JP2000183541A - 多層プリント基板 - Google Patents

多層プリント基板

Info

Publication number
JP2000183541A
JP2000183541A JP35345498A JP35345498A JP2000183541A JP 2000183541 A JP2000183541 A JP 2000183541A JP 35345498 A JP35345498 A JP 35345498A JP 35345498 A JP35345498 A JP 35345498A JP 2000183541 A JP2000183541 A JP 2000183541A
Authority
JP
Japan
Prior art keywords
power supply
layer
circuit board
printed circuit
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35345498A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000183541A5 (enExample
Inventor
Kinya Takamizawa
欣也 高見沢
Hisanori Tobara
久典 都原
Hiroshi Daishiyouji
寛 大庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Canon Medical Systems Corp
Original Assignee
Toshiba Corp
Toshiba Medical Systems Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Medical Systems Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP35345498A priority Critical patent/JP2000183541A/ja
Publication of JP2000183541A publication Critical patent/JP2000183541A/ja
Publication of JP2000183541A5 publication Critical patent/JP2000183541A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP35345498A 1998-12-11 1998-12-11 多層プリント基板 Pending JP2000183541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35345498A JP2000183541A (ja) 1998-12-11 1998-12-11 多層プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35345498A JP2000183541A (ja) 1998-12-11 1998-12-11 多層プリント基板

Publications (2)

Publication Number Publication Date
JP2000183541A true JP2000183541A (ja) 2000-06-30
JP2000183541A5 JP2000183541A5 (enExample) 2006-02-23

Family

ID=18430967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35345498A Pending JP2000183541A (ja) 1998-12-11 1998-12-11 多層プリント基板

Country Status (1)

Country Link
JP (1) JP2000183541A (enExample)

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223449A (ja) * 2000-02-09 2001-08-17 Toshiba Corp 多層プリント基板
JP2002344149A (ja) * 2001-05-15 2002-11-29 Oki Electric Ind Co Ltd 配線構造基板
JP2002368358A (ja) * 2001-06-11 2002-12-20 Nippon Soken Inc 電子装置
JP2004303812A (ja) * 2003-03-28 2004-10-28 Toshiba Corp 多層回路基板および同基板の電磁シールド方法
JP2004363392A (ja) * 2003-06-05 2004-12-24 Hitachi Ltd プリント配線基板および無線通信装置
JP2006186286A (ja) * 2004-12-28 2006-07-13 Nec Toppan Circuit Solutions Inc 電子装置及び印刷配線板
JP2007158243A (ja) * 2005-12-08 2007-06-21 Ricoh Co Ltd 多層プリント回路基板
JP2007208013A (ja) * 2006-02-02 2007-08-16 Fujitsu Ltd 高周波回路基板
WO2007105716A1 (ja) * 2006-03-14 2007-09-20 Daikin Industries, Ltd. 基板及び装置
JP2008177363A (ja) * 2007-01-18 2008-07-31 Toshiba Corp 多層プリント配線板
KR100850759B1 (ko) * 2007-06-11 2008-08-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100851075B1 (ko) * 2007-04-30 2008-08-12 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
JP2008205457A (ja) * 2007-02-16 2008-09-04 Samsung Electronics Co Ltd 多層印刷回路基板
JP2009044029A (ja) * 2007-08-10 2009-02-26 Denso Corp 複数マイコン実装回路装置
US7505285B2 (en) 2005-04-18 2009-03-17 Hitachi, Ltd. Main board for backplane buses
KR100913363B1 (ko) 2007-09-18 2009-08-20 삼성전기주식회사 멀티 비아를 포함하는 전자기 밴드갭 구조물 및인쇄회로기판
JP2009239182A (ja) * 2008-03-28 2009-10-15 Nec Infrontia Corp 多層基板
JP2009260124A (ja) * 2008-04-18 2009-11-05 Aica Kogyo Co Ltd プリント基板
US7679006B2 (en) 2005-03-23 2010-03-16 Fujitsu Limited Printed wiring board
KR100956891B1 (ko) 2008-03-19 2010-05-11 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
JP2010135374A (ja) * 2008-12-02 2010-06-17 Sanyo Electric Co Ltd 多層プリント配線基板
KR101009152B1 (ko) 2009-06-23 2011-01-18 삼성전기주식회사 인쇄회로기판
JP2011030122A (ja) * 2009-07-29 2011-02-10 Tamura Seisakusho Co Ltd 可視光通信用ｌｅｄ照明装置
WO2011092903A1 (ja) * 2010-02-01 2011-08-04 オリンパスメディカルシステムズ株式会社 内視鏡用撮像ユニット
JP2011243835A (ja) * 2010-05-20 2011-12-01 Murata Mfg Co Ltd 積層型高周波モジュール
WO2013180091A1 (ja) * 2012-05-31 2013-12-05 株式会社ミクニ エンジンコントロールユニット
US9000306B2 (en) 2010-06-02 2015-04-07 Nec Corporation Interconnect board and electronic apparatus
JP2016026295A (ja) * 2015-09-14 2016-02-12 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
JP2017209121A (ja) * 2016-05-23 2017-11-30 株式会社三共 遊技機
CN114449733A (zh) * 2020-10-30 2022-05-06 爱思开海力士有限公司 用于固态驱动器的印刷电路板结构
JP2024032804A (ja) * 2020-08-31 2024-03-12 キオクシア株式会社 半導体装置
WO2024188218A1 (zh) * 2023-03-13 2024-09-19 中兴通讯股份有限公司 印制电路板、功率模组以及电子设备

