-24 2000-03-14 Teradyne, Inc. High performance probe interface for automatic test equipment
TW438980B (en) * 1998-03-24 2001-06-07 Teradyne Inc High performance probe interface for automatic test equipment
US6166553A (en) 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test

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