BE822420A - METHOD OF INTERCONNECTING ELECTRONIC MICROCOMPONENTS AND CIRCUITS FOR IMPLEMENTING THE SAID PROCESS - Google Patents
METHOD OF INTERCONNECTING ELECTRONIC MICROCOMPONENTS AND CIRCUITS FOR IMPLEMENTING THE SAID PROCESSInfo
- Publication number
- BE822420A BE822420A BE150705A BE150705A BE822420A BE 822420 A BE822420 A BE 822420A BE 150705 A BE150705 A BE 150705A BE 150705 A BE150705 A BE 150705A BE 822420 A BE822420 A BE 822420A
- Authority
- BE
- Belgium
- Prior art keywords
- implementing
- circuits
- interconnecting electronic
- electronic microcomponents
- microcomponents
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85007—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the wire connector during or after the bonding process
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7218676A FR2185915B1 (en) | 1972-05-25 | 1972-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE822420A true BE822420A (en) | 1975-03-14 |
Family
ID=9099096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE150705A BE822420A (en) | 1972-05-25 | 1974-11-20 | METHOD OF INTERCONNECTING ELECTRONIC MICROCOMPONENTS AND CIRCUITS FOR IMPLEMENTING THE SAID PROCESS |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE822420A (en) |
DE (1) | DE2326861A1 (en) |
FR (1) | FR2185915B1 (en) |
GB (1) | GB1427588A (en) |
IT (1) | IT986355B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981076A (en) * | 1974-11-27 | 1976-09-21 | Commissariat A L'energie Atomique | Method of connecting electronic microcomponents |
DE3501710A1 (en) * | 1985-01-19 | 1986-07-24 | Allied Corp., Morristown, N.J. | PCB WITH INTEGRAL POSITIONING MEANS |
DE19618917C1 (en) * | 1996-05-12 | 1997-10-02 | Markus Woelfel | Resin-sealed wired circuit board manufacturing method |
DE19705934C2 (en) * | 1997-02-15 | 2001-05-17 | Cubit Electronics Gmbh | Method and device for introducing wire-shaped conductor wires into a substrate |
DE102006037093B3 (en) * | 2006-08-07 | 2008-03-13 | Reinhard Ulrich | Joining method and apparatus for laying thin wire |
DE102007037165A1 (en) | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1070248A (en) * | 1966-01-31 | 1967-06-01 | Standard Telephones Cables Ltd | Electrical wiring assembly |
JPS5550399B1 (en) * | 1970-03-05 | 1980-12-17 | ||
US3710441A (en) * | 1970-05-15 | 1973-01-16 | Bunker Ramo | Numerically controlled automatic wiring system |
US3703033A (en) * | 1970-06-22 | 1972-11-21 | Bunker Ramo | Combined component and interconnection module and method of making |
-
1972
- 1972-05-25 FR FR7218676A patent/FR2185915B1/fr not_active Expired
-
1973
- 1973-05-14 GB GB2289373A patent/GB1427588A/en not_active Expired
- 1973-05-24 IT IT68521/73A patent/IT986355B/en active
- 1973-05-25 DE DE2326861A patent/DE2326861A1/en active Granted
-
1974
- 1974-11-20 BE BE150705A patent/BE822420A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE2326861C2 (en) | 1987-08-27 |
DE2326861A1 (en) | 1973-12-06 |
GB1427588A (en) | 1976-03-10 |
FR2185915A1 (en) | 1974-01-04 |
FR2185915B1 (en) | 1975-08-29 |
IT986355B (en) | 1975-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: COMMISSARIAT A L ENERGIE ATOMIQUE Effective date: 19881130 |