JP2001053194A - Double layer wiring tab tape and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a double-layer wiring TAB tape of high reliability, wherein generation of strain due to heat is little, configuration is superior, flexibility in wiring design of BGA, CSP, etc., is high and adhesion to photo solder resist, and in particular, adhesion of a stiffener sticking side are superior, and a manufacturing method of the double layer wiring TAB tape of high productivity and a low cost. SOLUTION: This TAB tape is provided with a polyimide layer 1 of 30-45 μm thickness, a first wiring layer 8 formed on one surface of the polyimide layer 1 by patterning via an adhesive agent layer 4, a second wiring layer 9 formed on the other surface of the polyimide layer 1 by patterning without going through the intermediary of an adhesive agent layer, a bind via 6 formed penetrating the polyimide layer 1, the adhesive agent layer 4 and the second wiring layer 9, a copper plating layer 7, which is formed on the inner surface of the blind via 6 and the surface of the second wiring layer 9 and connects electrically the second wiring layer 9 with the first wiring layer 8, solder balls 26 arranged on a ball pad layer formed on the surface of the copper plating layer 7, and a photo-solder resist layer 10 formed in a region, except the ball pad layer of the second wiring layer 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a two-layer wiring TAB.
(Tape Automated Bonding) tape and a method of manufacturing the same, particularly, a CSP (Chip)
Scale Package) and BGA (Ba
BGA / C
A highly reliable two-layer wiring TAB tape that has a high degree of freedom in the design of wiring such as SP and has good adhesion to the photo solder resist, particularly good adhesion on the side where the stiffener is attached;
And a method of manufacturing a two-layer wiring TAB tape with high productivity and low cost.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a method of manufacturing a TAB for a BGA / CSP having two layers. FIG.
As shown in (a) and (b), as a two-layer wiring TAB tape, an adhesive-less two-layer CCL (Copper C1a) is used.
d Laminate) 3, through holes are formed in the copper layer 2 on one side in advance by a photo process using a photo process and etching, and through holes are formed in the polyimide tape 1 as an insulating layer by laser processing to form blind vias 6. Form. As shown in FIG. 3C, after the inner wall of the blind via 6 is desmeared, the inner wall of the blind via 6 is made conductive to about 8 μm.
It is manufactured by applying a copper plating 8 having a thickness (for example,
1-1176193). In addition, adhesive-less two-layer CC
L3 is manufactured by applying a polyimide varnish on the copper foil 2 and heating it with a heater to form a polyimide layer 1.

[0003]

However, no adhesive is required.
According to the conventional two-layer wiring TAB tape using the layer CCL, when the polyimide layer has a thickness of about 50 μm, the distortion generated when the polyimide varnish is heated by the heater increases, thereby meandering the adhesive-less two-layer CCL. May be caught on the guide during transport,
In addition, the etching pattern of the wiring may be shifted. Misalignment of the etching pattern hinders miniaturization of the wiring and makes it difficult to reduce the wiring pitch to 40 μm or less. Also, the polyimide layer formed by casting has poor adhesion to the photo solder resist,
In a semiconductor device having a structure in which a stiffener is attached to a photo solder resist via an adhesive, peeling occurs between the photo solder resist and the polyimide layer, thereby lowering reliability.
In the case of a TAB tape with two-layer wiring, the wiring pattern of BGA / CSP is limited, and the ball pad (Ba)
When the number of (ll Pad) increases, the possible wiring pitch of the wiring pattern becomes 40 μm or less, and it is extremely difficult to etch the copper foil layer.

Accordingly, it is an object of the present invention to reduce the occurrence of distortion due to heat, to be excellent in shape, to have a high degree of freedom in designing wiring such as BGA and CSP, and to improve the adhesion with a photo solder resist, particularly, by using a stiffener. An object of the present invention is to provide a highly reliable two-layer wiring TAB tape having good adhesion on the attachment side and a method of manufacturing a two-layer wiring TAB tape with high productivity and low cost.

