JP2001012856A - 熱処理装置 - Google Patents

熱処理装置

Info

Publication number
JP2001012856A
JP2001012856A JP11182470A JP18247099A JP2001012856A JP 2001012856 A JP2001012856 A JP 2001012856A JP 11182470 A JP11182470 A JP 11182470A JP 18247099 A JP18247099 A JP 18247099A JP 2001012856 A JP2001012856 A JP 2001012856A
Authority
JP
Japan
Prior art keywords
heated
heating
heat
heat treatment
treatment apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11182470A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001012856A5 (enExample
Inventor
Akio Kotado
明夫 古田土
Atsushi Seki
篤志 関
Eiji Inaba
栄次 稲葉
Chuji Sato
忠次 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Chemical Techno Plant Ltd
Original Assignee
Hitachi Chemical Techno Plant Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Techno Plant Ltd filed Critical Hitachi Chemical Techno Plant Ltd
Priority to JP11182470A priority Critical patent/JP2001012856A/ja
Publication of JP2001012856A publication Critical patent/JP2001012856A/ja
Publication of JP2001012856A5 publication Critical patent/JP2001012856A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Solid Materials (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
JP11182470A 1999-06-28 1999-06-28 熱処理装置 Pending JP2001012856A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11182470A JP2001012856A (ja) 1999-06-28 1999-06-28 熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11182470A JP2001012856A (ja) 1999-06-28 1999-06-28 熱処理装置

Publications (2)

Publication Number Publication Date
JP2001012856A true JP2001012856A (ja) 2001-01-19
JP2001012856A5 JP2001012856A5 (enExample) 2005-09-08

Family

ID=16118836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11182470A Pending JP2001012856A (ja) 1999-06-28 1999-06-28 熱処理装置

Country Status (1)

Country Link
JP (1) JP2001012856A (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002219425A (ja) * 2001-01-25 2002-08-06 Panakku Kogyo Kk 加圧式洗浄装置
JP2002221394A (ja) * 2001-01-24 2002-08-09 Showa Mfg Co Ltd 電子部品の加熱装置
JP2004144338A (ja) * 2002-10-22 2004-05-20 Showa Mfg Co Ltd ガラス基板用熱処理装置
WO2004083754A1 (ja) * 2003-03-19 2004-09-30 Hirata Corporation 大型基板用多段式加熱装置
WO2004083755A1 (ja) * 2003-03-19 2004-09-30 Hirata Corporation 大型基板用多段式加熱装置
WO2004085942A1 (ja) * 2003-03-24 2004-10-07 Hirata Corporation 大型基板用多段式加熱装置
WO2006022232A1 (ja) * 2004-08-24 2006-03-02 Kabushiki Kaisha Ishiihyoki 塗布膜用乾燥炉
JP2006208005A (ja) * 2001-12-03 2006-08-10 Tokyo Ohka Kogyo Co Ltd 乾燥装置
JP2006292328A (ja) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd 乾燥装置
CN100350207C (zh) * 2002-04-10 2007-11-21 光洋热系统株式会社 加热装置
JP2011510252A (ja) * 2008-01-21 2011-03-31 インターベツト・インターナシヨナル・ベー・ベー 医薬化合物を含有している粒子を凍結乾燥する方法およびこのような粒子を含有する医薬パック
CN102992602A (zh) * 2012-11-28 2013-03-27 江苏宜达光电科技有限公司 微晶玻璃热处理炉
WO2014047888A1 (zh) * 2012-09-26 2014-04-03 深圳市华星光电技术有限公司 对基板进行烤焙处理的装置及方法
KR20160083475A (ko) * 2014-12-31 2016-07-12 주식회사 비아트론 히팅 모듈 및 이를 갖는 열처리 장치
JP5956635B1 (ja) * 2015-03-19 2016-07-27 株式会社ワイエイシイデンコー 加熱装置
JP2016200378A (ja) * 2015-04-14 2016-12-01 株式会社デンソー 加熱装置
JP2022140910A (ja) * 2021-03-15 2022-09-29 株式会社カネカ 光散乱膜付き透光性基板の製造方法、及び有機elパネルの製造方法

