FR2849273B1 - Matrice de detecteurs multispectraux - Google Patents
Matrice de detecteurs multispectrauxInfo
- Publication number
- FR2849273B1 FR2849273B1 FR0216178A FR0216178A FR2849273B1 FR 2849273 B1 FR2849273 B1 FR 2849273B1 FR 0216178 A FR0216178 A FR 0216178A FR 0216178 A FR0216178 A FR 0216178A FR 2849273 B1 FR2849273 B1 FR 2849273B1
- Authority
- FR
- France
- Prior art keywords
- matrix
- multispectral detectors
- multispectral
- detectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14669—Infrared imagers
- H01L27/1467—Infrared imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
- H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/1465—Infrared imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/14652—Multispectral infrared imagers, having a stacked pixel-element structure, e.g. npn, npnpn or MQW structures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0216178A FR2849273B1 (fr) | 2002-12-19 | 2002-12-19 | Matrice de detecteurs multispectraux |
PCT/FR2003/050186 WO2004057675A1 (fr) | 2002-12-19 | 2003-12-17 | Matrice de detecteurs multispectraux |
EP03809998A EP1573821A1 (fr) | 2002-12-19 | 2003-12-17 | Matrice de detecteurs multispectraux |
US10/540,334 US7352043B2 (en) | 2002-12-19 | 2003-12-17 | Multispectral detector matrix |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0216178A FR2849273B1 (fr) | 2002-12-19 | 2002-12-19 | Matrice de detecteurs multispectraux |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2849273A1 FR2849273A1 (fr) | 2004-06-25 |
FR2849273B1 true FR2849273B1 (fr) | 2005-10-14 |
Family
ID=32406204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0216178A Expired - Fee Related FR2849273B1 (fr) | 2002-12-19 | 2002-12-19 | Matrice de detecteurs multispectraux |
Country Status (4)
Country | Link |
---|---|
US (1) | US7352043B2 (fr) |
EP (1) | EP1573821A1 (fr) |
FR (1) | FR2849273B1 (fr) |
WO (1) | WO2004057675A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005098956A1 (fr) * | 2004-04-12 | 2005-10-20 | Nanyang Technological University | Procede et dispositif de photodetection sensibles a la longueur d'onde, utilisant plusieurs jonctions pn |
DE102004060365B4 (de) | 2004-12-15 | 2009-03-19 | Austriamicrosystems Ag | Bauelement mit Halbleiterübergang und Verfahren zur Herstellung |
KR100850859B1 (ko) * | 2006-12-21 | 2008-08-06 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 그 제조 방법 |
US7791159B2 (en) * | 2007-10-30 | 2010-09-07 | Panasonic Corporation | Solid-state imaging device and method for fabricating the same |
FR2924803A1 (fr) * | 2007-12-11 | 2009-06-12 | Commissariat Energie Atomique | Dispositif d'analyse spectroscopique interferentielle |
US8399820B2 (en) * | 2009-06-23 | 2013-03-19 | Sensors Unlimited, Inc. | Multicolor detectors and applications thereof |
JP6017311B2 (ja) * | 2010-06-01 | 2016-10-26 | 博立▲碼▼杰通▲訊▼(深▲せん▼)有限公司Boly Media Communications(Shenzhen)Co.,Ltd. | マルチスペクトル感光部材およびその製作方法 |
FR2965104B1 (fr) * | 2010-09-16 | 2013-06-07 | Commissariat Energie Atomique | Detecteur bispectral multicouche a photodiodes et procede de fabrication d'un tel detecteur |
FR2982706A1 (fr) * | 2011-11-15 | 2013-05-17 | Soc Fr Detecteurs Infrarouges Sofradir | Dispositif de detection de deux couleurs differentes a conditions de fonctionnement ameliorees |
JP6291895B2 (ja) * | 2014-02-20 | 2018-03-14 | 富士通株式会社 | 赤外線検出器及びその製造方法 |
US9881966B2 (en) * | 2015-07-17 | 2018-01-30 | International Business Machines Corporation | Three-dimensional integrated multispectral imaging sensor |
US10763092B2 (en) * | 2017-11-29 | 2020-09-01 | L-3 Communications Corporation-Insight Technology Division | Dual-spectrum photocathode for image intensification |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4206470A (en) * | 1977-09-01 | 1980-06-03 | Honeywell Inc. | Thin film interconnect for multicolor IR/CCD |
US4514755A (en) * | 1983-07-08 | 1985-04-30 | Fuji Photo Film Co., Ltd. | Solid-state color imager with two layer three story structure |
US5373182A (en) * | 1993-01-12 | 1994-12-13 | Santa Barbara Research Center | Integrated IR and visible detector |
US5552603A (en) * | 1994-09-15 | 1996-09-03 | Martin Marietta Corporation | Bias and readout for multicolor quantum well detectors |
FR2756667B1 (fr) * | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques bispectral |
KR20010040506A (ko) * | 1998-02-02 | 2001-05-15 | 유니액스 코포레이션 | 유기 반도체로부터 제조한 영상 센서 |
US6465860B2 (en) * | 1998-09-01 | 2002-10-15 | Kabushiki Kaisha Toshiba | Multi-wavelength semiconductor image sensor and method of manufacturing the same |
US6373117B1 (en) * | 1999-05-03 | 2002-04-16 | Agilent Technologies, Inc. | Stacked multiple photosensor structure including independent electrical connections to each photosensor |
JP4330210B2 (ja) * | 1999-07-30 | 2009-09-16 | 富士通株式会社 | 光半導体装置及びその製造方法 |
-
2002
- 2002-12-19 FR FR0216178A patent/FR2849273B1/fr not_active Expired - Fee Related
-
2003
- 2003-12-17 EP EP03809998A patent/EP1573821A1/fr not_active Withdrawn
- 2003-12-17 WO PCT/FR2003/050186 patent/WO2004057675A1/fr active Application Filing
- 2003-12-17 US US10/540,334 patent/US7352043B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2004057675A1 (fr) | 2004-07-08 |
US7352043B2 (en) | 2008-04-01 |
EP1573821A1 (fr) | 2005-09-14 |
US20060038251A1 (en) | 2006-02-23 |
FR2849273A1 (fr) | 2004-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150831 |