JP2000208614A5 - - Google Patents

Download PDF

Info

Publication number
JP2000208614A5
JP2000208614A5 JP1999007759A JP775999A JP2000208614A5 JP 2000208614 A5 JP2000208614 A5 JP 2000208614A5 JP 1999007759 A JP1999007759 A JP 1999007759A JP 775999 A JP775999 A JP 775999A JP 2000208614 A5 JP2000208614 A5 JP 2000208614A5
Authority
JP
Japan
Prior art keywords
film
insulating film
soi substrate
semiconductor device
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999007759A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000208614A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11007759A priority Critical patent/JP2000208614A/ja
Priority claimed from JP11007759A external-priority patent/JP2000208614A/ja
Priority to US09/325,644 priority patent/US6436792B1/en
Publication of JP2000208614A publication Critical patent/JP2000208614A/ja
Publication of JP2000208614A5 publication Critical patent/JP2000208614A5/ja
Pending legal-status Critical Current

Links

JP11007759A 1999-01-14 1999-01-14 半導体装置の製造方法及び半導体装置 Pending JP2000208614A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11007759A JP2000208614A (ja) 1999-01-14 1999-01-14 半導体装置の製造方法及び半導体装置
US09/325,644 US6436792B1 (en) 1999-01-14 1999-06-04 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11007759A JP2000208614A (ja) 1999-01-14 1999-01-14 半導体装置の製造方法及び半導体装置

Publications (2)

Publication Number Publication Date
JP2000208614A JP2000208614A (ja) 2000-07-28
JP2000208614A5 true JP2000208614A5 (OSRAM) 2006-04-06

Family

ID=11674630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11007759A Pending JP2000208614A (ja) 1999-01-14 1999-01-14 半導体装置の製造方法及び半導体装置

Country Status (2)

Country Link
US (1) US6436792B1 (OSRAM)
JP (1) JP2000208614A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8405147B2 (en) 2005-07-11 2013-03-26 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink
US8669804B2 (en) 2008-02-28 2014-03-11 Peregrine Semiconductor Corporation Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals
US8954902B2 (en) 2005-07-11 2015-02-10 Peregrine Semiconductor Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US9225378B2 (en) 2001-10-10 2015-12-29 Peregrine Semiconductor Corpopration Switch circuit and method of switching radio frequency signals
US9590674B2 (en) 2012-12-14 2017-03-07 Peregrine Semiconductor Corporation Semiconductor devices with switchable ground-body connection

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659826B2 (ja) 2004-06-23 2011-03-30 ペレグリン セミコンダクター コーポレーション Rfフロントエンド集積回路
US8742502B2 (en) 2005-07-11 2014-06-03 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
US20080076371A1 (en) 2005-07-11 2008-03-27 Alexander Dribinsky Circuit and method for controlling charge injection in radio frequency switches
US9653601B2 (en) 2005-07-11 2017-05-16 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink-harmonic wrinkle reduction
USRE48965E1 (en) 2005-07-11 2022-03-08 Psemi Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US7411245B2 (en) * 2005-11-30 2008-08-12 Taiwan Semiconductor Manufacturing Co., Ltd. Spacer barrier structure to prevent spacer voids and method for forming the same
US7960772B2 (en) 2007-04-26 2011-06-14 Peregrine Semiconductor Corporation Tuning capacitance to enhance FET stack voltage withstand
US8723260B1 (en) 2009-03-12 2014-05-13 Rf Micro Devices, Inc. Semiconductor radio frequency switch with body contact
US20150236798A1 (en) 2013-03-14 2015-08-20 Peregrine Semiconductor Corporation Methods for Increasing RF Throughput Via Usage of Tunable Filters
US9406695B2 (en) 2013-11-20 2016-08-02 Peregrine Semiconductor Corporation Circuit and method for improving ESD tolerance and switching speed
US9831857B2 (en) 2015-03-11 2017-11-28 Peregrine Semiconductor Corporation Power splitter with programmable output phase shift
JP6763703B2 (ja) * 2016-06-17 2020-09-30 ラピスセミコンダクタ株式会社 半導体装置および半導体装置の製造方法
US9948281B2 (en) 2016-09-02 2018-04-17 Peregrine Semiconductor Corporation Positive logic digitally tunable capacitor
US10505530B2 (en) 2018-03-28 2019-12-10 Psemi Corporation Positive logic switch with selectable DC blocking circuit
US10886911B2 (en) 2018-03-28 2021-01-05 Psemi Corporation Stacked FET switch bias ladders
US10236872B1 (en) 2018-03-28 2019-03-19 Psemi Corporation AC coupling modules for bias ladders
US11476849B2 (en) 2020-01-06 2022-10-18 Psemi Corporation High power positive logic switch

