IT986355B - PROCEDURE FOR THE INTERCONNECTION OF ELECTRONIC MICROCOMPONENTS - Google Patents
PROCEDURE FOR THE INTERCONNECTION OF ELECTRONIC MICROCOMPONENTSInfo
- Publication number
- IT986355B IT986355B IT68521/73A IT6852173A IT986355B IT 986355 B IT986355 B IT 986355B IT 68521/73 A IT68521/73 A IT 68521/73A IT 6852173 A IT6852173 A IT 6852173A IT 986355 B IT986355 B IT 986355B
- Authority
- IT
- Italy
- Prior art keywords
- studs
- substrate
- wire
- component
- thermo
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2224/48095—Kinked
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
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- H01L2224/491—Disposition
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85007—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the wire connector during or after the bonding process
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
Abstract
1427588 Component assemblies COMMISSARIAT A L'ENERGIE ATOMIQUE 14 May 1973 [25 May 1972] 22893/73 Heading H1R In a method of interconnecting microcomponents which avoids the use of multilayer printed circuit boards, conducting studs 62, Fig. 1, are deposited on a substrate 60; a single length of insulated wire 64 is stuck to the substrate, the wire being bared and welded to studs 62 where required; then excess wire is removed, leaving a number of interconnection circuits between sets of studs 62 to which microcomponent terminals are connected. Fig. 6 depicts a substrate 30 of polyimide with a layer 32 of thermo-adhesive material on one surface thereof. Wire 36 having a thermo-adhesive coating is paid out by a feed head 34 having a heating coil 40 thereon for activating the adhesive. In modifications, a plurality of rectangular insulation frames 2, Fig. 5, are attached to the substrate each having grooves 4 in its upper surface. Bared wire portions 22 are secured in the grooves by copper studs 24 which are built up by electrodeposition. The studs may protrude finger-like into the space within the frame, to be connected flip-chip-wise to a micro-component therein (Figs. 4, 8, not shown); alternatively the studs may end flush with the inner periphery of the frame, connection to a micro-component therein being by way of beam leads (Fig. 7, not shown). The substrate may be mounted on a further, more rigid, support to strengthen the assembly; the further support may also act as a heat dissipator. Reference has been directed by the Comptroller to Specification 1,352,557.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7218676A FR2185915B1 (en) | 1972-05-25 | 1972-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT986355B true IT986355B (en) | 1975-01-30 |
Family
ID=9099096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT68521/73A IT986355B (en) | 1972-05-25 | 1973-05-24 | PROCEDURE FOR THE INTERCONNECTION OF ELECTRONIC MICROCOMPONENTS |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE822420A (en) |
DE (1) | DE2326861A1 (en) |
FR (1) | FR2185915B1 (en) |
GB (1) | GB1427588A (en) |
IT (1) | IT986355B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981076A (en) * | 1974-11-27 | 1976-09-21 | Commissariat A L'energie Atomique | Method of connecting electronic microcomponents |
DE3501710A1 (en) * | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | PCB WITH INTEGRAL POSITIONING MEANS |
DE19618917C1 (en) * | 1996-05-12 | 1997-10-02 | Markus Woelfel | Resin-sealed wired circuit board manufacturing method |
DE19705934C2 (en) * | 1997-02-15 | 2001-05-17 | Cubit Electronics Gmbh | Method and device for introducing wire-shaped conductor wires into a substrate |
DE102006037093B3 (en) * | 2006-08-07 | 2008-03-13 | Reinhard Ulrich | Joining method and apparatus for laying thin wire |
DE102007037165A1 (en) | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1070248A (en) * | 1966-01-31 | 1967-06-01 | Standard Telephones Cables Ltd | Electrical wiring assembly |
JPS5550399B1 (en) * | 1970-03-05 | 1980-12-17 | ||
US3710441A (en) * | 1970-05-15 | 1973-01-16 | Bunker Ramo | Numerically controlled automatic wiring system |
US3703033A (en) * | 1970-06-22 | 1972-11-21 | Bunker Ramo | Combined component and interconnection module and method of making |
-
1972
- 1972-05-25 FR FR7218676A patent/FR2185915B1/fr not_active Expired
-
1973
- 1973-05-14 GB GB2289373A patent/GB1427588A/en not_active Expired
- 1973-05-24 IT IT68521/73A patent/IT986355B/en active
- 1973-05-25 DE DE2326861A patent/DE2326861A1/en active Granted
-
1974
- 1974-11-20 BE BE150705A patent/BE822420A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE2326861C2 (en) | 1987-08-27 |
DE2326861A1 (en) | 1973-12-06 |
GB1427588A (en) | 1976-03-10 |
FR2185915A1 (en) | 1974-01-04 |
FR2185915B1 (en) | 1975-08-29 |
BE822420A (en) | 1975-03-14 |
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