[0005]

In order to solve the above-mentioned problems, the present invention provides the following two-layered TAB tape [1] to [6] and a method of manufacturing the same. That is,

[1] A polyimide layer having a thickness of 30 to 45 μm, a first wiring layer formed on one side of the polyimide layer by patterning via an adhesive layer, and an adhesive on the other side of the polyimide layer A second wiring layer patterned and formed without a layer, a blind via provided through the polyimide layer, the adhesive layer and the second wiring layer, an inner surface of the blind via, and A copper plating layer formed on the surface of the second wiring layer to electrically connect the second wiring layer to the first wiring layer; and a ball pad layer formed on the surface of the copper plating layer. A two-layer wiring TAB tape, comprising: a solder ball formed as described above; and a photo solder resist layer formed in a region of the second wiring layer excluding the ball pad layer.

[2] The above-mentioned [1], wherein the polyimide layer has a region for mounting a semiconductor chip on the one surface and a region for attaching a stiffener via a photo solder resist layer and an adhesive layer. 2-layer wiring TAB tape.

[3] An adhesive-less single-sided copper-clad CCL substrate in which a second copper foil layer is laminated on one side of a polyimide layer having a thickness of 30 to 45 μm, a polyimide layer side surface of the CCL substrate is interposed therebetween. The first copper foil layer is attached and cured to form a composite base material, and the second copper foil layer of the composite base material is subjected to an etching process, and the polyimide layer and the adhesive layer are directly subjected to laser ( (Laser) processing to form a blind via, a desmearing treatment and a conductive treatment to form a copper plating layer on the blind via, and process the first copper foil layer into a first wiring layer having a predetermined pattern. Processing the second copper foil layer into a second wiring layer having a predetermined pattern, electrically connecting the first and second wiring layers to each other by the copper plating layer, Ball and the surface of the second wiring layer. Forming a layer, forming a photo solder resist layer in a region of the second wiring layer excluding the ball / pad layer, and disposing a solder ball on the ball / pad layer. A method for manufacturing a wiring TAB tape.

According to the present invention, since the above-described structure is employed, no distortion occurs due to heat in the polyimide layer, so that the tape does not meander, and the wiring pattern does not shift. Further, the degree of freedom in designing wiring such as BGA / CSP is high, and furthermore, since the ball pad layer made of a photo solder resist does not directly contact the polyimide layer formed on the casting, peeling can be avoided.

[0010]

Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 shows a semiconductor device using a two-layer wiring TAB tape of the present invention. As shown in FIGS. 1A and 1B, this semiconductor device has a polyimide layer 1 having a thickness of 30 to 45 μm, and an adhesive layer 4 on one surface of the polyimide layer 1.
A first wiring layer 8 formed by patterning through the polyimide layer 1, a second wiring layer 9 formed by patterning the other surface of the polyimide layer 1 without using the adhesive layer, the polyimide layer 1, the adhesive layer 4 and the second wiring layer 9, the blind via 6 provided through the second wiring layer 9, and the inner surface of the blind via 6 and the second wiring layer 9.
, A solder ball 26 disposed on a ball pad layer 10 formed on the surface of the copper plating layer 7, and a second wiring layer 1 excluding the ball pad layer 26.
The first and second wiring layers 8 and 9 are electrically connected to each other by a copper plating layer 7.

Here, the thickness of the polyimide layer 1 is 30 to
It needs to be 45 μm. If it is less than 30 μm, the mechanical strength becomes insufficient, and if it exceeds 45 μm, distortion due to heat at the time of casting occurs, and the shape is reduced. Further, the thickness of the first copper foil layer 5 is preferably from 5 to 35 μm. Outside of this range, it may not be possible to produce with an electrolytic copper foil. The diameter of the blind via 6 is 30
~ 80 µm is preferred. If it exceeds 80 μm, it may be difficult to route fine pitch wiring with a lead wiring pitch of less than 80 μm, and if it is less than 30 μm,
Laser drilling may be unstable and desmear processing may be uncertain. Further, the thickness of the second copper foil layer 2 is preferably from 5 to 35 μm. Outside of this range, it may not be possible to produce with an electrolytic copper foil. Further, the thickness of the adhesive layer 4 is preferably 5 to 15 μm. If it is less than 5 μm, the mechanical strength becomes insufficient, and if it exceeds 15 μm, the flexibility becomes insufficient.

