JP2000254771A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000254771A5 JP2000254771A5 JP1999060899A JP6089999A JP2000254771A5 JP 2000254771 A5 JP2000254771 A5 JP 2000254771A5 JP 1999060899 A JP1999060899 A JP 1999060899A JP 6089999 A JP6089999 A JP 6089999A JP 2000254771 A5 JP2000254771 A5 JP 2000254771A5
- Authority
- JP
- Japan
- Prior art keywords
- ladle
- lining
- granular
- particle size
- skull
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims description 6
- 238000003723 Smelting Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000007873 sieving Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 4
- 238000005266 casting Methods 0.000 claims 3
- 229910001018 Cast iron Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 2
- 210000003625 skull Anatomy 0.000 claims 2
- 229910001208 Crucible steel Inorganic materials 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- 239000008187 granular material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004880 explosion Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06089999A JP4087000B2 (ja) | 1999-03-08 | 1999-03-08 | レードル及びレードルのライニング方法 |
| US09/520,158 US6284044B1 (en) | 1999-03-08 | 2000-03-07 | Film forming method and film forming apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06089999A JP4087000B2 (ja) | 1999-03-08 | 1999-03-08 | レードル及びレードルのライニング方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000254771A JP2000254771A (ja) | 2000-09-19 |
| JP2000254771A5 true JP2000254771A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2005-06-23 |
| JP4087000B2 JP4087000B2 (ja) | 2008-05-14 |
Family
ID=13155675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06089999A Expired - Lifetime JP4087000B2 (ja) | 1999-03-08 | 1999-03-08 | レードル及びレードルのライニング方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6284044B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JP4087000B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6551403B1 (en) * | 2000-05-25 | 2003-04-22 | Nec Electronics, Inc. | Solvent pre-wet system for wafers |
| JP3754322B2 (ja) * | 2001-05-24 | 2006-03-08 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
| JP2004322168A (ja) * | 2003-04-25 | 2004-11-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| JP4731913B2 (ja) * | 2003-04-25 | 2011-07-27 | 株式会社半導体エネルギー研究所 | パターンの形成方法および半導体装置の製造方法 |
| US7713841B2 (en) * | 2003-09-19 | 2010-05-11 | Micron Technology, Inc. | Methods for thinning semiconductor substrates that employ support structures formed on the substrates |
| TWI240952B (en) * | 2003-10-28 | 2005-10-01 | Samsung Electronics Co Ltd | System for rinsing and drying semiconductor substrates and method therefor |
| KR100564582B1 (ko) * | 2003-10-28 | 2006-03-29 | 삼성전자주식회사 | 전자 소자 기판의 표면 처리 장치 및 이를 이용한 표면처리 방법 |
| JP2005161168A (ja) * | 2003-12-01 | 2005-06-23 | Tokyo Ohka Kogyo Co Ltd | 被膜形成方法 |
| US7244665B2 (en) * | 2004-04-29 | 2007-07-17 | Micron Technology, Inc. | Wafer edge ring structures and methods of formation |
| KR100596783B1 (ko) * | 2004-05-03 | 2006-07-04 | 주식회사 하이닉스반도체 | 감광액 도포장치 |
| JP4343022B2 (ja) * | 2004-05-10 | 2009-10-14 | 東京エレクトロン株式会社 | 基板の処理方法及び基板の処理装置 |
| JP3988834B2 (ja) * | 2004-06-03 | 2007-10-10 | 芝浦メカトロニクス株式会社 | 樹脂層形成方法及び樹脂層形成装置、ディスク及びディスク製造方法 |
| US8158517B2 (en) * | 2004-06-28 | 2012-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing wiring substrate, thin film transistor, display device and television device |
