JP2001007310A - 複数光センサ構造 - Google Patents

複数光センサ構造

Info

Publication number
JP2001007310A
JP2001007310A JP2000132296A JP2000132296A JP2001007310A JP 2001007310 A JP2001007310 A JP 2001007310A JP 2000132296 A JP2000132296 A JP 2000132296A JP 2000132296 A JP2000132296 A JP 2000132296A JP 2001007310 A JP2001007310 A JP 2001007310A
Authority
JP
Japan
Prior art keywords
layer
optical sensor
light
sensor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000132296A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001007310A5 (enExample
Inventor
Jeremy A Theil
ジェレミー・エイ・ゼイル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2001007310A publication Critical patent/JP2001007310A/ja
Publication of JP2001007310A5 publication Critical patent/JP2001007310A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H10F39/1825—Multicolour image sensors having stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP2000132296A 1999-05-03 2000-05-01 複数光センサ構造 Pending JP2001007310A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/304,433 US6373117B1 (en) 1999-05-03 1999-05-03 Stacked multiple photosensor structure including independent electrical connections to each photosensor
US09/304433 1999-05-03

Publications (2)

Publication Number Publication Date
JP2001007310A true JP2001007310A (ja) 2001-01-12
JP2001007310A5 JP2001007310A5 (enExample) 2007-06-14

Family

ID=23176492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000132296A Pending JP2001007310A (ja) 1999-05-03 2000-05-01 複数光センサ構造

Country Status (3)

Country Link
US (1) US6373117B1 (enExample)
EP (1) EP1050907A3 (enExample)
JP (1) JP2001007310A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119113A (ja) * 2013-12-19 2015-06-25 野洲メディカルイメージングテクノロジー株式会社 アクティブマトリクスアレイ基板、信号処理装置、受光装置及び表示装置
JP2016033978A (ja) * 2014-07-31 2016-03-10 キヤノン株式会社 光電変換装置、及び撮像システム
JP6711985B1 (ja) * 2019-07-31 2020-06-17 株式会社京都セミコンダクター 受光素子ユニット
JP2021027321A (ja) * 2019-07-31 2021-02-22 株式会社京都セミコンダクター 受光素子ユニット

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JP2001284631A (ja) * 2000-03-30 2001-10-12 Toshiba Corp 光検出器及び光検出システム
EP1364413A1 (de) * 2001-03-01 2003-11-26 STMicroelectronics N.V. Optoelektronisches bauelement
FR2829875B1 (fr) * 2001-09-14 2004-01-02 Atmel Grenoble Sa Capteur d'image avec creusement des couches de planarisation et procede de fabrication
EP1438750A1 (de) * 2001-10-26 2004-07-21 STMicroelectronics N.V. Verfahren zum herstellen eines tfa-bildsensors sowie tfa-bildsensor
US7282382B2 (en) * 2001-10-29 2007-10-16 Stmicroelectronics N.V. Method for producing a photodiode contact for a TFA image sensor
DE50211700D1 (de) * 2001-10-29 2008-03-27 St Microelectronics Nv Verfahren zur herstellung einer photodiodenkontaktierung für einen tfa-bildsensor
WO2004001853A2 (fr) * 2002-06-25 2003-12-31 Commissariat A L'energie Atomique Imageur
FR2841383B1 (fr) * 2002-06-25 2005-01-07 Commissariat Energie Atomique Imageur pour ultraviolet
EP1535340A1 (en) * 2002-07-16 2005-06-01 STMicroelectronics N.V. Tfa image sensor with stability-optimized photodiode
FR2849273B1 (fr) * 2002-12-19 2005-10-14 Commissariat Energie Atomique Matrice de detecteurs multispectraux
US20060138312A1 (en) * 2004-12-22 2006-06-29 Butterworth Mark M Solid-state spectrophotomer
JP4538337B2 (ja) * 2005-02-15 2010-09-08 富士フイルム株式会社 固体撮像素子
US20070215998A1 (en) * 2006-03-20 2007-09-20 Chi Lin Technology Co., Ltd. LED package structure and method for manufacturing the same
TWI320577B (en) * 2006-09-20 2010-02-11 Powerchip Semiconductor Corp Image sensor structure and method of fabricating the same
KR100789577B1 (ko) * 2006-10-30 2007-12-28 동부일렉트로닉스 주식회사 이미지 소자 및 이의 제조 방법
EP2432015A1 (en) 2007-04-18 2012-03-21 Invisage Technologies, Inc. Materials, systems and methods for optoelectronic devices
US8525287B2 (en) 2007-04-18 2013-09-03 Invisage Technologies, Inc. Materials, systems and methods for optoelectronic devices
US20100044676A1 (en) 2008-04-18 2010-02-25 Invisage Technologies, Inc. Photodetectors and Photovoltaics Based on Semiconductor Nanocrystals
US8138567B2 (en) * 2008-04-18 2012-03-20 Invisage Technologies, Inc. Materials, fabrication equipment, and methods for stable, sensitive photodetectors and image sensors made therefrom
US8203195B2 (en) 2008-04-18 2012-06-19 Invisage Technologies, Inc. Materials, fabrication equipment, and methods for stable, sensitive photodetectors and image sensors made therefrom
JP5136215B2 (ja) * 2008-05-29 2013-02-06 住友ベークライト株式会社 半導体装置
US9136301B2 (en) 2009-11-12 2015-09-15 Maxchip Electronics Corp. Multi-wave band light sensor combined with function of IR sensing and method of fabricating the same
TWI438917B (zh) * 2009-11-12 2014-05-21 Maxchip Electronics Corp 結合紅外線感測之環境光源感測器及其製造方法
CN102087141A (zh) * 2009-12-03 2011-06-08 钜晶电子股份有限公司 结合红外线感测的环境光源传感器及其制造方法
US8916947B2 (en) 2010-06-08 2014-12-23 Invisage Technologies, Inc. Photodetector comprising a pinned photodiode that is formed by an optically sensitive layer and a silicon diode
US9013615B2 (en) * 2011-09-21 2015-04-21 Semiconductor Components Industries, Llc Image sensor with flexible interconnect capabilities
CN104576663B (zh) * 2013-10-23 2017-09-22 中芯国际集成电路制造(上海)有限公司 图像传感单元及其形成方法
JP6217458B2 (ja) * 2014-03-03 2017-10-25 ソニー株式会社 半導体装置およびその製造方法、並びに電子機器
KR102591364B1 (ko) * 2015-09-23 2023-10-19 삼성디스플레이 주식회사 광 센서 및 이를 포함하는 표시 장치
WO2019035930A1 (en) * 2017-08-15 2019-02-21 Bidirectional Display Inc. IMAGE DETECTION PANEL AND METHOD FOR MANUFACTURING SAME