As a preferred example of the two-layer wiring TAB tape of the present invention, the polyimide layer 1 has a semiconductor chip 20
Can be used.

As a preferred example, a polyimide layer 1
However, on one side, the photo solder resist 10 and the adhesive layer 2
One having a region to which the stiffener 24 is attached via the step 5 can be used.

As a further preferred example, the first and second wiring layers 8 and 9 have a nickel layer, a gold layer,
Examples further include a tin layer or a solder plating layer.

As shown in FIGS. 2A to 2C, in the two-layer wiring TAB tape of the present invention, a second copper foil layer 2 is laminated on one side of a polyimide layer 1 having a thickness of 30 to 45 μm. The first copper foil layer 5 is adhered to the surface of the adhesive-less single-sided copper-clad CCL substrate 3 on the polyimide layer 1 side via the adhesive layer 4 and cured to form a composite substrate. The second copper foil layer 2 is subjected to a photo process and an etching process, and a laser (Laser) is directly applied to the polyimide layer 1 and the adhesive layer 4.
Processing is performed to form a blind via 6, a desmear treatment is performed, and then a conductive treatment is performed to form a copper plating layer 7 on the blind via 6, and the first copper foil layer 5 is formed into a first wiring layer 8 having a predetermined pattern.
The second copper foil layer 2 is processed into a second wiring layer 9 having a predetermined pattern, and the first and second wiring layers 8 and 9 are electrically connected to each other by a copper plating layer 7. Further, the ball pad layer 10 is formed on the surfaces of the copper plating layer 7 and the second wiring layers 8 and 9, and the solder balls 26 are provided on the ball pad layer 10, and the balls of the second wiring layer 9 are formed.・ Pad layer 10
It can be manufactured by forming the photo-solder resist 10 in a region where there is not.

As a preferred example of the method for manufacturing a two-layer wiring TAB tape of the present invention, first and second wiring layers 8 and 9 are used.
And a method of further forming a nickel layer, a gold layer, a tin layer, or a solder plating layer on each of the surfaces.

Hereinafter, the present invention will be described more specifically with reference to examples. (Example 1) As shown in FIG.
Adhesive-less single-sided copper-clad CCL (Copper C1ad Laminat) having a width of 70 mm in which a second copper foil layer 2 having a thickness of 18 μm is laminated on one side of a polyimide layer 1
e) A polyimide adhesive is applied to the surface of the substrate 3 on the polyimide layer side to form an adhesive layer 4 having a thickness of 12 μm,
A first copper foil layer 5 having a thickness of 18 μm was stuck on the surface and cured to form a composite substrate.

Next, as shown in FIG. 2B, the second copper foil layer 2 of the obtained composite base material is subjected to a photo process and an etching process. Blind via with a diameter of 60 μm directly by laser processing (B
After forming 64 (Via vial), desmear treatment was performed with potassium permanganate, and then carbon conduction treatment was performed.

Next, as shown in FIG.
A μm copper plating layer 7 was formed.

Next, as shown in FIGS. 1A and 1B, the second copper foil layer 2 is subjected to a photo process and an etching process.
While processing into the second wiring layer 9 of a predetermined pattern,
The first copper foil layer 5 was processed into a first wiring layer 8 having a predetermined pattern by a photo process and etching.

Next, a ball pad layer 10 is formed on the second wiring layer 9, and N is added to the second wiring layer 9 and the first wiring layer 8.
i, Au plating layer (not shown) is formed, and T
AB tape was produced.

Next, the LSI chip 20 is adhered to the polyimide tape 1 with the die attach agent 21, and the bonding wire 27 is bonded with a single point bonder.
It was sealed with a potting sealing resin 23. The stiffener 24 was stuck with a stiffener sticking adhesive 25 to form a package.

Next, after the solder balls 26 are mounted, FR4
It was mounted on a substrate (not shown) and its reliability was measured. As a result, the temperature cycle test (−55 ° C. (hold for 30 minutes) ⇔12
1000 cycles of 5 ° C (holding for 30 minutes) and high temperature bias test (85 ° C x 85% RH, imprint voltage 7V)
Even in time, there was no problem and good results were obtained.

