JP2001092105A5 - - Google Patents

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Publication number
JP2001092105A5
JP2001092105A5 JP1999263665A JP26366599A JP2001092105A5 JP 2001092105 A5 JP2001092105 A5 JP 2001092105A5 JP 1999263665 A JP1999263665 A JP 1999263665A JP 26366599 A JP26366599 A JP 26366599A JP 2001092105 A5 JP2001092105 A5 JP 2001092105A5
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JP
Japan
Prior art keywords
pattern
exposure
resist
transferred
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999263665A
Other languages
English (en)
Japanese (ja)
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JP2001092105A (ja
JP3987246B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP26366599A priority Critical patent/JP3987246B2/ja
Priority claimed from JP26366599A external-priority patent/JP3987246B2/ja
Priority to US09/661,553 priority patent/US6558853B1/en
Publication of JP2001092105A publication Critical patent/JP2001092105A/ja
Publication of JP2001092105A5 publication Critical patent/JP2001092105A5/ja
Application granted granted Critical
Publication of JP3987246B2 publication Critical patent/JP3987246B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP26366599A 1999-09-17 1999-09-17 露光用マスク及び半導体装置の製造方法 Expired - Fee Related JP3987246B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP26366599A JP3987246B2 (ja) 1999-09-17 1999-09-17 露光用マスク及び半導体装置の製造方法
US09/661,553 US6558853B1 (en) 1999-09-17 2000-09-14 Method for manufacturing exposure mask, exposure apparatus and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26366599A JP3987246B2 (ja) 1999-09-17 1999-09-17 露光用マスク及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2001092105A JP2001092105A (ja) 2001-04-06
JP2001092105A5 true JP2001092105A5 (enExample) 2005-06-30
JP3987246B2 JP3987246B2 (ja) 2007-10-03

Family

ID=17392644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26366599A Expired - Fee Related JP3987246B2 (ja) 1999-09-17 1999-09-17 露光用マスク及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US6558853B1 (enExample)
JP (1) JP3987246B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040058550A1 (en) * 2002-09-19 2004-03-25 Infineon Technologies North America Corp. Dummy patterns for reducing proximity effects and method of using same
DE10310136B4 (de) * 2003-03-07 2007-05-03 Infineon Technologies Ag Maskensatz zur Projektion von jeweils auf den Masken des Satzes angeordneten und aufeinander abgestimmten Strukturmustern auf einen Halbleiterwafer
DE10310137B4 (de) * 2003-03-07 2010-08-19 Qimonda Ag Satz von wenigstens zwei Masken zur Projektion von jeweils auf den Masken gebildeten und aufeinander abgestimmten Strukturmustern und Verfahren zur Herstellung der Masken
TWI235415B (en) * 2003-12-17 2005-07-01 Macronix Int Co Ltd Method and device for improving uniformity of critical dimension between different patterns of semiconductor devices
EP1982160A4 (en) * 2006-02-09 2016-02-17 Kla Tencor Tech Corp METHOD AND SYSTEMS FOR DETERMINING A WAFER FEATURE
US8280649B2 (en) * 2006-06-27 2012-10-02 Nec Corporation Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program
US7858269B2 (en) * 2007-03-16 2010-12-28 International Business Machines Corporation Structure and method for sub-resolution dummy clear shapes for improved gate dimensional control
JP4914272B2 (ja) * 2007-04-02 2012-04-11 エルピーダメモリ株式会社 投影露光用のレチクル、該投影露光用のレチクルの製造方法及び該レチクルを用いた半導体装置
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
KR101647010B1 (ko) * 2008-06-19 2016-08-10 케이엘에이-텐코어 코오포레이션 웨이퍼의 하나 이상의 특성들을 결정하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8269960B2 (en) * 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
JP5356114B2 (ja) * 2009-05-29 2013-12-04 株式会社東芝 露光用マスク及び半導体装置の製造方法
JP2012022036A (ja) * 2010-07-12 2012-02-02 Toshiba Corp 露光用マスクおよび半導体装置の製造方法
US9594862B2 (en) * 2014-06-20 2017-03-14 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating an integrated circuit with non-printable dummy features
JP6414399B2 (ja) * 2014-07-03 2018-10-31 富士通セミコンダクター株式会社 レチクル及びその検査方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08234410A (ja) * 1995-02-28 1996-09-13 Dainippon Printing Co Ltd 位相シフトフォトマスク及び位相シフトフォトマスクドライエッチング方法
JP3080024B2 (ja) * 1997-02-20 2000-08-21 日本電気株式会社 露光方法および球面収差量の測定方法
US6001512A (en) * 1998-04-28 1999-12-14 Taiwan Semiconductor Manufacturing Company Ltd. Method of blind border pattern layout for attenuated phase shifting masks

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