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223449A (ja) * 2000-02-09 2001-08-17 Toshiba Corp 多層プリント基板
JP2002344149A (ja) * 2001-05-15 2002-11-29 Oki Electric Ind Co Ltd 配線構造基板
JP2002368358A (ja) * 2001-06-11 2002-12-20 Nippon Soken Inc 電子装置
JP2004303812A (ja) * 2003-03-28 2004-10-28 Toshiba Corp 多層回路基板および同基板の電磁シールド方法
JP2004363392A (ja) * 2003-06-05 2004-12-24 Hitachi Ltd プリント配線基板および無線通信装置
JP2006186286A (ja) * 2004-12-28 2006-07-13 Nec Toppan Circuit Solutions Inc 電子装置及び印刷配線板
US7679006B2 (en) 2005-03-23 2010-03-16 Fujitsu Limited Printed wiring board
US7505285B2 (en) 2005-04-18 2009-03-17 Hitachi, Ltd. Main board for backplane buses
JP2007158243A (ja) * 2005-12-08 2007-06-21 Ricoh Co Ltd 多層プリント回路基板
JP2007208013A (ja) * 2006-02-02 2007-08-16 Fujitsu Ltd 高周波回路基板
WO2007105716A1 (ja) * 2006-03-14 2007-09-20 Daikin Industries, Ltd. 基板及び装置
JP2008177363A (ja) * 2007-01-18 2008-07-31 Toshiba Corp 多層プリント配線板
JP2008205457A (ja) * 2007-02-16 2008-09-04 Samsung Electronics Co Ltd 多層印刷回路基板
KR100851075B1 (ko) * 2007-04-30 2008-08-12 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
KR100850759B1 (ko) * 2007-06-11 2008-08-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2009044029A (ja) * 2007-08-10 2009-02-26 Denso Corp 複数マイコン実装回路装置
KR100913363B1 (ko) 2007-09-18 2009-08-20 삼성전기주식회사 멀티 비아를 포함하는 전자기 밴드갭 구조물 및인쇄회로기판
KR100956891B1 (ko) 2008-03-19 2010-05-11 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
JP2009239182A (ja) * 2008-03-28 2009-10-15 Nec Infrontia Corp 多層基板
JP2009260124A (ja) * 2008-04-18 2009-11-05 Aica Kogyo Co Ltd プリント基板
JP2010135374A (ja) * 2008-12-02 2010-06-17 Sanyo Electric Co Ltd 多層プリント配線基板
KR101009152B1 (ko) 2009-06-23 2011-01-18 삼성전기주식회사 인쇄회로기판
JP2011030122A (ja) * 2009-07-29 2011-02-10 Tamura Seisakusho Co Ltd 可視光通信用ｌｅｄ照明装置
WO2011092903A1 (ja) * 2010-02-01 2011-08-04 オリンパスメディカルシステムズ株式会社 内視鏡用撮像ユニット
JP2011243835A (ja) * 2010-05-20 2011-12-01 Murata Mfg Co Ltd 積層型高周波モジュール
JP5761184B2 (ja) * 2010-06-02 2015-08-12 日本電気株式会社 配線基板及び電子装置
US9000306B2 (en) 2010-06-02 2015-04-07 Nec Corporation Interconnect board and electronic apparatus
WO2013180091A1 (ja) * 2012-05-31 2013-12-05 株式会社ミクニ エンジンコントロールユニット
US9549483B2 (en) 2012-05-31 2017-01-17 Mikuni Corporation Engine control unit
JP2016026295A (ja) * 2015-09-14 2016-02-12 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
JP2017209121A (ja) * 2016-05-23 2017-11-30 株式会社三共 遊技機
JP2024032804A (ja) * 2020-08-31 2024-03-12 キオクシア株式会社 半導体装置
JP7583200B2 (ja) 2020-08-31 2024-11-13 キオクシア株式会社 半導体装置
CN114449733A (zh) * 2020-10-30 2022-05-06 爱思开海力士有限公司 用于固态驱动器的印刷电路板结构
WO2024188218A1 (zh) * 2023-03-13 2024-09-19 中兴通讯股份有限公司 印制电路板、功率模组以及电子设备

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