JP2001096455A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JP2001096455A
JP2001096455A JP27425999A JP27425999A JP2001096455A JP 2001096455 A JP2001096455 A JP 2001096455A JP 27425999 A JP27425999 A JP 27425999A JP 27425999 A JP27425999 A JP 27425999A JP 2001096455 A JP2001096455 A JP 2001096455A
Authority
JP
Japan
Prior art keywords
polishing
substrate
polished
polishing tool
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27425999A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001096455A5 (enExample
Inventor
Koji Ono
耕司 小野
Shozo Oguri
章三 小栗
Kenichi Sasabe
憲一 笹部
Masato Kurita
昌人 栗田
Yasuhisa Kojima
康寿 小島
Tadanori Keigawa
忠典 惠川
Kenichi Shigeta
賢一 重田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP27425999A priority Critical patent/JP2001096455A/ja
Priority to US09/669,883 priority patent/US6634924B1/en
Publication of JP2001096455A publication Critical patent/JP2001096455A/ja
Priority to US10/644,766 priority patent/US6997778B2/en
Publication of JP2001096455A5 publication Critical patent/JP2001096455A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP27425999A 1999-09-28 1999-09-28 研磨装置 Pending JP2001096455A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP27425999A JP2001096455A (ja) 1999-09-28 1999-09-28 研磨装置
US09/669,883 US6634924B1 (en) 1999-09-28 2000-09-27 Polishing apparatus
US10/644,766 US6997778B2 (en) 1999-09-28 2003-08-21 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27425999A JP2001096455A (ja) 1999-09-28 1999-09-28 研磨装置

Publications (2)

Publication Number Publication Date
JP2001096455A true JP2001096455A (ja) 2001-04-10
JP2001096455A5 JP2001096455A5 (enExample) 2004-12-24

Family

ID=17539201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27425999A Pending JP2001096455A (ja) 1999-09-28 1999-09-28 研磨装置

Country Status (2)

Country Link
US (2) US6634924B1 (enExample)
JP (1) JP2001096455A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003010807A1 (en) * 2001-07-24 2003-02-06 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
JP2008310402A (ja) * 2007-06-12 2008-12-25 Nikon Corp 作業情報管理システム
JP2009178800A (ja) * 2008-01-30 2009-08-13 Ebara Corp 研磨方法及び研磨装置
JP2013115396A (ja) * 2011-12-01 2013-06-10 Disco Abrasive Syst Ltd 板状基板の割れ検知方法
JP2014123601A (ja) * 2012-12-20 2014-07-03 Disco Abrasive Syst Ltd 研削装置及び研削方法
JP2015133449A (ja) * 2014-01-15 2015-07-23 株式会社荏原製作所 基板処理装置の異常検出装置、及び基板処理装置
KR20170073489A (ko) 2015-12-18 2017-06-28 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 제어 방법 및 기록매체에 저장된 프로그램
KR20180081188A (ko) * 2017-01-05 2018-07-16 주식회사 케이씨텍 화학 기계적 연마장치
CN112518528A (zh) * 2019-09-19 2021-03-19 株式会社 V 技术 研磨装置
EP3932615A1 (en) 2020-06-29 2022-01-05 Ebara Corporation Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method
KR20220042189A (ko) * 2019-08-02 2022-04-04 액서스 테크놀로지, 엘엘씨 가공대상물 연마 중 웨이퍼 슬립 검출의 인시츄 조절을 위한 방법 및 장치
KR20230035651A (ko) * 2020-07-14 2023-03-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 부적합 기판 프로세싱 이벤트들을 검출하는 방법들