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221394A (ja) * 2001-01-24 2002-08-09 Showa Mfg Co Ltd 電子部品の加熱装置
JP2002219425A (ja) * 2001-01-25 2002-08-06 Panakku Kogyo Kk 加圧式洗浄装置
JP2006208005A (ja) * 2001-12-03 2006-08-10 Tokyo Ohka Kogyo Co Ltd 乾燥装置
CN100350207C (zh) * 2002-04-10 2007-11-21 光洋热系统株式会社 加热装置
JP2004144338A (ja) * 2002-10-22 2004-05-20 Showa Mfg Co Ltd ガラス基板用熱処理装置
WO2004083754A1 (ja) * 2003-03-19 2004-09-30 Hirata Corporation 大型基板用多段式加熱装置
WO2004083755A1 (ja) * 2003-03-19 2004-09-30 Hirata Corporation 大型基板用多段式加熱装置
WO2004085942A1 (ja) * 2003-03-24 2004-10-07 Hirata Corporation 大型基板用多段式加熱装置
US8167611B2 (en) 2004-08-24 2012-05-01 Kabushiki Kaisha Ishiihyoki Drying furnace for coated film
WO2006022232A1 (ja) * 2004-08-24 2006-03-02 Kabushiki Kaisha Ishiihyoki 塗布膜用乾燥炉
KR101117536B1 (ko) * 2004-08-24 2012-03-07 이시이 효키 가부시키가이샤 도포막용 건조로
JP2006292328A (ja) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd 乾燥装置
JP2011510252A (ja) * 2008-01-21 2011-03-31 インターベツト・インターナシヨナル・ベー・ベー 医薬化合物を含有している粒子を凍結乾燥する方法およびこのような粒子を含有する医薬パック
US8516714B2 (en) 2008-01-21 2013-08-27 Intervet International B.V. Method for lyophilising particles having a pharmaceutical compound contained therein and a pharmaceutical pack containing such particles
WO2014047888A1 (zh) * 2012-09-26 2014-04-03 深圳市华星光电技术有限公司 对基板进行烤焙处理的装置及方法
CN102992602A (zh) * 2012-11-28 2013-03-27 江苏宜达光电科技有限公司 微晶玻璃热处理炉
KR20160083475A (ko) * 2014-12-31 2016-07-12 주식회사 비아트론 히팅 모듈 및 이를 갖는 열처리 장치
KR101662302B1 (ko) 2014-12-31 2016-10-06 주식회사 비아트론 히팅 모듈 및 이를 갖는 열처리 장치
JP5956635B1 (ja) * 2015-03-19 2016-07-27 株式会社ワイエイシイデンコー 加熱装置
JP2016200378A (ja) * 2015-04-14 2016-12-01 株式会社デンソー 加熱装置
JP2022140910A (ja) * 2021-03-15 2022-09-29 株式会社カネカ 光散乱膜付き透光性基板の製造方法、及び有機elパネルの製造方法

Similar Documents

Publication Publication Date Title
JP2001012856A (ja) 熱処理装置
EP1182692B1 (en) Heat-processing apparatus and method for semiconductor processing
US6949722B2 (en) Method and apparatus for active temperature control of susceptors
KR100241293B1 (ko) 고속열처리로의 온도제어방법 및 그 장치
KR101312676B1 (ko) 액티브 냉각 기판 지지체
JP6246123B2 (ja) 冷却能力を高めた加熱要素
US6353209B1 (en) Temperature processing module
CN101490491B (zh) 用以加热半导体处理腔室的设备和方法
US9184069B2 (en) Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
US7358200B2 (en) Gas-assisted rapid thermal processing
KR100423629B1 (ko) 저항 가열 단일 웨이퍼 노
US20190326139A1 (en) Ceramic wafer heater having cooling channels with minimum fluid drag
TWI844060B (zh) 加熱處理裝置
JP2001012856A5 (enExample)
US6623269B2 (en) Thermal treatment apparatus
JP2001110885A (ja) 半導体処理装置および半導体処理方法
KR100728408B1 (ko) 강제 대류가 지원된 급속 열로
KR101450006B1 (ko) 기판처리장치
JP2004037044A (ja) Fpd用真空加熱炉
JP3612225B2 (ja) プラズマ処理装置
KR200454992Y1 (ko) 기판 처리 장치
JP2001168012A (ja) 熱処理装置
JPH07230965A (ja) 熱処理装置
JP2011134597A (ja) 加熱装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050317

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050317

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070118

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070320

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070518

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080205

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080305

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080610

A912 Removal of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20080718