JP2000344599A5 - - Google Patents

Download PDF

Info

Publication number
JP2000344599A5
JP2000344599A5 JP2000027362A JP2000027362A JP2000344599A5 JP 2000344599 A5 JP2000344599 A5 JP 2000344599A5 JP 2000027362 A JP2000027362 A JP 2000027362A JP 2000027362 A JP2000027362 A JP 2000027362A JP 2000344599 A5 JP2000344599 A5 JP 2000344599A5
Authority
JP
Japan
Prior art keywords
oxide
rare earth
silicon substrate
earth oxide
plane orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000027362A
Other languages
English (en)
Japanese (ja)
Other versions
JP4239343B2 (ja
JP2000344599A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000027362A priority Critical patent/JP4239343B2/ja
Priority claimed from JP2000027362A external-priority patent/JP4239343B2/ja
Publication of JP2000344599A publication Critical patent/JP2000344599A/ja
Publication of JP2000344599A5 publication Critical patent/JP2000344599A5/ja
Application granted granted Critical
Publication of JP4239343B2 publication Critical patent/JP4239343B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000027362A 1999-03-26 2000-01-31 酸化物の結晶成長方法、電界効果トランジスタの製造方法および強誘電体不揮発性メモリの製造方法 Expired - Fee Related JP4239343B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000027362A JP4239343B2 (ja) 1999-03-26 2000-01-31 酸化物の結晶成長方法、電界効果トランジスタの製造方法および強誘電体不揮発性メモリの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8491999 1999-03-26
JP11-84919 1999-03-26
JP2000027362A JP4239343B2 (ja) 1999-03-26 2000-01-31 酸化物の結晶成長方法、電界効果トランジスタの製造方法および強誘電体不揮発性メモリの製造方法

Publications (3)

Publication Number Publication Date
JP2000344599A JP2000344599A (ja) 2000-12-12
JP2000344599A5 true JP2000344599A5 (enrdf_load_stackoverflow) 2006-02-16
JP4239343B2 JP4239343B2 (ja) 2009-03-18

Family

ID=26425882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000027362A Expired - Fee Related JP4239343B2 (ja) 1999-03-26 2000-01-31 酸化物の結晶成長方法、電界効果トランジスタの製造方法および強誘電体不揮発性メモリの製造方法

Country Status (1)

Country Link
JP (1) JP4239343B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569240B1 (en) 1999-03-17 2003-05-27 Matsushita Electric Industrial Co., Ltd. Dielectric film and method for forming the same
JP3470068B2 (ja) 1999-09-01 2003-11-25 松下電器産業株式会社 誘電体膜の形成方法
GB2447683B (en) 2007-03-21 2011-05-04 Advanced Risc Mach Ltd Techniques for generating a trace stream for a data processing apparatus
JP5029539B2 (ja) * 2007-09-04 2012-09-19 三菱マテリアル株式会社 多結晶シリコンの洗浄方法及び多結晶シリコンの製造方法
JP5262068B2 (ja) * 2007-11-01 2013-08-14 富士ゼロックス株式会社 画像形成装置
JP2009224403A (ja) * 2008-03-13 2009-10-01 Toshiba Corp 情報記録素子及びそれを備えた情報記録再生装置
JP2010212391A (ja) * 2009-03-10 2010-09-24 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置

Similar Documents

Publication Publication Date Title
EP1109212B1 (en) Semiconductor structure having a crystalline alkaline earth metal silicon nitride/oxide interface with silicon
US6291319B1 (en) Method for fabricating a semiconductor structure having a stable crystalline interface with silicon
TWI305660B (enrdf_load_stackoverflow)
US6241821B1 (en) Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
US6248459B1 (en) Semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
US6224669B1 (en) Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon
US6270568B1 (en) Method for fabricating a semiconductor structure with reduced leakage current density
JP6737983B2 (ja) 応力を緩和するアモルファスSiO2中間層
JP7609865B2 (ja) 複合基板のための高抵抗率ハンドル支持体を形成する方法
KR100707215B1 (ko) 고배향성 실리콘 박막 형성 방법, 3d 반도체소자 제조방법 및 3d 반도체소자
JP2001068467A (ja) シリコンとの金属酸化物インタフェースを備える半導体構造の作成方法
JP2002237579A (ja) 半導体装置用基板、soi基板およびそれらの製造方法
JP2003257854A5 (enrdf_load_stackoverflow)
JP2000344599A5 (enrdf_load_stackoverflow)
JP3095944B2 (ja) 酸化物結晶薄膜の製造方法及び薄膜素子
JP2000281494A5 (enrdf_load_stackoverflow)
JPH10270653A (ja) 酸化物積層構造およびその製造方法ならびに強誘電体不揮発性メモリ
JP2001024165A5 (enrdf_load_stackoverflow)
KR950004553A (ko) 반도체 장치의 제조방법
JP2004349481A (ja) チタン酸ストロンチウム薄膜積層体及びその作製方法
JP4075120B2 (ja) 強誘電体薄膜の製造方法
CN118007101B (zh) 一种hzo铁电材料的制备方法
JPH0395920A (ja) 結晶性の改良方法
JP3985288B2 (ja) 半導体結晶成長方法
CN114497368A (zh) 一种提高掺杂氧化铪薄膜铁电器件性能的方法