| JP4531502B2 (ja) * | 2004-09-14 | 2010-08-25 | 東京エレクトロン株式会社 | 塗布処理装置 |
| JP4216238B2 (ja) * | 2004-09-24 | 2009-01-28 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布処理方法 |
| DE102004053139A1 (de) * | 2004-11-03 | 2006-06-01 | Süss Microtec Lithography Gmbh | Drehbare Vorrichtung zum Halten eines Substrats |
| CN100592208C (zh) * | 2006-07-03 | 2010-02-24 | 元太科技工业股份有限公司 | 防止静电聚集的光刻胶涂布机承载盘 |
| US20080176004A1 (en) * | 2007-01-19 | 2008-07-24 | Tokyo Electron Limited | Coating treatment apparatus, substrate treatment system, coating treatment method, and computer storage medium |
| JP5262117B2 (ja) * | 2007-04-11 | 2013-08-14 | 株式会社リコー | スピンコート装置及びその温度制御方法、並びに光ディスク製造装置及び光ディスク製造方法 |
| CN109676839B (zh) * | 2018-12-11 | 2022-02-22 | 上海航天控制技术研究所 | 一种用于多类型陀螺仪的智能固胶仪器 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5609995A (en) * | 1995-08-30 | 1997-03-11 | Micron Technology, Inc. | Method for forming a thin uniform layer of resist for lithography |
| JP3300624B2 (ja) | 1997-01-24 | 2002-07-08 | 東京エレクトロン株式会社 | 基板端面の洗浄方法 |
| US6094965A (en) * | 1998-05-29 | 2000-08-01 | Vlsi Technology, Inc. | Semiconductor calibration structures and calibration wafers for ascertaining layer alignment during processing and calibrating multiple semiconductor wafer coating systems |
| US6121130A (en) * | 1998-11-16 | 2000-09-19 | Chartered Semiconductor Manufacturing Ltd. | Laser curing of spin-on dielectric thin films |
-
1999
- 1999-03-08 JP JP06089999A patent/JP4087000B2/ja not_active Expired - Lifetime
-
2000
- 2000-03-07 US US09/520,158 patent/US6284044B1/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000254771A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP4087000B2 (ja) | レードル及びレードルのライニング方法 | |
| JPH0125809B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| US3888956A (en) | Method of making granulate | |
| CA2067067A1 (en) | Metallurgical fluxes | |
| US2988444A (en) | Method and apparatus for treating molten metal | |
| US4046323A (en) | Process for controlled slow cooling of non-ferrous smelting slags | |
| JP4031070B2 (ja) | 重量骨材 | |
| WO1997012069A1 (fr) | Materiau destine a la preparation de lingots pour la production d'acier, procede de production du materiau, lingots destines a la production d'acier et procede et machine de production de ces lingots | |
| JP2009028779A (ja) | 固形化スラグ凝集材 | |
| CN115094301A (zh) | 微颗粒稀土镁硅铁球化剂的球化处理方法 | |
| JP5303978B2 (ja) | スラグ除去材および除去方法 | |
| US4111691A (en) | Crushable low reactivity nickel-base magnesium additive | |
| US2839393A (en) | Addition agent and method for treating cast iron | |
| RU2092567C1 (ru) | Способ модифицирования чугуна | |
| RU2834662C1 (ru) | Способ сфероидизирующего модифицирования высокопрочных чугунов в барабанном ковше | |
| RU2027792C1 (ru) | Способ извлечения металла из шлака | |
| SU1167211A1 (ru) | Способ легировани сплавов при разливке | |
| JPS5932535B2 (ja) | スラグの性状改良方法 | |
| SU1091987A1 (ru) | Способ защиты поддонов изложниц | |
| ES2608934B2 (es) | Procedimiento de obtención de fundición nodular | |
| RU2146181C1 (ru) | Способ получения полуфабриката для металлургического передела | |
| SU1724420A1 (ru) | Способ разливки стали сверху в изложницы | |
| RU1782188C (ru) | Поддон дл разливки стали сверху | |
| CN104131129B (zh) | 一种粉末冶金型蠕化剂及其制备方法 |