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507567B2 (ja) * 1988-11-25 1996-06-12 三菱電機株式会社 絶縁体基板上の半導体層に形成されたmos型電界効果トランジスタ
JP2547663B2 (ja) * 1990-10-03 1996-10-23 三菱電機株式会社 半導体装置
US6171931B1 (en) * 1994-12-15 2001-01-09 Sgs-Thomson Microelectronics S.R.L. Wafer of semiconductor material for fabricating integrated devices, and process for its fabrication
JPH1022462A (ja) * 1996-06-28 1998-01-23 Sharp Corp 半導体装置及びその製造方法
KR100218668B1 (ko) * 1996-12-14 1999-09-01 권혁준 바이폴라 소자의 컬랙터 장치 및 그 제조방법
US5973358A (en) * 1997-07-01 1999-10-26 Citizen Watch Co., Ltd. SOI device having a channel with variable thickness
KR100253406B1 (ko) * 1998-01-20 2000-04-15 김영환 반도체 파워 집적회로에서의 소자격리구조 및 그 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9225378B2 (en) 2001-10-10 2015-12-29 Peregrine Semiconductor Corpopration Switch circuit and method of switching radio frequency signals
US8405147B2 (en) 2005-07-11 2013-03-26 Peregrine Semiconductor Corporation Method and apparatus for use in improving linearity of MOSFETs using an accumulated charge sink
US8954902B2 (en) 2005-07-11 2015-02-10 Peregrine Semiconductor Corporation Method and apparatus improving gate oxide reliability by controlling accumulated charge
US8669804B2 (en) 2008-02-28 2014-03-11 Peregrine Semiconductor Corporation Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals
US9590674B2 (en) 2012-12-14 2017-03-07 Peregrine Semiconductor Corporation Semiconductor devices with switchable ground-body connection

Similar Documents

Publication Publication Date Title
JP2000208614A5 (OSRAM)
JP3402022B2 (ja) 半導体装置の製造方法
US6436792B1 (en) Method of manufacturing semiconductor device
JP3917327B2 (ja) 半導体装置の製造方法及び装置
KR20120091567A (ko) 소자 분리막 구조물 형성 방법
JP2002246460A (ja) 浅いトレンチアイソレーション構造を有する半導体装置及びその製造方法
TWI690025B (zh) 絕緣體上半導體基底、其形成方法以及積體電路
JP2019526936A (ja) Vdmos装置およびその製造方法
CN110364544A (zh) 一种晶圆结构及其制造方法、芯片结构
JP2001257259A (ja) 素子分離構造形成方法
US12014953B2 (en) Semiconductor device mitigating parasitic capacitance and method of fabricating the same
JP2001127169A (ja) 半導体装置およびその製造方法
JP3362588B2 (ja) 半導体装置の製造方法
CN113192890A (zh) 半导体器件的制造方法
TWI515825B (zh) 半導體結構及其製造方法
JP4175650B2 (ja) 半導体装置の製造方法
JP2010103242A (ja) 半導体装置の製造方法および半導体装置
JP2004363486A (ja) トレンチ分離を有する半導体装置およびその製造方法
JP2011216897A (ja) 半導体装置
JP2008244229A (ja) 半導体装置の製造方法及び半導体装置
CN118248646A (zh) 半导体器件及其制作方法
JP4360413B2 (ja) 半導体装置の製造方法
JP4565847B2 (ja) 半導体装置およびその製造方法
US8927387B2 (en) Robust isolation for thin-box ETSOI MOSFETS
JP3609660B2 (ja) 半導体装置の製造方法及び半導体装置