JP2000208589A - 処理装置 - Google Patents
処理装置Info
- Publication number
- JP2000208589A JP2000208589A JP31233699A JP31233699A JP2000208589A JP 2000208589 A JP2000208589 A JP 2000208589A JP 31233699 A JP31233699 A JP 31233699A JP 31233699 A JP31233699 A JP 31233699A JP 2000208589 A JP2000208589 A JP 2000208589A
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- transfer
- chamber
- load lock
- load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 122
- 238000012546 transfer Methods 0.000 claims abstract description 203
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 230000001174 ascending effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 72
- 230000010485 coping Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 24
- 239000007789 gas Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 8
- 230000032258 transport Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 238000013507 mapping Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012384 transportation and delivery Methods 0.000 description 3
- ULEBESPCVWBNIF-BYPYZUCNSA-N L-arginine amide Chemical compound NC(=O)[C@@H](N)CCCNC(N)=N ULEBESPCVWBNIF-BYPYZUCNSA-N 0.000 description 2
- 235000001630 Pyrus pyrifolia var culta Nutrition 0.000 description 2
- 240000002609 Pyrus pyrifolia var. culta Species 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31233699A JP2000208589A (ja) | 1998-11-09 | 1999-11-02 | 処理装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33497498 | 1998-11-09 | ||
| JP10-334974 | 1998-11-09 | ||
| JP31233699A JP2000208589A (ja) | 1998-11-09 | 1999-11-02 | 処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000208589A true JP2000208589A (ja) | 2000-07-28 |
| JP2000208589A5 JP2000208589A5 (enExample) | 2006-12-14 |
Family
ID=26567119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31233699A Pending JP2000208589A (ja) | 1998-11-09 | 1999-11-02 | 処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000208589A (enExample) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002324829A (ja) * | 2001-07-13 | 2002-11-08 | Tokyo Electron Ltd | 処理システム |
| US7090741B2 (en) | 2001-08-31 | 2006-08-15 | Tokyo Electron Limited | Semiconductor processing system |
| CN1310301C (zh) * | 2002-02-22 | 2007-04-11 | 东京毅力科创株式会社 | 半导体处理系统中的端口机构 |
| KR100749546B1 (ko) | 2006-07-04 | 2007-08-14 | 세메스 주식회사 | 반도체 기판의 이송 장치, 기판 처리 장치, 그리고 이를이용한 기판의 온도 제어 방법 |
| KR100749755B1 (ko) | 2006-02-10 | 2007-08-16 | 주식회사 싸이맥스 | 웨이퍼 처리장치 |
| CN100336634C (zh) * | 2002-11-27 | 2007-09-12 | 东京毅力科创株式会社 | 输送系统的输送位置对准方法 |
| JP2007533167A (ja) * | 2004-04-16 | 2007-11-15 | アクセリス テクノロジーズ インコーポレーテッド | ワークピース処理システム |
| US7351291B2 (en) | 2002-02-20 | 2008-04-01 | Tokyo Electron Limited | Semiconductor processing system |
| JP2009076705A (ja) * | 2007-09-21 | 2009-04-09 | Tokyo Electron Ltd | ロードロック装置および真空処理システム |
| JP2010087177A (ja) * | 2008-09-30 | 2010-04-15 | Tokyo Electron Ltd | 搬送機構の制御方法、基板処理装置、及び記憶媒体 |
| US7857569B2 (en) | 2002-02-25 | 2010-12-28 | Tokyo Electron Limited | Semiconductor processing system |
| JP2011009342A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | 基板処理装置の制御方法及び記憶媒体 |
| KR101184596B1 (ko) | 2010-12-22 | 2012-09-21 | 주식회사 원익아이피에스 | 기판 이송 장치 및 그 동작 방법 |
| KR20140000265A (ko) | 2010-12-09 | 2014-01-02 | 도쿄엘렉트론가부시키가이샤 | 로드록 장치 |
| JP2014236193A (ja) * | 2013-06-05 | 2014-12-15 | Sppテクノロジーズ株式会社 | 基板搬送装置、及びこれを用いた基板搬送方法 |
| JP2016225625A (ja) * | 2015-05-29 | 2016-12-28 | ピーエスケー インコーポレイテッド | 基板処理装置及び方法 |
| US9541920B2 (en) | 2012-10-15 | 2017-01-10 | Tokyo Electron Limited | Method for positioning a transfer unit, method for calculating positional deviation amount of an object to be processed, and method for correcting teaching data of the transfer unit |
