JP2001027804A5 - - Google Patents

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Publication number
JP2001027804A5
JP2001027804A5 JP1999199095A JP19909599A JP2001027804A5 JP 2001027804 A5 JP2001027804 A5 JP 2001027804A5 JP 1999199095 A JP1999199095 A JP 1999199095A JP 19909599 A JP19909599 A JP 19909599A JP 2001027804 A5 JP2001027804 A5 JP 2001027804A5
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JP
Japan
Prior art keywords
resist
chemically amplified
resist composition
irradiation
dry etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999199095A
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English (en)
Japanese (ja)
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JP4424630B2 (ja
JP2001027804A (ja
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Publication date
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Priority to JP19909599A priority Critical patent/JP4424630B2/ja
Priority claimed from JP19909599A external-priority patent/JP4424630B2/ja
Publication of JP2001027804A publication Critical patent/JP2001027804A/ja
Publication of JP2001027804A5 publication Critical patent/JP2001027804A5/ja
Application granted granted Critical
Publication of JP4424630B2 publication Critical patent/JP4424630B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP19909599A 1999-07-13 1999-07-13 化学増幅型レジスト組成物およびレジストパターン形成方法 Expired - Fee Related JP4424630B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19909599A JP4424630B2 (ja) 1999-07-13 1999-07-13 化学増幅型レジスト組成物およびレジストパターン形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19909599A JP4424630B2 (ja) 1999-07-13 1999-07-13 化学増幅型レジスト組成物およびレジストパターン形成方法

Publications (3)

Publication Number Publication Date
JP2001027804A JP2001027804A (ja) 2001-01-30
JP2001027804A5 true JP2001027804A5 (https=) 2006-08-31
JP4424630B2 JP4424630B2 (ja) 2010-03-03

Family

ID=16402046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19909599A Expired - Fee Related JP4424630B2 (ja) 1999-07-13 1999-07-13 化学増幅型レジスト組成物およびレジストパターン形成方法

Country Status (1)

Country Link
JP (1) JP4424630B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765184B2 (ja) * 2001-03-19 2011-09-07 住友ベークライト株式会社 複合シート。
TWI400570B (zh) 2005-07-25 2013-07-01 Nissan Chemical Ind Ltd 正型感光性樹脂組成物及由其所得之硬化膜
US8828651B2 (en) 2005-07-25 2014-09-09 Nissan Chemical Industries, Ltd. Positive-type photosensitive resin composition and cured film manufactured therefrom
WO2007086249A1 (ja) * 2006-01-25 2007-08-02 Nissan Chemical Industries, Ltd. ポジ型感光性樹脂組成物及びそれから得られる硬化膜
TWI408496B (zh) * 2006-03-01 2013-09-11 Zeon Corp A radiation linear resin composition, a laminate, and a method for producing the same
JP4771086B2 (ja) * 2006-03-01 2011-09-14 日本ゼオン株式会社 感放射線性樹脂組成物、積層体及びその製造方法
WO2007132892A1 (ja) * 2006-05-16 2007-11-22 Nissan Chemical Industries, Ltd. シロキサン化合物を含有するポジ型感光性樹脂組成物
KR101388998B1 (ko) 2006-06-15 2014-04-24 닛산 가가쿠 고교 가부시키 가이샤 환구조를 갖는 고분자 화합물을 함유하는 포지티브형 감광성 수지조성물
JP5077526B2 (ja) * 2006-09-21 2012-11-21 日産化学工業株式会社 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物
US8168371B2 (en) 2007-01-22 2012-05-01 Nissan Chemical Industries, Ltd. Positive photosensitive resin composition
JP2008286924A (ja) * 2007-05-16 2008-11-27 Panasonic Corp 化学増幅型レジスト材料、トップコート膜形成用材料及びそれらを用いたパターン形成方法
KR101754676B1 (ko) 2010-02-02 2017-07-06 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지 조성물 및 발액성 피막
JP5291744B2 (ja) * 2010-11-02 2013-09-18 富士フイルム株式会社 エッチングレジスト用感光性樹脂組成物、パターン作製方法、mems構造体及びその作製方法、ドライエッチング方法、ウェットエッチング方法、memsシャッターデバイス、並びに、画像表示装置
JP5585796B2 (ja) * 2012-07-06 2014-09-10 日産化学工業株式会社 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物

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