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103165A (ja) * 1981-12-15 1983-06-20 Fuji Photo Film Co Ltd ３層４階構造の固体カラ−撮像デバイス
JPS6015969A (ja) * 1983-07-06 1985-01-26 Mitsubishi Electric Corp カラ−固体撮像素子
JPS61193479A (ja) * 1985-02-22 1986-08-27 Fuji Photo Film Co Ltd 固体カラ−撮像デバイス
JPH0362968A (ja) * 1989-07-31 1991-03-19 Fujitsu Ltd 半導体装置の製造方法
JPH0945952A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd Ｘ線検出器及び二次元ｘ線センサー・マトリックス・アレイ
WO1999012206A1 (de) * 1997-08-28 1999-03-11 Forschungszentrum Jülich GmbH Mehrfarbensensor

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US4438455A (en) * 1981-12-15 1984-03-20 Fuji Photo Film Co., Ltd. Solid-state color imager with three layer four story structure
US4443813A (en) * 1981-12-15 1984-04-17 Fuji Photo Film Co., Ltd. Solid-state color imager with two layer three story structure
JPS61204967A (ja) * 1985-03-08 1986-09-11 Fuji Photo Film Co Ltd 固体カラ−撮像デバイス
JPH03150876A (ja) * 1989-11-08 1991-06-27 Fujitsu Ltd フォト・ダイオード
DE19512493A1 (de) * 1995-04-04 1996-10-10 Siemens Ag Farbsensoranordnung
US5838054A (en) * 1996-12-23 1998-11-17 General Electric Company Contact pads for radiation imagers
US6114739A (en) * 1998-10-19 2000-09-05 Agilent Technologies Elevated pin diode active pixel sensor which includes a patterned doped semiconductor electrode

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103165A (ja) * 1981-12-15 1983-06-20 Fuji Photo Film Co Ltd ３層４階構造の固体カラ−撮像デバイス
JPS6015969A (ja) * 1983-07-06 1985-01-26 Mitsubishi Electric Corp カラ−固体撮像素子
JPS61193479A (ja) * 1985-02-22 1986-08-27 Fuji Photo Film Co Ltd 固体カラ−撮像デバイス
JPH0362968A (ja) * 1989-07-31 1991-03-19 Fujitsu Ltd 半導体装置の製造方法
JPH0945952A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd Ｘ線検出器及び二次元ｘ線センサー・マトリックス・アレイ
WO1999012206A1 (de) * 1997-08-28 1999-03-11 Forschungszentrum Jülich GmbH Mehrfarbensensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119113A (ja) * 2013-12-19 2015-06-25 野洲メディカルイメージングテクノロジー株式会社 アクティブマトリクスアレイ基板、信号処理装置、受光装置及び表示装置
JP2016033978A (ja) * 2014-07-31 2016-03-10 キヤノン株式会社 光電変換装置、及び撮像システム
JP6711985B1 (ja) * 2019-07-31 2020-06-17 株式会社京都セミコンダクター 受光素子ユニット
WO2021019744A1 (ja) * 2019-07-31 2021-02-04 株式会社京都セミコンダクター 受光素子ユニット
JP2021027321A (ja) * 2019-07-31 2021-02-22 株式会社京都セミコンダクター 受光素子ユニット
US11145773B2 (en) 2019-07-31 2021-10-12 Kyoto Semiconductor Co., Ltd. Light receiving element unit

Also Published As

Publication number Publication date
EP1050907A2 (en) 2000-11-08
EP1050907A3 (en) 2001-12-19
US6373117B1 (en) 2002-04-16

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