JP2000150422A5 - - Google Patents

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Publication number
JP2000150422A5
JP2000150422A5 JP1998318965A JP31896598A JP2000150422A5 JP 2000150422 A5 JP2000150422 A5 JP 2000150422A5 JP 1998318965 A JP1998318965 A JP 1998318965A JP 31896598 A JP31896598 A JP 31896598A JP 2000150422 A5 JP2000150422 A5 JP 2000150422A5
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JP
Japan
Prior art keywords
electrode
bonded
protrusion
base electrode
base
Prior art date
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Application number
JP1998318965A
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English (en)
Japanese (ja)
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JP2000150422A (ja
JP3931454B2 (ja
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Priority to JP31896598A priority Critical patent/JP3931454B2/ja
Priority claimed from JP31896598A external-priority patent/JP3931454B2/ja
Publication of JP2000150422A publication Critical patent/JP2000150422A/ja
Publication of JP2000150422A5 publication Critical patent/JP2000150422A5/ja
Application granted granted Critical
Publication of JP3931454B2 publication Critical patent/JP3931454B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP31896598A 1998-11-10 1998-11-10 半導体装置の電極の製造方法 Expired - Fee Related JP3931454B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31896598A JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31896598A JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

Publications (3)

Publication Number Publication Date
JP2000150422A JP2000150422A (ja) 2000-05-30
JP2000150422A5 true JP2000150422A5 (cg-RX-API-DMAC10.html) 2005-10-27
JP3931454B2 JP3931454B2 (ja) 2007-06-13

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ID=18104982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31896598A Expired - Fee Related JP3931454B2 (ja) 1998-11-10 1998-11-10 半導体装置の電極の製造方法

Country Status (1)

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JP (1) JP3931454B2 (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483490B2 (ja) 1999-02-16 2004-01-06 シャープ株式会社 半導体装置の製造方法
JP4549636B2 (ja) * 2003-04-22 2010-09-22 株式会社荏原製作所 基板処理装置
JP4998763B2 (ja) * 2005-03-31 2012-08-15 地方独立行政法人青森県産業技術センター 配線付基板およびその製造方法並びに表示装置
JP4775369B2 (ja) * 2007-12-17 2011-09-21 富士電機株式会社 半導体チップ、半導体装置および製造方法
JP2011026680A (ja) * 2009-07-28 2011-02-10 Renesas Electronics Corp 半導体装置の製造方法及び半導体装置の製造装置
JP5528938B2 (ja) * 2010-07-29 2014-06-25 シャープ株式会社 無電解メッキ処理装置および無電解メッキ処理方法

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