JP2000174166A - 半導体搭載パッケ―ジ - Google Patents

半導体搭載パッケ―ジ

Info

Publication number
JP2000174166A
JP2000174166A JP11248983A JP24898399A JP2000174166A JP 2000174166 A JP2000174166 A JP 2000174166A JP 11248983 A JP11248983 A JP 11248983A JP 24898399 A JP24898399 A JP 24898399A JP 2000174166 A JP2000174166 A JP 2000174166A
Authority
JP
Japan
Prior art keywords
metal member
diamond
substrate
conductive metal
high thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11248983A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000174166A5 (enExample
Inventor
Yoshiyuki Yamamoto
喜之 山本
Takahiro Imai
貴浩 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP11248983A priority Critical patent/JP2000174166A/ja
Priority to CA002284396A priority patent/CA2284396A1/en
Priority to US09/408,875 priority patent/US6316826B1/en
Priority to KR1019990042170A priority patent/KR20000028759A/ko
Priority to EP99307599A priority patent/EP0991121A3/en
Publication of JP2000174166A publication Critical patent/JP2000174166A/ja
Publication of JP2000174166A5 publication Critical patent/JP2000174166A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP11248983A 1998-10-02 1999-09-02 半導体搭載パッケ―ジ Pending JP2000174166A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11248983A JP2000174166A (ja) 1998-10-02 1999-09-02 半導体搭載パッケ―ジ
CA002284396A CA2284396A1 (en) 1998-10-02 1999-09-29 Semiconductor mounting package
US09/408,875 US6316826B1 (en) 1998-10-02 1999-09-29 Semiconductor mounting package
KR1019990042170A KR20000028759A (ko) 1998-10-02 1999-10-01 반도체 탑재 패키지
EP99307599A EP0991121A3 (en) 1998-10-02 1999-10-01 Semiconductor mounting package for heat dissipation

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP28166298 1998-10-02
JP10-281662 1998-10-02
JP11248983A JP2000174166A (ja) 1998-10-02 1999-09-02 半導体搭載パッケ―ジ

Publications (2)

Publication Number Publication Date
JP2000174166A true JP2000174166A (ja) 2000-06-23
JP2000174166A5 JP2000174166A5 (enExample) 2006-09-07

Family

ID=26539043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11248983A Pending JP2000174166A (ja) 1998-10-02 1999-09-02 半導体搭載パッケ―ジ

Country Status (5)

Country Link
US (1) US6316826B1 (enExample)
EP (1) EP0991121A3 (enExample)
JP (1) JP2000174166A (enExample)
KR (1) KR20000028759A (enExample)
CA (1) CA2284396A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191092A (ja) * 2003-12-24 2005-07-14 Ngk Spark Plug Co Ltd セラミックパッケージ
JP2007180441A (ja) * 2005-12-28 2007-07-12 Kinik Co 高導熱放率電路板
DE10393851B4 (de) * 2002-12-09 2007-11-29 Kabushiki Kaisha Toyota Chuo Kenkyusho Halbleiterelement-Wärmeableitungselement sowie Halbleitervorrichtung, in der dieses eingesetzt wird und Verfahren zu dessen Herstellung
JP2012238861A (ja) * 2004-01-22 2012-12-06 Cree Inc ダイアモンド基板上炭化珪素並びに関連するデバイス及び方法
JP2019519111A (ja) * 2016-06-09 2019-07-04 エレメント シックス テクノロジーズ リミテッド 合成ダイヤモンドヒートスプレッダ
JP2022097276A (ja) * 2020-12-18 2022-06-30 セイコーエプソン株式会社 熱伝導構造体および熱伝導構造体の製造方法

