JP2000106340A5 - - Google Patents

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Publication number
JP2000106340A5
JP2000106340A5 JP1998290053A JP29005398A JP2000106340A5 JP 2000106340 A5 JP2000106340 A5 JP 2000106340A5 JP 1998290053 A JP1998290053 A JP 1998290053A JP 29005398 A JP29005398 A JP 29005398A JP 2000106340 A5 JP2000106340 A5 JP 2000106340A5
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JP
Japan
Prior art keywords
substrate
mask
compartment region
scanning exposure
compartment
Prior art date
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Application number
JP1998290053A
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English (en)
Japanese (ja)
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JP2000106340A (ja
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Priority to JP10290053A priority Critical patent/JP2000106340A/ja
Priority claimed from JP10290053A external-priority patent/JP2000106340A/ja
Publication of JP2000106340A publication Critical patent/JP2000106340A/ja
Publication of JP2000106340A5 publication Critical patent/JP2000106340A5/ja
Withdrawn legal-status Critical Current

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JP10290053A 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置 Withdrawn JP2000106340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10290053A JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP27950097 1997-09-26
JP9-279500 1997-09-26
JP22650098 1998-07-27
JP10-226500 1998-07-27
JP10290053A JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Publications (2)

Publication Number Publication Date
JP2000106340A JP2000106340A (ja) 2000-04-11
JP2000106340A5 true JP2000106340A5 (enExample) 2005-11-10

Family

ID=27331177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10290053A Withdrawn JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Country Status (1)

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JP (1) JP2000106340A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927505B2 (en) 2001-12-19 2005-08-09 Nikon Corporation Following stage planar motor
JP3679776B2 (ja) * 2002-04-22 2005-08-03 キヤノン株式会社 駆動装置、露光装置及びデバイス製造方法
EP3226073A3 (en) 2003-04-09 2017-10-11 Nikon Corporation Exposure method and apparatus, and method for fabricating device
SG10201603067VA (en) 2003-04-11 2016-05-30 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
TWI433212B (zh) 2003-06-19 2014-04-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
TWI511179B (zh) 2003-10-28 2015-12-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
KR100585108B1 (ko) * 2003-11-14 2006-06-01 삼성전자주식회사 스캔 방식의 노광 장치를 이용한 웨이퍼 노광 방법
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
US7016019B2 (en) 2003-12-16 2006-03-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI511182B (zh) 2004-02-06 2015-12-01 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
KR101762083B1 (ko) 2005-05-12 2017-07-26 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
SG10201407218XA (en) * 2006-09-01 2015-01-29 Nippon Kogaku Kk Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP6066610B2 (ja) * 2012-07-31 2017-01-25 キヤノン株式会社 露光方法、露光装置及びデバイス製造方法
JP6501530B2 (ja) * 2015-01-21 2019-04-17 株式会社ディスコ レーザー加工装置
WO2019044489A1 (ja) * 2017-08-28 2019-03-07 キヤノン株式会社 駆動装置および撮像装置の制御方法
JP7467821B2 (ja) * 2020-02-06 2024-04-16 株式会社東京精密 レーザ加工装置及び加工方法
CN118871245A (zh) * 2022-04-18 2024-10-29 雅马哈发动机株式会社 激光加工装置、激光加工方法、激光加工程序、记录介质、半导体芯片制造方法和半导体芯片
WO2023203612A1 (ja) * 2022-04-18 2023-10-26 ヤマハ発動機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ
DE112022006864T5 (de) * 2022-04-18 2025-02-20 Yamaha Hatsudoki Kabushiki Kaisha Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren, Laserbearbeitungsprogramm, Aufzeichnungsmedium, Halbleiterchip-Herstellungsverfahren und Halbleiterchip
DE112022006866T5 (de) * 2022-04-18 2025-02-20 Yamaha Hatsudoki Kabushiki Kaisha Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren, Laserbearbeitungsprogramm, Aufzeichnungsmedium, Halbleiterchip-Herstellungsverfahren und Halbleiterchip

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