JP2000150906A5 - - Google Patents
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- Publication number
- JP2000150906A5 JP2000150906A5 JP1999240758A JP24075899A JP2000150906A5 JP 2000150906 A5 JP2000150906 A5 JP 2000150906A5 JP 1999240758 A JP1999240758 A JP 1999240758A JP 24075899 A JP24075899 A JP 24075899A JP 2000150906 A5 JP2000150906 A5 JP 2000150906A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor
- insulating
- forming
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 description 116
- 239000004065 semiconductor Substances 0.000 description 50
- 230000001681 protective effect Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 phosphorus ions Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24075899A JP4472064B2 (ja) | 1998-08-31 | 1999-08-27 | 半導体装置の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24543398 | 1998-08-31 | ||
| JP10-245433 | 1998-08-31 | ||
| JP24075899A JP4472064B2 (ja) | 1998-08-31 | 1999-08-27 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000150906A JP2000150906A (ja) | 2000-05-30 |
| JP2000150906A5 true JP2000150906A5 (enExample) | 2006-10-05 |
| JP4472064B2 JP4472064B2 (ja) | 2010-06-02 |
Family
ID=26534902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24075899A Expired - Fee Related JP4472064B2 (ja) | 1998-08-31 | 1999-08-27 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4472064B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8013346B2 (en) | 2000-12-21 | 2011-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW504846B (en) * | 2000-06-28 | 2002-10-01 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| JP4067819B2 (ja) * | 2000-12-21 | 2008-03-26 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP4741569B2 (ja) * | 2000-12-21 | 2011-08-03 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP4766758B2 (ja) * | 2001-02-28 | 2011-09-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2002289347A (ja) * | 2001-03-27 | 2002-10-04 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置、その製造方法、被着マスク及びその製造方法 |
| JP4731718B2 (ja) * | 2001-04-27 | 2011-07-27 | 株式会社半導体エネルギー研究所 | 表示装置 |
| KR20020091705A (ko) * | 2001-05-31 | 2002-12-06 | 주식회사 현대 디스플레이 테크놀로지 | 박막 트랜지스터 액정표시소자의 제조방법 |
| KR100720099B1 (ko) | 2001-06-21 | 2007-05-18 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그의 제조 방법 |
| JP2003068757A (ja) * | 2001-08-30 | 2003-03-07 | Sony Corp | アクティブマトリクス基板及びその製造方法 |
| US7223641B2 (en) | 2004-03-26 | 2007-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing the same, liquid crystal television and EL television |
| US7491590B2 (en) | 2004-05-28 | 2009-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film transistor in display device |
| JP2006215086A (ja) * | 2005-02-01 | 2006-08-17 | Sharp Corp | アクティブマトリクス基板およびそれを備えた表示装置 |
| KR100712295B1 (ko) * | 2005-06-22 | 2007-04-27 | 삼성에스디아이 주식회사 | 유기 전계 발광 소자 및 그 제조 방법 |
| JP4964442B2 (ja) * | 2005-08-10 | 2012-06-27 | 三菱電機株式会社 | 薄膜トランジスタおよびその製造方法 |
| TWI411095B (zh) | 2005-09-29 | 2013-10-01 | Semiconductor Energy Lab | 記憶裝置 |
| TWI521712B (zh) * | 2007-12-03 | 2016-02-11 | 半導體能源研究所股份有限公司 | 薄膜電晶體,包括該薄膜電晶體的顯示裝置,和其製造方法 |
| JP4659925B2 (ja) * | 2008-08-04 | 2011-03-30 | パナソニック株式会社 | フレキシブル半導体装置およびその製造方法 |
| WO2011027723A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2011176153A (ja) * | 2010-02-25 | 2011-09-08 | Dainippon Printing Co Ltd | 薄膜トランジスタ基板 |
| US9123691B2 (en) | 2012-01-19 | 2015-09-01 | E Ink Holdings Inc. | Thin-film transistor and method for manufacturing the same |
| TWI467774B (zh) * | 2012-01-19 | 2015-01-01 | E Ink Holdings Inc | 薄膜電晶體結構及其製造方法 |
| JP2013250319A (ja) * | 2012-05-30 | 2013-12-12 | Sharp Corp | アクティブマトリクス基板、製造方法、及び表示装置 |
| JP2017136724A (ja) * | 2016-02-02 | 2017-08-10 | 東芝テック株式会社 | インクジェットヘッド |
| KR102675575B1 (ko) * | 2016-12-12 | 2024-06-18 | 삼성디스플레이 주식회사 | 표시 장치 |
| JP6853770B2 (ja) * | 2017-11-30 | 2021-03-31 | 株式会社Joled | 半導体装置および表示装置 |
-
1999
- 1999-08-27 JP JP24075899A patent/JP4472064B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8013346B2 (en) | 2000-12-21 | 2011-09-06 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
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