JP2000158342A - 研磨方法及び研磨装置 - Google Patents

研磨方法及び研磨装置

Info

Publication number
JP2000158342A
JP2000158342A JP10338909A JP33890998A JP2000158342A JP 2000158342 A JP2000158342 A JP 2000158342A JP 10338909 A JP10338909 A JP 10338909A JP 33890998 A JP33890998 A JP 33890998A JP 2000158342 A JP2000158342 A JP 2000158342A
Authority
JP
Japan
Prior art keywords
polishing
slurry
polishing slurry
main body
apparatus main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10338909A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000158342A5 (https=
Inventor
Yoshiyasu Maehane
良保 前羽
Shigeki Kobayashi
茂樹 小林
Yoshitaka Morioka
善隆 森岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP10338909A priority Critical patent/JP2000158342A/ja
Publication of JP2000158342A publication Critical patent/JP2000158342A/ja
Publication of JP2000158342A5 publication Critical patent/JP2000158342A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP10338909A 1998-11-30 1998-11-30 研磨方法及び研磨装置 Pending JP2000158342A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10338909A JP2000158342A (ja) 1998-11-30 1998-11-30 研磨方法及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10338909A JP2000158342A (ja) 1998-11-30 1998-11-30 研磨方法及び研磨装置

Publications (2)

Publication Number Publication Date
JP2000158342A true JP2000158342A (ja) 2000-06-13
JP2000158342A5 JP2000158342A5 (https=) 2005-11-04

Family

ID=18322492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10338909A Pending JP2000158342A (ja) 1998-11-30 1998-11-30 研磨方法及び研磨装置

Country Status (1)

Country Link
JP (1) JP2000158342A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006281375A (ja) * 2005-03-31 2006-10-19 Kawasaki Heavy Ind Ltd ウォータジェット装置および研磨液の噴出方法
WO2007099976A1 (ja) * 2006-02-22 2007-09-07 Ebara Corporation 基板処理装置、基板搬送装置、基板把持装置、および薬液処理装置
CN104044079A (zh) * 2014-06-23 2014-09-17 菲斯达精密工业部件（苏州）有限公司 一种磁力研磨液重复使用装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006281375A (ja) * 2005-03-31 2006-10-19 Kawasaki Heavy Ind Ltd ウォータジェット装置および研磨液の噴出方法
WO2007099976A1 (ja) * 2006-02-22 2007-09-07 Ebara Corporation 基板処理装置、基板搬送装置、基板把持装置、および薬液処理装置
JP5188952B2 (ja) * 2006-02-22 2013-04-24 株式会社荏原製作所 基板処理装置
CN104044079A (zh) * 2014-06-23 2014-09-17 菲斯达精密工业部件（苏州）有限公司 一种磁力研磨液重复使用装置

Similar Documents

Publication Publication Date Title
JP3701126B2 (ja) 基板の洗浄方法及び研磨装置
US5664990A (en) Slurry recycling in CMP apparatus
US6866784B2 (en) Slurry recycling system and method for CMP apparatus
US6306025B1 (en) Dressing tool for the surface of an abrasive cloth and its production process
JP3708748B2 (ja) 研磨剤の再生装置および研磨剤の再生方法
JP5163078B2 (ja) 研磨装置とその方法
JPH1110540A (ja) Ｃｍｐ装置のスラリリサイクルシステム及びその方法
JP4657412B2 (ja) 半導体ウェハを研磨する装置及び方法
CN1621355A (zh) 水处理装置以及使用该装置的水处理方法
JP2000158342A (ja) 研磨方法及び研磨装置
JP2004306210A (ja) ガラス研磨における排出水中の酸化セリウム系研磨剤と水を再利用するための処理方法とその処理装置
US20030003851A1 (en) Method and apparatus for recycling slurry
JP2000117635A (ja) 研磨方法及び研磨システム
CN212039386U (zh) 一种半导体制造研磨废水回收装置
JP3533046B2 (ja) 半導体基板用研磨布のドレッサー
JP3778386B2 (ja) Ｍｎ酸化物を砥粒とする研磨剤の製造方法および半導体装置の製造方法
TWI298314B (en) System and process for wastewater treatment
JP3464929B2 (ja) スラリー供給システム及びこれを備えた研磨システム
CN102580953A (zh) 清洗研磨液供给系统的方法
JP5248209B2 (ja) 薬液回収装置及び薬液回収方法
JP3672398B2 (ja) 研磨装置および研磨方法
JPH1133362A (ja) 研磨剤の回収方法及び研磨剤の回収装置
JP2000117636A (ja) 研磨方法及び研磨システム
CN222627332U (zh) 一种新型晶片有蜡抛光卸片用装置
JP2000237959A (ja) スラリー循環供給システム及びこれを備えた研磨システム

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050815

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050815

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071217

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081128

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090324