JP2000022367A5 - - Google Patents
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- Publication number
- JP2000022367A5 JP2000022367A5 JP1998187631A JP18763198A JP2000022367A5 JP 2000022367 A5 JP2000022367 A5 JP 2000022367A5 JP 1998187631 A JP1998187631 A JP 1998187631A JP 18763198 A JP18763198 A JP 18763198A JP 2000022367 A5 JP2000022367 A5 JP 2000022367A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- hydraulic fluid
- heat radiating
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 47
- 239000000758 substrate Substances 0.000 description 43
- 239000012530 fluid Substances 0.000 description 42
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 28
- 230000017525 heat dissipation Effects 0.000 description 26
- 230000005855 radiation Effects 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187631A JP2000022367A (ja) | 1998-07-02 | 1998-07-02 | 電子機器用放熱装置 |
| CA002276795A CA2276795A1 (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| KR1019990025574A KR20000011358A (ko) | 1998-07-01 | 1999-06-30 | 전자기기용방열장치 |
| US09/343,459 US6115252A (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| AU36896/99A AU753320B2 (en) | 1998-07-01 | 1999-06-30 | Heat sink device for electronic devices |
| EP99112514A EP0969354A3 (en) | 1998-07-01 | 1999-07-01 | Heat sink device for electronic devices |
| CNB991089502A CN1170466C (zh) | 1998-07-01 | 1999-07-01 | 电子器件的散热装置 |
| TW088111168A TW479449B (en) | 1998-07-01 | 1999-07-01 | Heat sink device for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187631A JP2000022367A (ja) | 1998-07-02 | 1998-07-02 | 電子機器用放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000022367A JP2000022367A (ja) | 2000-01-21 |
| JP2000022367A5 true JP2000022367A5 (https=) | 2005-10-06 |
Family
ID=16209501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10187631A Pending JP2000022367A (ja) | 1998-07-01 | 1998-07-02 | 電子機器用放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000022367A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115665970B (zh) * | 2022-10-08 | 2023-11-21 | 江苏东海半导体股份有限公司 | 一种igbt驱动保护电路板 |
-
1998
- 1998-07-02 JP JP10187631A patent/JP2000022367A/ja active Pending
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