JP2000022369A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000022369A5 JP2000022369A5 JP1998187641A JP18764198A JP2000022369A5 JP 2000022369 A5 JP2000022369 A5 JP 2000022369A5 JP 1998187641 A JP1998187641 A JP 1998187641A JP 18764198 A JP18764198 A JP 18764198A JP 2000022369 A5 JP2000022369 A5 JP 2000022369A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- heat pipe
- heat radiating
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 description 25
- 239000012530 fluid Substances 0.000 description 21
- 230000017525 heat dissipation Effects 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 230000005855 radiation Effects 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187641A JP2000022369A (ja) | 1998-07-02 | 1998-07-02 | 電子機器用放熱装置 |
| CA002276795A CA2276795A1 (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| KR1019990025574A KR20000011358A (ko) | 1998-07-01 | 1999-06-30 | 전자기기용방열장치 |
| US09/343,459 US6115252A (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| AU36896/99A AU753320B2 (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| EP99112514A EP0969354A3 (en) | 1998-07-01 | 1999-07-01 | Heat sink device for electronic devices |
| CNB991089502A CN1170466C (zh) | 1998-07-01 | 1999-07-01 | 电子器件的散热装置 |
| TW088111168A TW479449B (en) | 1998-07-01 | 1999-07-01 | Heat sink device for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187641A JP2000022369A (ja) | 1998-07-02 | 1998-07-02 | 電子機器用放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000022369A JP2000022369A (ja) | 2000-01-21 |
| JP2000022369A5 true JP2000022369A5 (https=) | 2005-10-06 |
Family
ID=16209681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10187641A Pending JP2000022369A (ja) | 1998-07-01 | 1998-07-02 | 電子機器用放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000022369A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001267771A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Ltd | 電子装置 |
| JP6462771B2 (ja) | 2017-06-01 | 2019-01-30 | 古河電気工業株式会社 | 平面型ヒートパイプ |
-
1998
- 1998-07-02 JP JP10187641A patent/JP2000022369A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6115252A (en) | Heat sink device for electronic devices | |
| US11968806B2 (en) | Electronic apparatus and cooling module | |
| JP6456891B2 (ja) | 電子機器 | |
| JP4719079B2 (ja) | 電子機器 | |
| JP3634825B2 (ja) | 電子機器 | |
| JP2009128947A (ja) | 電子機器 | |
| JP2002100713A (ja) | 冷却装置、この冷却装置を有する回路モジュールおよび電子機器 | |
| JP7275243B1 (ja) | 電子機器 | |
| CN101754655B (zh) | 散热模组 | |
| JPH04354010A (ja) | 電子機器装置 | |
| US20080198547A1 (en) | Electronic device and heat conduction member | |
| JP7254891B1 (ja) | 冷却モジュール及び電子機器 | |
| JP2009169752A (ja) | 電子機器 | |
| JPWO2011087117A1 (ja) | ヒートシンク | |
| JP2002344186A (ja) | 電子機器 | |
| JP4558627B2 (ja) | 電子機器の筐体および電子機器 | |
| JP2000022369A5 (https=) | ||
| JP2007123641A5 (https=) | ||
| JP2000022369A (ja) | 電子機器用放熱装置 | |
| JP2000022368A5 (https=) | ||
| JP2000022367A5 (https=) | ||
| JP7681777B1 (ja) | 冷却モジュール及び電子機器 | |
| JP2000022368A (ja) | 電子機器用放熱装置 | |
| JPH10261746A (ja) | 発熱素子の冷却構造 | |
| JP2000022367A (ja) | 電子機器用放熱装置 |