(Embodiment 2) In the embodiment 1, 50 μm
The procedure was the same as in the example except that a blind via having a diameter was formed. As a result, good results were obtained in the temperature cycle test and the high temperature bias test without any trouble even after 1000 hours.

It should be noted that the two-layer wiring TAB tape of the present invention
Flip without outer hole and no device hole
The present invention is also applicable to the structure of a chip bonding two-layer wiring TAB tape.

Also, the two-layer wiring TAB tape of the present invention is
The wire having a fine wiring lead pitch of 80 μm or less.
Bonding type CSP and Tape BGA
(Ball Grid Array) and the like.

[0028]

As described above, according to the present invention, the generation of distortion due to heat is small, the shape is excellent, and BGA / C
A highly reliable two-layer wiring TAB tape that has a high degree of freedom in the design of wiring such as SP and has good adhesion to the photo solder resist, particularly good adhesion on the side where the stiffener is attached;
Further, it is possible to provide a method of manufacturing a two-layer wiring TAB tape with high productivity and low cost.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a two-layer wiring TAB tape of the present invention.
FIG. 3A is a cross-sectional view schematically showing a case where the present invention is applied to a BGA, and FIG.

FIG. 2 is a cross-sectional view schematically showing steps ((a) to (c)) of forming a blind via on one side CCL and performing copper plating in one embodiment of the two-layer wiring TAB tape of the present invention. is there.

FIG. 3 shows one side C subjected to a conventional conduction treatment and copper plating.
It is sectional drawing which shows the manufacturing process [(a)-(c)] of CL typically.

[Explanation of symbols]

 1: polyimide layer 2: second copper foil layer 3: CCL substrate 4: adhesive layer 5: first copper foil layer 6: blind via 7: copper plating layer 8: first wiring layer 9: second Wiring layer 10: Photo solder resist 20: LSI chip 21: Die attach agent 22: Outer lead 23: Potting sealing resin 24: Stiffener 25: Stiffener bonding adhesive 26: Solder ball 27: Bonding wire

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) H05K 3/42 610 H05K 3/42 610A F-term (Reference) 5E317 AA07 AA25 BB03 BB12 CC31 CD01 CD11 CD21 CD27 CD32 GG03 GG17 GG20 5F044 MM04 MM11 MM48

Claims (3)

[Claims] 1. A polyimide layer having a thickness of 30 to 45 μm, a first wiring layer formed by patterning one surface of the polyimide layer via an adhesive layer, and an adhesive layer on the other surface of the polyimide layer. A second wiring layer formed by patterning without passing through, a blind via provided through the polyimide layer, the adhesive layer, and the second wiring layer; an inner surface of the blind via; A copper plating layer formed on the surface of the wiring layer and electrically connecting the second wiring layer to the first wiring layer; and a ball pad layer formed on the surface of the copper plating layer. A two-layer wiring TAB tape, comprising: a solder ball; and a photo solder resist layer formed in a region of the second wiring layer excluding the ball pad layer. 2. The structure according to claim 1, wherein the polyimide layer has a region for mounting a semiconductor chip on the one surface and a region for attaching a stiffener via a photo solder resist layer and an adhesive layer. Layer wiring TAB tape. 3. An adhesive-less single-sided copper paste C in which a second copper foil layer is laminated on one side of a polyimide layer having a thickness of 30 to 45 μm.
On the surface of the CL substrate on the polyimide layer side, a first copper foil layer is attached via an adhesive layer and cured to form a composite substrate,
The second copper foil layer of the composite base material is subjected to an etching process, and the polyimide layer and the adhesive layer are directly subjected to a laser (Laser) process to form a blind via. Forming a copper plating layer on a blind via, processing the first copper foil layer into a first wiring layer having a predetermined pattern, and processing the second copper foil layer into a second wiring layer having a predetermined pattern; And electrically connecting the first and second wiring layers to each other by the copper plating layer, further forming a ball pad layer on the surfaces of the copper plating layer and the second wiring layer, A method of manufacturing a two-layer wiring TAB tape, comprising: forming a photo solder resist layer in a region of the second wiring layer other than the ball / pad layer; and arranging solder balls on the ball / pad layer. .