JP2000106340A5 - - Google Patents

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Publication number
JP2000106340A5
JP2000106340A5 JP1998290053A JP29005398A JP2000106340A5 JP 2000106340 A5 JP2000106340 A5 JP 2000106340A5 JP 1998290053 A JP1998290053 A JP 1998290053A JP 29005398 A JP29005398 A JP 29005398A JP 2000106340 A5 JP2000106340 A5 JP 2000106340A5
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JP
Japan
Prior art keywords
substrate
mask
compartment region
scanning exposure
compartment
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Application number
JP1998290053A
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English (en)
Japanese (ja)
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JP2000106340A (ja
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Priority to JP10290053A priority Critical patent/JP2000106340A/ja
Priority claimed from JP10290053A external-priority patent/JP2000106340A/ja
Publication of JP2000106340A publication Critical patent/JP2000106340A/ja
Publication of JP2000106340A5 publication Critical patent/JP2000106340A5/ja
Withdrawn legal-status Critical Current

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JP10290053A 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置 Withdrawn JP2000106340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10290053A JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP9-279500 1997-09-26
JP27950097 1997-09-26
JP10-226500 1998-07-27
JP22650098 1998-07-27
JP10290053A JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Publications (2)

Publication Number Publication Date
JP2000106340A JP2000106340A (ja) 2000-04-11
JP2000106340A5 true JP2000106340A5 (enExample) 2005-11-10

Family

ID=27331177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10290053A Withdrawn JP2000106340A (ja) 1997-09-26 1998-09-28 露光装置及び走査露光方法、並びにステージ装置

Country Status (1)

Country Link
JP (1) JP2000106340A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927505B2 (en) 2001-12-19 2005-08-09 Nikon Corporation Following stage planar motor
JP3679776B2 (ja) * 2002-04-22 2005-08-03 キヤノン株式会社 駆動装置、露光装置及びデバイス製造方法
KR20170018113A (ko) 2003-04-09 2017-02-15 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
JP4315198B2 (ja) 2003-04-11 2009-08-19 株式会社ニコン 液浸液体を光学アセンブリ下に維持するリソグラフィ装置及び液浸液体維持方法並びにそれらを用いるデバイス製造方法
DE602004024782D1 (de) * 2003-06-19 2010-02-04 Nippon Kogaku Kk Belichtungseinrichtung und bauelementeherstellungsverfahren
TWI569308B (zh) 2003-10-28 2017-02-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法
KR100585108B1 (ko) * 2003-11-14 2006-06-01 삼성전자주식회사 스캔 방식의 노광 장치를 이용한 웨이퍼 노광 방법
TWI512335B (zh) 2003-11-20 2015-12-11 尼康股份有限公司 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法
US7016019B2 (en) 2003-12-16 2006-03-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
KR101544336B1 (ko) 2005-05-12 2015-08-12 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
SG174740A1 (en) * 2006-09-01 2011-10-28 Nikon Corp Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP6066610B2 (ja) * 2012-07-31 2017-01-25 キヤノン株式会社 露光方法、露光装置及びデバイス製造方法
JP6501530B2 (ja) * 2015-01-21 2019-04-17 株式会社ディスコ レーザー加工装置
WO2019044489A1 (ja) 2017-08-28 2019-03-07 キヤノン株式会社 駆動装置および撮像装置の制御方法
JP7467821B2 (ja) * 2020-02-06 2024-04-16 株式会社東京精密 レーザ加工装置及び加工方法
WO2023203614A1 (ja) * 2022-04-18 2023-10-26 ヤマハ発動機株式会社 レーザ加工装置、レーザ加工方法、レーザ加工プログラム、記録媒体、半導体チップ製造方法および半導体チップ
US20250285888A1 (en) * 2022-04-18 2025-09-11 Yamaha Hatsudoki Kabushiki Kaisha Laser processing apparatus, laser processing method, laser processing program, recording medium, semiconductor chip manufacturing method and semiconductor chip
KR20240148877A (ko) * 2022-04-18 2024-10-11 야마하하쓰도키 가부시키가이샤 레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩
KR102948780B1 (ko) * 2022-04-18 2026-04-06 야마하하쓰도키 가부시키가이샤 레이저 가공 장치, 레이저 가공 방법, 레이저 가공 프로그램, 기록 매체, 반도체 칩 제조 방법, 및 반도체 칩

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