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031082A1 (en) * 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components
US7125786B2 (en) * 2000-04-11 2006-10-24 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
US6475889B1 (en) * 2000-04-11 2002-11-05 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
US7892974B2 (en) * 2000-04-11 2011-02-22 Cree, Inc. Method of forming vias in silicon carbide and resulting devices and circuits
US6942025B2 (en) 2000-09-20 2005-09-13 Degree Controls, Inc. Uniform heat dissipating and cooling heat sink
US6653730B2 (en) * 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface
US7276222B2 (en) * 2001-01-19 2007-10-02 Chevron U.S.A. Inc. Diamondoid-containing thermally conductive materials
US6783589B2 (en) * 2001-01-19 2004-08-31 Chevron U.S.A. Inc. Diamondoid-containing materials in microelectronics
US7306674B2 (en) * 2001-01-19 2007-12-11 Chevron U.S.A. Inc. Nucleation of diamond films using higher diamondoids
JP2003051609A (ja) * 2001-08-03 2003-02-21 Tokyo Gas Co Ltd ダイヤモンド高輝度紫外線発光素子
US20030152773A1 (en) * 2002-02-14 2003-08-14 Chrysler Gregory M. Diamond integrated heat spreader and method of manufacturing same
US6699571B1 (en) * 2002-03-27 2004-03-02 Morgan Advanced Ceramics, Inc. Devices and methods for mounting components of electronic circuitry
US20030183368A1 (en) * 2002-04-02 2003-10-02 Paradis Leo Richard Diamond heat sink
JP4014528B2 (ja) * 2003-03-28 2007-11-28 日本碍子株式会社 ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール
US6924170B2 (en) * 2003-06-30 2005-08-02 Intel Corporation Diamond-silicon hybrid integrated heat spreader
US7312562B2 (en) 2004-02-04 2007-12-25 Chevron U.S.A. Inc. Heterodiamondoid-containing field emission devices
US7612390B2 (en) 2004-02-05 2009-11-03 Cree, Inc. Heterojunction transistors including energy barriers
US7294324B2 (en) * 2004-09-21 2007-11-13 Cree, Inc. Low basal plane dislocation bulk grown SiC wafers
US7422634B2 (en) * 2005-04-07 2008-09-09 Cree, Inc. Three inch silicon carbide wafer with low warp, bow, and TTV
JP4378334B2 (ja) * 2005-09-09 2009-12-02 日本碍子株式会社 ヒートスプレッダモジュール及びその製造方法
CN100468797C (zh) * 2005-12-29 2009-03-11 联胜光电股份有限公司 集成散热片的半导体器件及其制造方法
US7592211B2 (en) 2006-01-17 2009-09-22 Cree, Inc. Methods of fabricating transistors including supported gate electrodes
US7709269B2 (en) 2006-01-17 2010-05-04 Cree, Inc. Methods of fabricating transistors including dielectrically-supported gate electrodes
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
US8907473B2 (en) * 2009-02-02 2014-12-09 Estivation Properties Llc Semiconductor device having a diamond substrate heat spreader
CN102518956B (zh) * 2009-05-21 2015-08-19 长春藤控股有限公司 发光源封装体
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
EP2889903A1 (en) * 2013-12-24 2015-07-01 Nxp B.V. Die with a multilayer backside interface layer for solder bonding to a substrate and corresponding manufacturing method
JP7014012B2 (ja) * 2018-03-30 2022-02-01 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
US10700036B2 (en) 2018-10-19 2020-06-30 Toyota Motor Engineering & Manufacturing North America, Inc. Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
CN117712057B (zh) * 2024-02-06 2024-05-10 成都汉芯国科集成技术有限公司 一种多级金刚石抗辐射过载的芯片封装结构及封装方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3974518A (en) * 1975-02-21 1976-08-10 Bell Telephone Laboratories, Incorporated Encapsulation for high frequency semiconductor device
JPH0754834B2 (ja) * 1986-03-26 1995-06-07 新技術事業団 ダイヤモンド膜製半導体基板の製造方法
JPS63299238A (ja) * 1987-05-29 1988-12-06 Mitsubishi Metal Corp 半導体装置のダイボンディング用基板
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
US5137398A (en) * 1990-04-27 1992-08-11 Sumitomo Electric Industries, Ltd. Drill bit having a diamond-coated sintered body
DE69231790T2 (de) * 1991-07-01 2002-03-07 Sumitomo Electric Industries, Ltd. Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung
EP0552475B1 (de) * 1992-01-23 1997-09-10 Siemens Aktiengesellschaft Halbleitermodul mit hoher Isolations- und Wärmefähigkeit
US5493153A (en) * 1992-11-26 1996-02-20 Tokyo Tungsten Co., Ltd. Plastic-packaged semiconductor device having a heat sink matched with a plastic package
US5328715A (en) * 1993-02-11 1994-07-12 General Electric Company Process for making metallized vias in diamond substrates
US5629559A (en) * 1993-04-06 1997-05-13 Tokuyama Corporation Package for semiconductor device
JP3387221B2 (ja) 1993-06-25 2003-03-17 住友電気工業株式会社 半導体用高熱伝導性セラミックスパッケージ
US5679895A (en) * 1995-05-01 1997-10-21 Kobe Steel Usa, Inc. Diamond field emission acceleration sensor
US5834840A (en) * 1995-05-25 1998-11-10 Massachusetts Institute Of Technology Net-shape ceramic processing for electronic devices and packages
WO1997005757A1 (en) * 1995-07-31 1997-02-13 Crystalline Materials Corporation Diamond electronic packages featuring bonded metal
US6071627A (en) * 1996-03-29 2000-06-06 Kabushiki Kaisha Toshiba Heat-resistant member and a method for evaluating quality of a heat-resistant member
JP4080030B2 (ja) * 1996-06-14 2008-04-23 住友電気工業株式会社 半導体基板材料、半導体基板、半導体装置、及びその製造方法
US6211463B1 (en) * 1998-01-26 2001-04-03 Saint-Gobain Industrial Ceramics, Inc. Electronic circuit package with diamond film heat conductor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10393851B4 (de) * 2002-12-09 2007-11-29 Kabushiki Kaisha Toyota Chuo Kenkyusho Halbleiterelement-Wärmeableitungselement sowie Halbleitervorrichtung, in der dieses eingesetzt wird und Verfahren zu dessen Herstellung
US7396735B2 (en) 2002-12-09 2008-07-08 Kabushiki Kaisha Toyota Chuo Kenkyusyo Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same
JP2005191092A (ja) * 2003-12-24 2005-07-14 Ngk Spark Plug Co Ltd セラミックパッケージ
JP2012238861A (ja) * 2004-01-22 2012-12-06 Cree Inc ダイアモンド基板上炭化珪素並びに関連するデバイス及び方法
JP2007180441A (ja) * 2005-12-28 2007-07-12 Kinik Co 高導熱放率電路板
JP2019519111A (ja) * 2016-06-09 2019-07-04 エレメント シックス テクノロジーズ リミテッド 合成ダイヤモンドヒートスプレッダ
JP2021119602A (ja) * 2016-06-09 2021-08-12 エレメント シックス テクノロジーズ リミテッド 合成ダイヤモンドヒートスプレッダ
JP2022097276A (ja) * 2020-12-18 2022-06-30 セイコーエプソン株式会社 熱伝導構造体および熱伝導構造体の製造方法
JP7494726B2 (ja) 2020-12-18 2024-06-04 セイコーエプソン株式会社 熱伝導構造体および熱伝導構造体の製造方法

Also Published As

Publication number Publication date
CA2284396A1 (en) 2000-04-02
EP0991121A3 (en) 2005-11-16
US6316826B1 (en) 2001-11-13
EP0991121A2 (en) 2000-04-05
KR20000028759A (ko) 2000-05-25

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