JP4558627B2 - 電子機器の筐体および電子機器 - Google Patents
電子機器の筐体および電子機器 Download PDFInfo
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- JP4558627B2 JP4558627B2 JP2005315502A JP2005315502A JP4558627B2 JP 4558627 B2 JP4558627 B2 JP 4558627B2 JP 2005315502 A JP2005315502 A JP 2005315502A JP 2005315502 A JP2005315502 A JP 2005315502A JP 4558627 B2 JP4558627 B2 JP 4558627B2
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- heat
- electronic device
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- 230000017525 heat dissipation Effects 0.000 description 20
- 230000000694 effects Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 230000005855 radiation Effects 0.000 description 8
- 206010037660 Pyrexia Diseases 0.000 description 7
- 230000015654 memory Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000191 radiation effect Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
まず、本実施形態に対する比較例としてのヒートシンク部24aを有する筐体20aを備えた電子機器の放熱作用について説明する。
20 筐体
21 排気口
22 吸入口
24 ヒートシンク部(放熱部)
31 CPU(発熱部品)
32 電源ユニット
34 吸入用ファン(ファン)
41 カバー部材
241 流入口(開口部)
242 接触面
244 導風面(接触面の裏側の面)
245 フィン
246 フード本体部(放熱部)
Claims (5)
- 電子機器の側壁として構成される筐体であって、
上記電子機器の内部の空気を排気するための排気口と、
上記排気口の下方に位置し、上記電子機器の内部に空気を取り込むための吸入口と、
上記電子機器が備える発熱部品と接触し、当該発熱部品から伝えられた熱を空気中に放熱する放熱部とを備え、
上記放熱部において、発熱部品と接触する接触面の裏側の面は、上記排気口の一部と接続するように曲がっており、電子機器に組み込まれたときに、上記吸入口から電子機器内に取り込まれ、上昇する空気の進行方向を、上記排気口に向かう方向に変更することを特徴とする電子機器の筐体。 - 上記接触面の裏側の面は、上記放熱部において空気が流入する流入口から上記排気口に向かうにつれて、単調に筐体の底面からの高さが増加するように形成されていることを特徴とする請求項1に記載の電子機器の筐体。
- 上記放熱部は、上記排気口と対向する面において、フィンが形成されていることを特徴とする請求項1または2に記載の電子機器の筐体。
- 上記吸入口には、ファンが備えられていることを特徴とする請求項1〜3のいずれか1項に記載の電子機器の筐体。
- 請求項1〜4のいずれか1項に記載の筐体を備えることを特徴とする電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005315502A JP4558627B2 (ja) | 2005-10-28 | 2005-10-28 | 電子機器の筐体および電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005315502A JP4558627B2 (ja) | 2005-10-28 | 2005-10-28 | 電子機器の筐体および電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007123641A JP2007123641A (ja) | 2007-05-17 |
JP2007123641A5 JP2007123641A5 (ja) | 2008-11-27 |
JP4558627B2 true JP4558627B2 (ja) | 2010-10-06 |
Family
ID=38147136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005315502A Active JP4558627B2 (ja) | 2005-10-28 | 2005-10-28 | 電子機器の筐体および電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4558627B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5469168B2 (ja) * | 2008-07-25 | 2014-04-09 | コーニンクレッカ フィリップス エヌ ヴェ | 半導体ダイを冷却するための冷却装置 |
JP5262473B2 (ja) * | 2008-09-09 | 2013-08-14 | 富士通株式会社 | 電子機器及びそのコンポーネント |
JP2010177309A (ja) | 2009-01-28 | 2010-08-12 | Funai Electric Co Ltd | 電子機器の放熱機構 |
JP2013197405A (ja) | 2012-03-21 | 2013-09-30 | Hitachi Automotive Systems Ltd | 電子制御装置 |
JP6012420B2 (ja) * | 2012-11-14 | 2016-10-25 | 矢崎総業株式会社 | 電気接続箱 |
JP7349837B2 (ja) * | 2019-07-16 | 2023-09-25 | 株式会社デンソーテン | 発熱部品の放熱構造 |
CN113766797A (zh) * | 2020-06-02 | 2021-12-07 | 鸿富锦精密电子(重庆)有限公司 | 背板以及电子装置 |
WO2023203800A1 (ja) * | 2022-11-11 | 2023-10-26 | 任天堂株式会社 | 電子機器及び電子機器の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103845U (ja) * | 1983-12-19 | 1985-07-15 | 三菱電機株式会社 | 半導体の冷却装置 |
JPS6210496U (ja) * | 1985-07-03 | 1987-01-22 | ||
JP2002009473A (ja) * | 2000-06-23 | 2002-01-11 | Showa Denko Kk | 放熱器 |
JP2003174276A (ja) * | 2001-12-07 | 2003-06-20 | Matsushita Electric Ind Co Ltd | 小型の電子機器 |
JP2004111655A (ja) * | 2002-09-18 | 2004-04-08 | Ryoichi Yasumi | 電子部品の冷却装置用ケース、およびこの冷却装置用ケースを用いた冷却装置 |
JP2004119812A (ja) * | 2002-09-27 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 小型端末装置 |
-
2005
- 2005-10-28 JP JP2005315502A patent/JP4558627B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103845U (ja) * | 1983-12-19 | 1985-07-15 | 三菱電機株式会社 | 半導体の冷却装置 |
JPS6210496U (ja) * | 1985-07-03 | 1987-01-22 | ||
JP2002009473A (ja) * | 2000-06-23 | 2002-01-11 | Showa Denko Kk | 放熱器 |
JP2003174276A (ja) * | 2001-12-07 | 2003-06-20 | Matsushita Electric Ind Co Ltd | 小型の電子機器 |
JP2004111655A (ja) * | 2002-09-18 | 2004-04-08 | Ryoichi Yasumi | 電子部品の冷却装置用ケース、およびこの冷却装置用ケースを用いた冷却装置 |
JP2004119812A (ja) * | 2002-09-27 | 2004-04-15 | Matsushita Electric Ind Co Ltd | 小型端末装置 |
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Publication number | Publication date |
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JP2007123641A (ja) | 2007-05-17 |
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