JP2000012865A5 - - Google Patents

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Publication number
JP2000012865A5
JP2000012865A5 JP1998174651A JP17465198A JP2000012865A5 JP 2000012865 A5 JP2000012865 A5 JP 2000012865A5 JP 1998174651 A JP1998174651 A JP 1998174651A JP 17465198 A JP17465198 A JP 17465198A JP 2000012865 A5 JP2000012865 A5 JP 2000012865A5
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JP
Japan
Prior art keywords
insulating layer
region
layer
semiconductor
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998174651A
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English (en)
Japanese (ja)
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JP2000012865A (ja
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Publication date
Application filed filed Critical
Priority to JP10174651A priority Critical patent/JP2000012865A/ja
Priority claimed from JP10174651A external-priority patent/JP2000012865A/ja
Priority to US09/197,705 priority patent/US6603174B2/en
Publication of JP2000012865A publication Critical patent/JP2000012865A/ja
Publication of JP2000012865A5 publication Critical patent/JP2000012865A5/ja
Pending legal-status Critical Current

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JP10174651A 1998-06-22 1998-06-22 半導体装置及び半導体装置の製造方法 Pending JP2000012865A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10174651A JP2000012865A (ja) 1998-06-22 1998-06-22 半導体装置及び半導体装置の製造方法
US09/197,705 US6603174B2 (en) 1998-06-22 1998-11-23 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10174651A JP2000012865A (ja) 1998-06-22 1998-06-22 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2000012865A JP2000012865A (ja) 2000-01-14
JP2000012865A5 true JP2000012865A5 (https=) 2005-10-20

Family

ID=15982328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10174651A Pending JP2000012865A (ja) 1998-06-22 1998-06-22 半導体装置及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US6603174B2 (https=)
JP (1) JP2000012865A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982919B2 (ja) * 2001-01-09 2012-07-25 ソニー株式会社 半導体装置の製造方法
JP2009004534A (ja) * 2007-06-21 2009-01-08 Hitachi Ltd 半導体装置及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249892B2 (ja) 1994-11-28 2002-01-21 三菱電機株式会社 Ｓｏｉ構造を有する半導体装置の製造方法
US5920108A (en) * 1995-06-05 1999-07-06 Harris Corporation Late process method and apparatus for trench isolation
KR100233286B1 (ko) * 1996-06-29 1999-12-01 김영환 반도체 장치 및 그 제조방법

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