| KR20170048200A (ko) | 2015-10-26 | 2017-05-08 | 도쿄엘렉트론가부시키가이샤 | 로드록 장치에 있어서의 기판 냉각 방법, 기판 반송 방법, 및 로드록 장치 |
| JPWO2016038656A1 (ja) * | 2014-09-08 | 2017-06-01 | 株式会社安川電機 | ロボットシステムおよび搬送方法 |
| US20200388515A1 (en) * | 2018-03-01 | 2020-12-10 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
| JP2023165990A (ja) * | 2018-12-12 | 2023-11-17 | 東京エレクトロン株式会社 | 基板処理システム、搬送方法、搬送プログラムおよび保持具 |
-
1999
- 1999-11-02 JP JP31233699A patent/JP2000208589A/ja active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002324829A (ja) * | 2001-07-13 | 2002-11-08 | Tokyo Electron Ltd | 処理システム |
| US7090741B2 (en) | 2001-08-31 | 2006-08-15 | Tokyo Electron Limited | Semiconductor processing system |
| US7351291B2 (en) | 2002-02-20 | 2008-04-01 | Tokyo Electron Limited | Semiconductor processing system |
| CN1310301C (zh) * | 2002-02-22 | 2007-04-11 | 东京毅力科创株式会社 | 半导体处理系统中的端口机构 |
| US7857569B2 (en) | 2002-02-25 | 2010-12-28 | Tokyo Electron Limited | Semiconductor processing system |
| CN100336634C (zh) * | 2002-11-27 | 2007-09-12 | 东京毅力科创株式会社 | 输送系统的输送位置对准方法 |
| JP2007533167A (ja) * | 2004-04-16 | 2007-11-15 | アクセリス テクノロジーズ インコーポレーテッド | ワークピース処理システム |
| KR100749755B1 (ko) | 2006-02-10 | 2007-08-16 | 주식회사 싸이맥스 | 웨이퍼 처리장치 |
| KR100749546B1 (ko) | 2006-07-04 | 2007-08-14 | 세메스 주식회사 | 반도체 기판의 이송 장치, 기판 처리 장치, 그리고 이를이용한 기판의 온도 제어 방법 |
| JP2009076705A (ja) * | 2007-09-21 | 2009-04-09 | Tokyo Electron Ltd | ロードロック装置および真空処理システム |
| JP2010087177A (ja) * | 2008-09-30 | 2010-04-15 | Tokyo Electron Ltd | 搬送機構の制御方法、基板処理装置、及び記憶媒体 |
| JP2011009342A (ja) * | 2009-06-24 | 2011-01-13 | Tokyo Electron Ltd | 基板処理装置の制御方法及び記憶媒体 |
| US9228685B2 (en) | 2010-12-09 | 2016-01-05 | Tokyo Electron Limited | Load lock device |
| KR20140000265A (ko) | 2010-12-09 | 2014-01-02 | 도쿄엘렉트론가부시키가이샤 | 로드록 장치 |
| KR101184596B1 (ko) | 2010-12-22 | 2012-09-21 | 주식회사 원익아이피에스 | 기판 이송 장치 및 그 동작 방법 |
| US9541920B2 (en) | 2012-10-15 | 2017-01-10 | Tokyo Electron Limited | Method for positioning a transfer unit, method for calculating positional deviation amount of an object to be processed, and method for correcting teaching data of the transfer unit |
| JP2014236193A (ja) * | 2013-06-05 | 2014-12-15 | Sppテクノロジーズ株式会社 | 基板搬送装置、及びこれを用いた基板搬送方法 |
| JPWO2016038656A1 (ja) * | 2014-09-08 | 2017-06-01 | 株式会社安川電機 | ロボットシステムおよび搬送方法 |
| US10580676B2 (en) | 2014-09-08 | 2020-03-03 | Kabushiki Kaisha Yaskawa Denki | Robot system and carrying method |
| JP2016225625A (ja) * | 2015-05-29 | 2016-12-28 | ピーエスケー インコーポレイテッド | 基板処理装置及び方法 |
| KR20170048200A (ko) | 2015-10-26 | 2017-05-08 | 도쿄엘렉트론가부시키가이샤 | 로드록 장치에 있어서의 기판 냉각 방법, 기판 반송 방법, 및 로드록 장치 |
| US10115611B2 (en) | 2015-10-26 | 2018-10-30 | Tokyo Electron Limited | Substrate cooling method, substrate transfer method, and load-lock mechanism |
| US20200388515A1 (en) * | 2018-03-01 | 2020-12-10 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
| JP2023165990A (ja) * | 2018-12-12 | 2023-11-17 | 東京エレクトロン株式会社 | 基板処理システム、搬送方法、搬送プログラムおよび保持具 |
| JP7520203B2 (ja) | 2018-12-12 | 2024-07-22 | 東京エレクトロン株式会社 | システム |
| TWI885951B (zh) * | 2018-12-12 | 2025-06-01 | 日商東京威力科創股份有限公司 | 基板處理系統 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061031 |
|
| A621 | Written request for application examination |
Effective date: 20061031 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090818 |
|
| A977 | Report on retrieval |
Effective date: 20090820 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A02 | Decision of refusal |
Effective date: 20091215 Free format text: JAPANESE INTERMEDIATE CODE: A02 |