IT986355B - Procedimento per l interconnessio ne di microcomponenti elettronici - Google Patents

Procedimento per l interconnessio ne di microcomponenti elettronici

Info

Publication number
IT986355B
IT986355B IT68521/73A IT6852173A IT986355B IT 986355 B IT986355 B IT 986355B IT 68521/73 A IT68521/73 A IT 68521/73A IT 6852173 A IT6852173 A IT 6852173A IT 986355 B IT986355 B IT 986355B
Authority
IT
Italy
Prior art keywords
studs
substrate
wire
component
thermo
Prior art date
Application number
IT68521/73A
Other languages
English (en)
Italian (it)
Inventor
Gerard Nicolas
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of IT986355B publication Critical patent/IT986355B/it

Links

Classifications

    • H10P72/0444—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H10W72/07141—
    • H10W72/07502—
    • H10W72/07533—
    • H10W72/522—
    • H10W72/5366—
    • H10W72/5445—
    • H10W72/581—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
IT68521/73A 1972-05-25 1973-05-24 Procedimento per l interconnessio ne di microcomponenti elettronici IT986355B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7218676A FR2185915B1 (enExample) 1972-05-25 1972-05-25

Publications (1)

Publication Number Publication Date
IT986355B true IT986355B (it) 1975-01-30

Family

ID=9099096

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68521/73A IT986355B (it) 1972-05-25 1973-05-24 Procedimento per l interconnessio ne di microcomponenti elettronici

Country Status (5)

Country Link
BE (1) BE822420A (enExample)
DE (1) DE2326861A1 (enExample)
FR (1) FR2185915B1 (enExample)
GB (1) GB1427588A (enExample)
IT (1) IT986355B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1070248A (en) * 1966-01-31 1967-06-01 Standard Telephones Cables Ltd Electrical wiring assembly
JPS5550399B1 (enExample) * 1970-03-05 1980-12-17
US3710441A (en) * 1970-05-15 1973-01-16 Bunker Ramo Numerically controlled automatic wiring system
US3703033A (en) * 1970-06-22 1972-11-21 Bunker Ramo Combined component and interconnection module and method of making

Also Published As

Publication number Publication date
FR2185915A1 (enExample) 1974-01-04
GB1427588A (en) 1976-03-10
FR2185915B1 (enExample) 1975-08-29
BE822420A (fr) 1975-03-14
DE2326861A1 (de) 1973-12-06
DE2326861C2 (enExample) 1987-08-27

Similar Documents

Publication Publication Date Title
US3981076A (en) Method of connecting electronic microcomponents
DE3879021D1 (de) Elektrische sicherung und verfahren zu ihrer herstellung.
GB1004459A (en) Electronic circuits
JPS5816552A (ja) 半導体素子用パッケ−ジ
CA1167976A (en) Circuit board having encapsulatd wiring on component side
US3703603A (en) Rub-on sub-element for electronic circuit board
US4188714A (en) Rigid termination for flexible printed circuits
IT986355B (it) Procedimento per l interconnessio ne di microcomponenti elettronici
GB1152809A (en) Electric Circuit Assembly
EP0015053A1 (en) A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
CN110571229A (zh) 一种埋入式光感模组及其制造方法
JPS6386322A (ja) 導電異方性接着剤シ−ト
GB1239824A (en) Magnetic circuit element
US20170345747A1 (en) Multilayer substrate and manufacturing method for same
JPS575356A (en) Hybrid integrated circuit device
JPS61118977A (ja) 多電極コネクタ−構造
GB1217148A (en) Improvements in or relating to substrates for microelectronic components
JPS63283136A (ja) 回路基板の実装方法
SU1133701A1 (ru) Монтажна плата
ES380076A1 (es) Metodo para unir una pluralidad de pilas de trabajo en zo- nas separadas sobre una o mas segundas piezas de trabajo.
CN111863633A (zh) 一种封装载板、封装体及其工艺
US12043016B2 (en) Methods and systems for attaching detectors to electronic readout substrates
JPH02222598A (ja) 半導体装置モジュール
JPH01194209A (ja) 熱接着性可撓性配線部材
JPS62263685A (ja) プリント配線基板