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
JP4102081B2 (ja) * 2002-02-28 2008-06-18 株式会社荏原製作所 研磨装置及び研磨面の異物検出方法
US6918301B2 (en) * 2002-11-12 2005-07-19 Micron Technology, Inc. Methods and systems to detect defects in an end effector for conditioning polishing pads used in polishing micro-device workpieces
JP2004195629A (ja) * 2002-12-20 2004-07-15 Ebara Corp 研磨装置
US7204639B1 (en) * 2003-09-26 2007-04-17 Lam Research Corporation Method and apparatus for thin metal film thickness measurement
KR101152747B1 (ko) * 2003-10-31 2012-06-18 어플라이드 머티어리얼스, 인코포레이티드 마찰 센서를 이용한 폴리싱 종료점 탐지 시스템 및 방법
US7727049B2 (en) * 2003-10-31 2010-06-01 Applied Materials, Inc. Friction sensor for polishing system
US7052364B2 (en) * 2004-06-14 2006-05-30 Cabot Microelectronics Corporation Real time polishing process monitoring
US7465302B2 (en) * 2004-08-17 2008-12-16 Encision, Inc. System and method for performing an electrosurgical procedure
US7422589B2 (en) * 2004-08-17 2008-09-09 Encision, Inc. System and method for performing an electrosurgical procedure
US20060041252A1 (en) * 2004-08-17 2006-02-23 Odell Roger C System and method for monitoring electrosurgical instruments
SE528539C2 (sv) * 2005-05-20 2006-12-12 Aros Electronics Ab Metod och anordning för återvinningsbart upptagande av elektrisk retardationsenergi från ett industrirobotsystem
US8038509B2 (en) * 2005-08-05 2011-10-18 Seung-Hun Bae Chemical mechanical polishing apparatus
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
JP5511190B2 (ja) * 2008-01-23 2014-06-04 株式会社荏原製作所 基板処理装置の運転方法
KR101618354B1 (ko) * 2008-05-08 2016-05-04 어플라이드 머티어리얼스, 인코포레이티드 Cmp 패드 두께 및 프로파일 모니터링 시스템
TWI450792B (zh) * 2008-08-05 2014-09-01 Ebara Corp 研磨方法及裝置
US9833281B2 (en) 2008-08-18 2017-12-05 Encision Inc. Enhanced control systems including flexible shielding and support systems for electrosurgical applications
EP2323578B1 (en) 2008-08-18 2018-10-03 Encision, Inc. Enhanced control systems including flexible shielding and support systems for electrosurgical applications
JP5510779B2 (ja) * 2009-06-15 2014-06-04 Ｎｔｎ株式会社 研削装置
JP5842830B2 (ja) * 2011-01-21 2016-01-13 株式会社ジェイテクト 研削異常監視方法および研削異常監視装置
US9403254B2 (en) * 2011-08-17 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for real-time error detection in CMP processing
JP6091773B2 (ja) * 2012-06-11 2017-03-08 株式会社東芝 半導体装置の製造方法
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9240042B2 (en) * 2013-10-24 2016-01-19 Globalfoundries Inc. Wafer slip detection during CMP processing
CN103639888B (zh) * 2013-11-29 2016-06-22 上海华力微电子有限公司 固定环及抛光头
US20160013085A1 (en) * 2014-07-10 2016-01-14 Applied Materials, Inc. In-Situ Acoustic Monitoring of Chemical Mechanical Polishing
JP6141814B2 (ja) * 2014-10-30 2017-06-07 信越半導体株式会社 研磨装置
JP6269450B2 (ja) * 2014-11-18 2018-01-31 信越半導体株式会社 ワークの加工装置
US10388548B2 (en) * 2016-05-27 2019-08-20 Texas Instruments Incorporated Apparatus and method for operating machinery under uniformly distributed mechanical pressure
JP7399155B2 (ja) 2018-08-31 2023-12-15 アプライド マテリアルズ インコーポレイテッド 静電容量式剪断センサを備えた研磨システム
KR102635614B1 (ko) * 2023-01-09 2024-02-13 주식회사 지에스에프솔루션 비접촉식 변위센서를 이용한 로봇 조정 방법 및 장치
CN116214302A (zh) * 2023-03-31 2023-06-06 西安奕斯伟材料科技股份有限公司 一种用于对硅片进行双面抛光的设备
CN118376432B (zh) * 2024-06-19 2024-08-23 东营鑫奥船舶设备制造有限公司 基于数据分析的船舶自动抛光机故障监测系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3137587A (en) * 1961-11-07 1964-06-16 Harry H Wieder Method and apparatus for the manufacture of semiconductor film-type hall generators
US5445996A (en) * 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer
US5823853A (en) 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JP2853506B2 (ja) * 1993-03-24 1999-02-03 信越半導体株式会社 ウエーハの製造方法
US5897424A (en) * 1995-07-10 1999-04-27 The United States Of America As Represented By The Secretary Of Commerce Renewable polishing lap
US5838447A (en) 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
JP3705670B2 (ja) 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
US6076256A (en) * 1997-04-18 2000-06-20 Seagate Technology, Inc. Method for manufacturing magneto-optical data storage system
JP3761673B2 (ja) * 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
JP3763975B2 (ja) * 1998-07-21 2006-04-05 株式会社荏原製作所 トップリング制御装置及びポリッシング装置
US6152808A (en) * 1998-08-25 2000-11-28 Micron Technology, Inc. Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers
US6273792B1 (en) 1999-08-11 2001-08-14 Speedfam-Ipec Corporation Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing
US6386947B2 (en) * 2000-02-29 2002-05-14 Applied Materials, Inc. Method and apparatus for detecting wafer slipouts
US6424137B1 (en) * 2000-09-18 2002-07-23 Stmicroelectronics, Inc. Use of acoustic spectral analysis for monitoring/control of CMP processes

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003010807A1 (en) * 2001-07-24 2003-02-06 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
JP2008310402A (ja) * 2007-06-12 2008-12-25 Nikon Corp 作業情報管理システム
JP2009178800A (ja) * 2008-01-30 2009-08-13 Ebara Corp 研磨方法及び研磨装置
US8430716B2 (en) 2008-01-30 2013-04-30 Ebara Corporation Polishing method and polishing apparatus
JP2013115396A (ja) * 2011-12-01 2013-06-10 Disco Abrasive Syst Ltd 板状基板の割れ検知方法
JP2014123601A (ja) * 2012-12-20 2014-07-03 Disco Abrasive Syst Ltd 研削装置及び研削方法
TWI618163B (zh) * 2014-01-15 2018-03-11 Ebara Corp Abnormality detecting device of substrate processing device, and substrate processing device
JP2015133449A (ja) * 2014-01-15 2015-07-23 株式会社荏原製作所 基板処理装置の異常検出装置、及び基板処理装置
US10391603B2 (en) 2015-12-18 2019-08-27 Ebara Corporation Polishing apparatus, control method and recording medium
KR20170073489A (ko) 2015-12-18 2017-06-28 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 제어 방법 및 기록매체에 저장된 프로그램
KR20180081188A (ko) * 2017-01-05 2018-07-16 주식회사 케이씨텍 화학 기계적 연마장치
KR102668400B1 (ko) * 2017-01-05 2024-05-24 주식회사 케이씨텍 화학 기계적 연마장치
KR102795946B1 (ko) * 2019-08-02 2025-04-16 액서스 테크놀로지, 엘엘씨 가공대상물 연마 중 웨이퍼 슬립 검출의 인시츄 조절을 위한 방법 및 장치
JP2025024123A (ja) * 2019-08-02 2025-02-19 アクス テクノロジー エルエルシー ワークピースの研磨中のウェーハスリップ検出の現場調整方法及び装置
KR20220042189A (ko) * 2019-08-02 2022-04-04 액서스 테크놀로지, 엘엘씨 가공대상물 연마 중 웨이퍼 슬립 검출의 인시츄 조절을 위한 방법 및 장치
JP2022542219A (ja) * 2019-08-02 2022-09-30 アクス テクノロジー エルエルシー ワークピースの研磨中のウェーハスリップ検出の現場調整方法及び装置
JP7592036B2 (ja) 2019-08-02 2024-11-29 アクス テクノロジー エルエルシー ワークピースの研磨中のウェーハスリップ検出の現場調整方法及び装置
CN112518528A (zh) * 2019-09-19 2021-03-19 株式会社 V 技术 研磨装置
JP2021045827A (ja) * 2019-09-19 2021-03-25 株式会社ブイ・テクノロジー 研磨装置
JP7305178B2 (ja) 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
KR20220001477A (ko) 2020-06-29 2022-01-05 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치, 기판 처리 방법, 및 기판 처리 방법을 기판 처리 장치의 컴퓨터에 실행시키기 위한 프로그램을 저장한 기억 매체
US11911868B2 (en) 2020-06-29 2024-02-27 Ebara Corporation Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method
JP7443169B2 (ja) 2020-06-29 2024-03-05 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
JP2022010795A (ja) * 2020-06-29 2022-01-17 株式会社荏原製作所 基板処理装置、基板処理方法、および基板処理方法を基板処理装置のコンピュータに実行させるためのプログラムを格納した記憶媒体
EP3932615A1 (en) 2020-06-29 2022-01-05 Ebara Corporation Substrate processing apparatus, substrate processing method, and storage medium that stores program to cause computer in substrate processing apparatus to execute substrate processing method
JP2023534268A (ja) * 2020-07-14 2023-08-08 アプライド マテリアルズ インコーポレイテッド 化学機械研磨中に不適合基板処理事象を検出する方法
KR20230035651A (ko) * 2020-07-14 2023-03-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 부적합 기판 프로세싱 이벤트들을 검출하는 방법들
KR102746464B1 (ko) 2020-07-14 2024-12-23 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 부적합 기판 프로세싱 이벤트들을 검출하는 방법들
JP7705444B2 (ja) 2020-07-14 2025-07-09 アプライド マテリアルズ インコーポレイテッド 化学機械研磨中に不適合基板処理事象を検出する方法

Also Published As

Publication number Publication date
US6634924B1 (en) 2003-10-21
US20040033761A1 (en) 2004-02-19
US6997778B2 (en) 2006-02-14

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