ITRM910646A0 - Struttura di transistore sos e procedimento per la sua fabbricazione - Google Patents
Struttura di transistore sos e procedimento per la sua fabbricazioneInfo
- Publication number
- ITRM910646A0 ITRM910646A0 IT91RM646A ITRM910646A ITRM910646A0 IT RM910646 A0 ITRM910646 A0 IT RM910646A0 IT 91RM646 A IT91RM646 A IT 91RM646A IT RM910646 A ITRM910646 A IT RM910646A IT RM910646 A0 ITRM910646 A0 IT RM910646A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacture
- transistor structure
- sos
- sos transistor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/7853—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66651—Lateral single gate silicon transistors with a single crystalline channel formed on the silicon substrate after insulating device isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910009066A KR920022546A (ko) | 1991-05-31 | 1991-05-31 | 모오스 트랜지스터의 구조 및 그 제조방법 |
Publications (3)
Publication Number | Publication Date |
---|---|
ITRM910646A0 true ITRM910646A0 (it) | 1991-08-29 |
ITRM910646A1 ITRM910646A1 (it) | 1993-03-01 |
IT1250089B IT1250089B (it) | 1995-03-30 |
Family
ID=19315297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITRM910646A IT1250089B (it) | 1991-05-31 | 1991-08-29 | Struttura di transistore mos e procedimento per la sua fabbricazione. |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH04368180A (it) |
KR (1) | KR920022546A (it) |
DE (1) | DE4127795A1 (it) |
GB (1) | GB2256315A (it) |
IT (1) | IT1250089B (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6762448B1 (en) * | 2003-04-03 | 2004-07-13 | Advanced Micro Devices, Inc. | FinFET device with multiple fin structures |
US7385247B2 (en) * | 2004-01-17 | 2008-06-10 | Samsung Electronics Co., Ltd. | At least penta-sided-channel type of FinFET transistor |
JPWO2006006438A1 (ja) * | 2004-07-12 | 2008-04-24 | 日本電気株式会社 | 半導体装置及びその製造方法 |
US20060071270A1 (en) * | 2004-09-29 | 2006-04-06 | Shibib Muhammed A | Metal-oxide-semiconductor device having trenched diffusion region and method of forming same |
TWI263328B (en) * | 2005-01-04 | 2006-10-01 | Samsung Electronics Co Ltd | Semiconductor devices having faceted channels and methods of fabricating such devices |
JP4849504B2 (ja) * | 2005-03-29 | 2012-01-11 | ラピスセミコンダクタ株式会社 | 半導体装置、その製造方法、出力回路および電子機器 |
JP2007005568A (ja) | 2005-06-23 | 2007-01-11 | Toshiba Corp | 半導体装置 |
JP5270817B2 (ja) * | 2006-03-29 | 2013-08-21 | 株式会社東芝 | 3次元形状を有する半導体部材を加工する方法 |
CN104078356B (zh) * | 2013-03-28 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | 分段沟道晶体管及其形成方法 |
CN104952785A (zh) * | 2014-03-31 | 2015-09-30 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制作方法 |
CN107342327A (zh) * | 2017-08-10 | 2017-11-10 | 睿力集成电路有限公司 | 一种半导体存储器的晶体管结构及制作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132075A (en) * | 1974-09-11 | 1976-03-18 | Tetsutaro Mori | Senkohodenkan no tentokairo |
NL188776C (nl) * | 1979-04-21 | 1992-09-16 | Nippon Telegraph & Telephone | Veldeffecttransistorinrichting en werkwijze voor het vervaardigen daarvan. |
JPS5676575A (en) * | 1979-11-26 | 1981-06-24 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of junction type field effect semiconductor device |
JPS5676576A (en) * | 1979-11-26 | 1981-06-24 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor device and manufacture thereof |
US4393391A (en) * | 1980-06-16 | 1983-07-12 | Supertex, Inc. | Power MOS transistor with a plurality of longitudinal grooves to increase channel conducting area |
FR2501913A1 (fr) * | 1981-03-10 | 1982-09-17 | Thomson Csf | Transistor a effet de champ de type planar comportant des electrodes a puits metallises et procede de fabrication de ce transistor |
US4583107A (en) * | 1983-08-15 | 1986-04-15 | Westinghouse Electric Corp. | Castellated gate field effect transistor |
FR2554639B1 (fr) * | 1983-11-08 | 1986-02-21 | Thomson Csf | Transistor a effet de champ a tension de seuil reglable, et circuit integre comportant ce type de transistors |
EP0167810A1 (en) * | 1984-06-08 | 1986-01-15 | Eaton Corporation | Power JFET with plural lateral pinching |
-
1991
- 1991-05-31 KR KR1019910009066A patent/KR920022546A/ko not_active IP Right Cessation
- 1991-08-22 DE DE4127795A patent/DE4127795A1/de not_active Withdrawn
- 1991-08-23 JP JP3235678A patent/JPH04368180A/ja active Pending
- 1991-08-29 IT ITRM910646A patent/IT1250089B/it active IP Right Grant
- 1991-08-29 GB GB9118511A patent/GB2256315A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE4127795A1 (de) | 1992-12-03 |
GB2256315A (en) | 1992-12-02 |
ITRM910646A1 (it) | 1993-03-01 |
KR920022546A (ko) | 1992-12-19 |
JPH04368180A (ja) | 1992-12-21 |
GB9118511D0 (en) | 1991-10-16 |
IT1250089B (it) | 1995-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |